Adaptive Clock Generation Module for DVFS and Droop Response
![]() | |
Fabless / IDM News
-
eASIC Demonstrates 10Gbps JEDEC JESD204B (Monday Dec. 08, 2014)
eASIC Corporation, a fabless semiconductor company delivering a custom IC platform (eASIC Platform) announced today that it has successfully completed JESD204B interoperability at 10 Gbps lane rates.
-
Allwinner H3 Quad-Core Announced: a Full 4K OTT Box Solution (Monday Dec. 08, 2014)
Allwinner Technology, a worldwide leader in application processor design, today announced its new full 4K OTT box solution H3, after its release of octa-core A80 and H8 solutions for smart OTT box market this year.
-
Cavium Announces Availability of ThunderX: Industry's First 48 Core Family of ARMv8 Workload Optimized Processors for Next Generation Data Center & Cloud Infrastructure (Monday Dec. 01, 2014)
Cavium today announced availability of both single socket and dual socket versions of its ARMv8 ThunderX™ family of processors. The workload optimized ThunderX CN88xx product line is the highest performance family of ARMv8 SoC processors for next generation Data Center and Cloud infrastructure.
-
Toshiba Launches ARM Cortex-A9 Based Application Processors with Enhanced Sound and Image Data-Mining and Security Functions (Monday Dec. 01, 2014)
Toshiba today announced the launch of three new application processors, the “TZ2100 group,” as the latest additions to its ApP LiteTM family’s ARM® Cortex®-A9-based “TZ2000 series”.
-
Intel Reveals Details for Future High-Performance Computing System Building Blocks as Momentum Builds for Intel Xeon Phi Product (Tuesday Nov. 18, 2014)
Discloses Future Generation Intel Xeon Phi Processor and New Performance and Architectural Details for Intel® Omni-Path Fabric Interconnect Technology
-
Rockchip Debuts Intel Jointly-Developed Game-Changing 3G Processor for Android Devices (Monday Nov. 17, 2014)
Rockchip Electronics™ today announced the North American availability of its system-on-a-chip (SoC) processor with 3G communications it jointly developed with Intel®. The SoC is Rockchip's XMM™6321 and it's aimed at Android® tablet, phablet and smartphone design manufacturers seeking to develop products for entry-level markets.
-
CSR Launches World's First Integrated Bluetooth High Definition Audio Platform with Support for Ambient Noise Cancellation (Friday Nov. 14, 2014)
CSR today announces the CSR8675™, its latest audio flash platform, designed specifically for high-end wireless audio products. Building on the success of the CSR8670™, the feature rich platform offers greater processing power than its predecessor, allowing manufacturers to deliver enhanced quality audio output and noise cancellation for high-end speakers, soundbars, stereo headsets and gaming headphones.
-
STMicroelectronics and Autotalks Ignite Cooperation to Deliver Vehicle-to-Vehicle/Infrastructure Communication for Safer, Cleaner Motoring (Tuesday Nov. 04, 2014)
-
Actions Semiconductor Debuts 28nm Quad-Core Processor for Mainstream Android Tablets (Monday Nov. 03, 2014)
Actions Semiconductor today introduced a new quad-core system-on-a-chip (SoC) to provide primary processing, connectivity, enhanced battery life and other capabilities in computer tablets and set top boxes (STB).
-
Marvell's Total Cloud Platform Solution Powers the World's First Dedicated ARM-Based High Density Cloud Server from Online.net Labs (Monday Nov. 03, 2014)
Marvell today announced that the Marvell® ARMADA®-XP System-on-Chip (SoC), Prestera® DX Switch and Alaska®-X 10GbE PHY solutions have been selected by Online.net Labs, the hosting subsidiary of a leading French telecom company, Iliad S.A., to support the world’s first dedicated ARM-based cloud platform.
-
Kili Technology Unveils First mPOS Solution-on-a-Chip (Tuesday Oct. 28, 2014)
Kili Technology Corporation, a rapidly growing developer of secure, low-cost payment processing solutions, announced today the industry's most highly integrated line of secure Solution-on-a-Chip (SoC) processors for payment processing applications.
-
Actions Semiconductor Debuts Its First 28nm OWL Series Chipset (Tuesday Oct. 28, 2014)
Actions Semiconductor today announced that it debuted its latest innovative 28nm process based quad-core application processor offering for the tablet and OTT set-top box markets.
-
MegaChips to Begin Sampling BlueChip Wireless Sub-GHz Band Wireless Communication LSI at the End of October (Tuesday Oct. 28, 2014)
MegaChips today announced it will begin sampling its sub-Ghz band BlueChip Wireless communication LSI (Model: MAB0100) LSI at the end of October and begin mass production volume shipping in January 2015.
-
Silicon Space Technology (SST) Demonstrates ARM Cortex-M0-based Processor and SRAM Solutions Operating at 250C for 500 Hours (Monday Oct. 27, 2014)
SST announced today the successful testing of temperature-hardened components operating at 250C for more than 500 hours.
-
Ambarella S3 IP Camera SoC Delivers Outstanding 4K Video Quality Using State-of-the-Art H.265/HEVC Encoding (Wednesday Oct. 22, 2014)
Ambarella today introduced S3, a security IP camera System-On-Chip (SoC) family with support for the new H.265 or HEVC (High Efficiency Video Coding) video standard.
