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Fabless / IDM News

• Tekmos Introduces 'Drop In Replacement' for Intel 80C186EB and 80C188EB Microprocessors (Tuesday Oct. 06, 2009)
  Tekmos, Inc. announced today the introduction of its new TK80C186EB and TK80C188EB microprocessors designed as drop-in replacements for the discontinued Intel 80C186EB / 80C188EB microprocessors.
  
  
• Dialog Semiconductor to Enable Rapid Prototyping of Optimized Audio/Video Portable Devices and Smartphones with NEC Electronics (Monday Oct. 05, 2009)
  Dialog Semiconductor has collaborated with NEC Electronics to develop a design platform based on NEC Electronics' multimedia processor system-on-chips (SoCs) and Dialog's power management platform ICs.
  
  
• Trident Microsystems and NXP to Combine Digital TV and Set-Top Box Businesses to Create Industry Leader in the Digital Home Market (Monday Oct. 05, 2009)
  Trident Microsystems and NXP Semiconductors today announced that they have signed a definitive agreement whereby Trident will acquire NXP's television systems and set-top box business lines.
  
  
• IPtronics Develops Components for Light Peak Technology (Thursday Oct. 01, 2009)
  Through a collaborative effort with Intel and other industry partners, IPtronics has developed silicon for Light Peak Technology implementation
  
  
• Crocus Technology Enters STT Memory Race and Sets Industry Pace with New Prototype (Thursday Oct. 01, 2009)
  Crocus Technology, a premier developer of Magnetic Random Access Memory (MRAM), has announced the development of a new Spin Transfer Torque (STT)-based MRAM technology that will deliver on the promise of using STT memory in high-density memory applications.
  
  
• Panasonic and Renesas Start Operation of New Development Line for Leading-Edge SoC Process Technologies at the Renesas Naka Site (Thursday Oct. 01, 2009)
  Panasonic and Renesas announced today that they will concentrate their joint development functions for leading-edge SoC process technologies at the Renesas Naka site and will start operation of their 28 to 32 nm process development line installed at that site
  
  
• Altair Semiconductor Announces Immediate Commercial Availability of LTE Baseband Chip for 4G Wireless Devices (Thursday Oct. 01, 2009)
  Altair Semiconductor, a 4G chip company developing the world’s most advanced mobile semiconductors for handheld devices, today announced the immediate commercial availability of its LTE baseband chip, the FourGee™-3100.
  
  
• Intel Unveils 45nm System-on-Chip for Internet TV (Friday Sep. 25, 2009)
  Intel Corporation today unveiled the Intel® Atom™ processor CE4100, the newest System-on-Chip (SoC) in a family of media processors designed to bring Internet content and services to digital TVs, DVD players and advanced set-top boxes
  
  
• LX Extends Leadership in USB with New USB 3.0 Solutions for Multiple Markets (Wednesday Sep. 23, 2009)
  PLX Technology today announced completion of key design milestones that bring to market diverse USB 3.0 (SuperSpeed USB) solutions for a wide variety of applications.
  
  
• LSI Introduces Industry's First 40nm Serial PHY for Notebook, Desktop and Enterprise Hard Disk Drives (Wednesday Sep. 23, 2009)
  LSI today announced that it has begun shipping samples of the industry's first 40-nanometer multi-interface physical layer (PHY) IP designed for notebook, desktop and enterprise hard disk drive (HDD) market segments.
  
  
• Samsung's New 5-Megapixel SoC Image Sensor Brings Digital Still Camera Capabilities to High-end Mobile Phones (Tuesday Sep. 22, 2009)
  Samsung Electronics announced its newest quarter-inch optical format, 5-megapixel (Mp) system-on-chip (SoC) image sensor, the S5K4EA, which brings digital still camera functionality to high-end mobile phones.
  
  
• Symwave and MCCI Demonstrate the World’s Highest Performance USB 3.0 System (Tuesday Sep. 22, 2009)
  Symwave and MCCI today announced their successful collaboration to demonstrate the world’s highest performing USB 3.0 system achieving over 270MB/s.
  
