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Fabless / IDM News

• Renesas Demonstrates Deterministic Deep Database Search Engine Interoperating with Xilinx’s FPGA-Based Packet Processor at Japan IT Week 2015 (Monday Apr. 27, 2015)
  Renesas Electronics Corporation today announced it is demonstrating its Deterministic Deep Database Search Engine interoperating with Xilinx’s FPGA-based packet processor at Japan Week 2015.
  
  
• Tiempo Secure TESIC-SC dual interface microcontroller is ready for evaluation and software development (Wednesday Apr. 01, 2015)
  Tiempo Secure is proud to announce that its dual interface secure microcontroller TESIC-SC-500K is selected by several customers who are currently evaluating the first batches and developing their software on Tiempo Secure’s asynchronous platform.
  
  
• Micron and Intel Unveil New 3D NAND Flash Memory (Friday Mar. 27, 2015)
  Micron Technology and Intel today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.
  
  
• Multicore Microcontrollers Enable Gigabit Ethernet Internet of Things for Under $5 (Tuesday Mar. 24, 2015)
  XMOS has today announced the launch, and the first customer shipments of its new Gigabit Ethernet enabled xCORE-200TM multicore microcontroller family.
  
  
• Cavium Adds Support for NVIDIA GPU Accelerators in 64-bit ARMv8-A ThunderX Processor Family (Tuesday Mar. 17, 2015)
  
  
  
• Silicon Image Introduces World's First superMHL/HDMI 2.0 Port Processor for Next Generation Home Theater Devices (Monday Mar. 16, 2015)
  Silicon Image today announced the world’s first superMHL™/HDMI® 2.0 port processor – the SiI9779. The SiI9779 supports superMHL, the MHL Consortium’s latest specification, which is ideal for the home theater/CE market and delivers 8K 60fps video resolution and immersive object audio.
  
  
• Toshiba Expands Line-up of ARM Cortex-M3-based Microcontroller for Smart Meters (Wednesday Mar. 11, 2015)
  Toshiba today announced the launch of a new microcontroller, “TMPM311CHDUG”, as the latest addition to its ARM® Cortex®-M3-based TX03 series.
  
  
• Wi-Charge Ushers in New Era of Wireless Device Charging (Tuesday Mar. 10, 2015)
  -Charge, an Israeli technology startup that is out to change the way people power their devices, today officially debuts the latest in wireless charging technology. Wi-Charge’s technology delivers up to 10W of power over 30 feet to multiple devices via an infrared light beam.
  
  
• Intel Packs Power, Intelligence of Xeon Processor Into System-on-Chip Offering to Target New, Growing Network Opportunities (Monday Mar. 09, 2015)
  Intel Corporation today announced the Intel® Xeon® processor D product family, the company’s first Intel Xeon processor-based system-on-chip (SoC). Built on Intel’s industry-leading 14nm process technology, the Intel Xeon processor D product family combines the performance and advanced intelligence of Intel Xeon processors with the size and power savings of an SoC.
  
  
• eASIC and Comcores Announce Availability of CPRI v6.1 (Monday Mar. 02, 2015)
  eASIC and Comcores today announced the immediate availability of the Common Public Radio Interface (CPRI) v6.1 for eASIC’s Nextreme-3 28nm devices.
  
  
• Cavium and ARM To Demonstrate Comprehensive Cloud RAN Application on 48 Core 64-bit ARMv8-A ThunderX SoC Processor at Mobile World Congress 2015 (Thursday Feb. 26, 2015)
  Cavium will demonstrate its family of ThunderX ARMv8-A based processors for servers with support for full virtualization of base station functions in a Cloud RAN (Radio Access Network) environment.
  
  
• Freescale i.MX 6SoloX Takes Applications Processor Security to New Levels (Tuesday Feb. 24, 2015)
  Freescale Semiconductor announces volume availability of the i.MX 6SoloX, a highly integrated, multi-market applications processor enabling secure connected home, Internet of Things, and connected vehicles applications.
  
  
• Atmel Launches Automotive Grade ARM Cortex-M0+-based MCUs With Capacitive Touch Hardware Support for HMI and LIN Applications (Tuesday Feb. 24, 2015)
  Atmel today announced the company has launched its next-generation family of automotive-qualified ARM® Cortex®-M0+-based MCUs with an integrated peripheral touch controller (PTC) for capacitive touch applications.
  
  
• EZchip Introduces TILE-Mx100 World's Highest Core-Count ARM Processor Optimized for High-Performance Networking Applications (Monday Feb. 23, 2015)
  EZchip Semiconductor today unveiled the TILE-Mx multicore processor family that incorporates an unprecedented one hundred ARMv8-A 64-bit cores, and is specifically targeted for high-performance network applications and network functions virtualization (NFV).
  
  
• Spansion and XMC Expand Partnership to Jointly Develop 3D NAND (Friday Feb. 06, 2015)
  Spansion and XMC, China's fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology. The companies have signed development and cross-licensing agreements.
  