-
Freescale Announces the Industry's Most Power-Efficient 64-Bit ARM-Based Processor for the New Virtual Network (Tuesday Oct. 21, 2014)
Freescale Semiconductor today introduced the QorIQ LS1043A communications processor – the industry’s most power-efficient 64-bit ARM-based processor for the new virtual network.
-
The World's First G.fast Chipsets Announced by Sckipio (Wednesday Oct. 08, 2014)
Sckipio Technologies today introduced the world’s first G.fast modem chipsets, fundamentally changing how telecom service providers can deliver 1Gbps ultra-broadband Internet access to bandwidth-hungry customers at the lowest cost per megabit.
-
Broadcom Introduces Industry's First 40GbE Quad Port Gearbox PHY (Tuesday Oct. 07, 2014)
Broadcom today announced the industry's first quad port 40GbE gearbox PHY supporting 20 Gbps input/output (IO) designs.
-
Aquantia Unveils Game-Changing Enterprise Technology to Break Mobile Infrastructure Bottleneck and Deliver Unprecedented Throughput (Monday Oct. 06, 2014)
-
Samsung Shows 14nm Chip (Thursday Oct. 02, 2014)
Samsung showed a working 14nm FinFET device at the ARM Tech Con here. However the Korean giant would not provide details of the chip, any of its customers for the process, or the status of the process.
-
AppliedMicro Launches 64-Bit ARM-Based Custom Cores for High End Embedded (Thursday Oct. 02, 2014)
AppliedMicro today announced HeliX™, a family of ARMv8-A architecture based embedded products designed for use in wired and wireless networking, networked storage, office automation solutions and industrial controls.
-
STMicroelectronics Accelerates MCU-Developers' Pace of Innovation with World's First ARM Cortex-M7 Core-Based STM32 F7 Series MCU (Wednesday Sep. 24, 2014)
STMicroelectronics today announced the extension of its STM32 family of more than 500 pin- and software-compatible microcontrollers. The new STM32 F7 microcontroller (MCU) series leverages the ARM Cortex-M7 core, just announced as ARM’s newest and most powerful Cortex-M processor.
-
Samsung Now Mass Producing Industry's First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM (Monday Sep. 22, 2014)
Samsung Electronics announced today that it has begun mass producing its six gigabit (Gb) low-power double data rate 3 (LPDDR3) mobile DRAM, based on advanced 20 nanometer (nm) process technology.
-
CoinTerra announces the world's first 16nm ASIC based Bitcoin Miner - the AIRE Miner (Friday Sep. 19, 2014)
CoinTerra today announced their next generation Bitcoin Miner – the AIREMiner™. At an expected performance per watt of 5x the current generation miners, the 16nm ASIC based AIRE Miner is now available for limited time pre-order with expected delivery in Q1 2015.
-
Cavium and XPliant Introduce a Fully Programmable Switch Silicon Family Scaling to 3.2 Terabits per Second (Tuesday Sep. 16, 2014)
Cavium and XPliant today introduced the CNX880xx line of Ethernet switch chips featuring the revolutionary XPliant Packet Architecture (patent pending) (“XPA”) – an industry first, delivering no-compromise, high packet throughput on a fully programmable switch architecture.
-
Peraso Releases PRS4000 60 GHz 802.11ad Baseband Chip (Monday Sep. 15, 2014)
Peraso Technologies Inc. announced today the immediate availability of the PRS4000 60 GHz 802.11ad baseband chip through its Baseband Early Access Program (BEAP). The highly integrated device includes an 802.11ad compliant MAC/PHY, a USB 3.0 system interface, and analog I/Q for seamless use with Peraso’s 60 GHz RF ICs.
-
Broadcom Announces Industry's Highest Performance, Lowest Power 100GbE Gearbox PHYs (Monday Sep. 15, 2014)
Broadcom today announced the industry's highest performance, lowest power multi-rate 100 Gigabit Ethernet (GbE) gearbox physical layer transceiver (PHY),
-
Tabula and Intel Work Together to Enable Next-Generation Data Center (Wednesday Sep. 10, 2014)
Tabula announced today that they are working with Intel Corporation to build a new multi-100 GigE line-rate packet processing platform to deliver a flexible, high-performance solution for next-generation data centers.
-
ASMedia Technologies Demonstrates Industry's First SuperSpeed USB 10 Gbps (USB 3.1) Silicon ASM1352R (USB3.1 to SATA6G with RAID) at Intel Developer Forum (Tuesday Sep. 09, 2014)
ASMedia Technologies, demonstrated the industry’s first SuperSpeed USB 10 Gbps (USB 3.1) silicon data transfer on its hardware development platform in the SuperSpeed USB Community at Intel Developers Forum in San Francisco.
-
Genesys Logic announced a reference design pairing its USB 3.0 card reader controller GL3221 with NFC transceiver ST95HF from STMicroelectronics (Tuesday Sep. 09, 2014)
Genesys Logic today announced a reference design pairing its USB 3.0 card reader controller GL3221 with STMicroelectronics' ST95HF NFC transceiver. This solution provides both high-performance memory card access and near field communication (NFC) simultaneously.