  
• Chelsio Expands Terminator 5 ASIC Product Line (Wednesday Jan. 21, 2015)
  Chelsio today announced the launch of four new SKUs in its Terminator 5 (T5) ASIC product line, the fifth generation of Chelsio's high performance Ethernet silicon technology and a recognized leader in performance, capabilities and features
  
  
• Ambiq Micro's Apollo microcontrollers redefine 'low power' with up to 10x reduction in energy consumption (Monday Jan. 19, 2015)
  Ambiq Micro today announced the Apollo family of four 32-bit ARM® Cortex-M4F microcontrollers (MCUs). In real-world applications, their energy consumption is typically 5 to 10 times lower than that of MCUs of comparable performance, resulting in far longer battery life in wearable electronics and other battery-powered applications.
  
  
• Vitesse Broadens Signal Integrity Portfolio For High Speed Data Transmission (Monday Jan. 19, 2015)
  Vitesse Semiconductor introduced the VSC7112, an 8.5G quad channel signal conditioner targeted at the expanding PCIe 3.0 market.
  
  
• Silicon Line Announces the World's First 10 Gbps Transceiver for USB 3.0 and USB 3.1 Active Optical Cables (Thursday Jan. 15, 2015)
  Silicon Line today announced the commercial release of the ultra-low power SL86050 USB 3 transceiver. The IC is used to implement active optical cables compliant with both Superspeed USB 3.0 (5 Gbps) and USB 3.1 (10 Gbps) standards.
  
  
• Atmel Unleashes Highest-Performing ARM Cortex-M7 based MCUs with Superior Memory Architecture and Connectivity for Automotive, IoT and Industrial Markets (Wednesday Jan. 07, 2015)
  Atmel today launched four new series of devices to the Atmel | SMART™ ARM® Cortex®-M7-based MCUs. The new series deliver the highest performing Cortex-M7 based MCUs to the market with exceptional memory and connectivity options for design flexibility making them ideal for the automotive, IoT and industrial connectivity markets.
  
  
• Atmel Expands Ultra-low Power SAM G ARM Cortex M4 MCU Portfolio for Wearables and Sensor Hub Management (Tuesday Jan. 06, 2015)
  Atmel today announced the company has expanded its award-winning SAM G series of ARM® Cortex®-M4-based MCUs to include the SAM G54 and SAM G55.
  
  
• The 5th Generation Intel Core Family of Processors Arrive to Transform Computing Experiences, 'Cherry Trail' Shipping (Monday Jan. 05, 2015)
  Today, Intel unveiled the 5th Generation Intel® Core™ processor family. Built on Intel’s cutting edge 14nm manufacturing process, the 5th Gen Intel Core processors deliver premium performance, stunning visuals and enables improved battery life to take computing to the next level.
  
  
• NVIDIA Launches Tegra X1 Mobile Super Chip (Monday Jan. 05, 2015)
  NVIDIA today unveiled Tegra® X1, its next-generation mobile super chip with over one teraflops of processing power – delivering capabilities that open the door to unprecedented graphics and sophisticated deep learning and computer vision applications.
  
  
• Actions to Debut First 64-bit Chipset at the 2015 International CES (Monday Jan. 05, 2015)
  Actions Semiconductor today announced that it will debut the inaugural chipset of its new Falcon Series product family, the ATM9009, a 64-bit quad-core solution for high-end Android tablets and OTT set-top boxes at the 2015 International CES
  
  
• MagnaCom Delivers World's First Demonstration of QAM-16384 Equivalent over Wireless Networks at CES 2015 (Monday Jan. 05, 2015)
  A QAM-16384 equivalent 14 bits modulation is now made possible wirelessly for the first time. WAM-14 can also benefit other networks, such as cable and terrestrial Digital Video Broadcasting (DVB) – delivering on the promise of next generation DVB-C2 and DVB-T2 standards.
  
  
• Peraso Demonstrates World's First WiGig USB 3.0 Adaptor at CES 2015 (Monday Jan. 05, 2015)
  Peraso Technologies announced today it will be demonstrating a WiGig network ecosystem using its WiGig USB 3.0 adaptors at CES 2015.
  
  
• ViXS Video SoC Is the First to Support 12-Bit High Dynamic Range Technology (Monday Jan. 05, 2015)
  ViXS Systems Inc. (VXS) has set another new benchmark for video processing with today's announcement of its innovative 12-bit High Dynamic Range (HDR) technology.
  
  
• Peraso Releases World's Highest Performance WiGig Radio for Consumer Electronics Applications (Tuesday Dec. 23, 2014)
  Peraso Technologies Inc. today announced the immediate production availability of its 60 GHz WiGig RF IC for consumer electronics. The device is available in two BGA versions, including the PRS1125, and the PRS1025, which includes an integrated antenna.
  
  
• eASIC and Xelic Deliver CPRI to OTN Reference Design For SFP+ to Enable Fast C-RAN Deployment (Wednesday Dec. 17, 2014)
  eASIC and Xelic today announced the immediate availability of a CPRI to OTN reference design implemented in the eASIC Nextreme-3 28nm Platform. The reference design dramatically reduces development time for SFP+ applications used in C-RAN.
  
  
• eASIC Announces 12.5Gbps JESD204B Interoperability Testing With Texas Instruments (Monday Dec. 15, 2014)
  eASIC today announced that it has successfully completed JESD204B interoperability at 12.5 Gbps between its eASIC Nextreme-3 28nm Platform and the dual-channel, 16-bit, 2.5 GSPS DAC38J82 digital-to-analog converter (DAC) from Texas Instruments (TI).