  
• NEC Electronics Rolls Out USB 3.0 SOC Design Solution to Speed Customer Time to Market (Monday Sep. 21, 2009)
  NEC Electronics today announced the availability of a Universal Serial Bus (USB) 3.0 system-on-a-chip (SOC) design solution that customers can use to kick start the development of custom USB 3.0 products. The SOC design solution features NEC Electronics' USB 3.0 intellectual property (IP) core, which is fully interoperable with the company's recently USB-IF-certified USB 3.0 host controller (part number uPD720200) and also backward compatible with previous versions of the USB standard.
  
  
• Fresco Logic Shipping its FL1000 PCI Express to USB 3.0 Single-Chip Host Controller (Friday Sep. 18, 2009)
  Fresco Logic is sampling its USB 3.0 host controller chip, the FL1000. The FL1000 is a single-chip PCI Express to USB 3.0 host controller that enables USB 3.0 connectivity
  
  
• Sequans Partners with Hellosoft for WiMAX VoIP CPE Solution (Thursday Sep. 17, 2009)
  Sequans Communications has integrated the Hellosoft VoIP media engine into its new generation CPE chip solution, the SQN1220. The SQN1220 is the second member of Sequans' SQN1200 series of chips, the first Mobile WiMAX SOCs to integrate baseband and triple-band RF in a single 65nm die.
  
  
• K-micro announces availability of MontaVista Linux for CatsEye development platform (Wednesday Sep. 16, 2009)
  K-micro announced the availability of MontaVista Linux for the CatsEye development platform to speed up the hardware and software development time associated with complex ASIC designs.
  
  
• IBM Announces Highest Performance Embedded Processor for System-on-Chip Designs (Tuesday Sep. 15, 2009)
  IBM Corporation today announced the industry's highest performance, highest throughput processor for system-on-chip (SoC) product families in the communication, storage, consumer, and aerospace and defense markets
  
  
• Cypress Revolutionizes Embedded Design with High Performance, Low Power PSoC® PSoC 5 Programmable System-on-Chip Architectures (Monday Sep. 14, 2009)
  New Scalable Platform Combines Programmable Precision Analog and Digital Logic with High Performance ARM-Cortex M3 and 8051-Based MCU Sub-Systems, Delivering Unmatched Time-to-Market, Integration, and Flexibility for 8-, 16- and 32-bit Applications
  
  
• Motorola Launches Advanced Multi-Format Encoding Platform for 1080P Content (Friday Sep. 11, 2009)
  Motorola today revealed its next generation encoding platform. This high-performance video processing platform supports both MPEG-4 and MPEG-2 standard-definition (SD) and high-definition (HD) encoding and transcoding and has been designed to meet future processing demands of both 1080P/50Hz and 1080P/60Hz resolutions using the MPEG-4 format.
  
  
• Wavesat Introduces LTE Chipset Featuring 100 Mb/s Downlink Capability (Thursday Sep. 10, 2009)
  The Odyssey 9000 family of chipsets incorporates a unique hybrid architecture with a combination of highly efficient DSPs and hardware acceleration blocks, easily scaling to support CAT-4 (150 Mb/s downlink) devices.
  
  
• Cavium Networks Introduces ECONA Family of Super Energy Efficient ARM-Based System-on-Chip (SoC) Processors for the Digital Home That Break the 1 Watt Barrier (Tuesday Sep. 08, 2009)
  The ECONA CNS3XXX Family of Single and Dual Core ARM® SoC Processors Enable High Performance, Intelligent Home Networks While Slashing Power and Cost for Next-Generation Gateways, Storage and Consumer Electronics (CE) Devices in the Digital Home
  
  
• Broadcom's New International Cable Set-Top Box SoC Solutions Drive Compelling High Definition TV and Advanced Connectivity (Tuesday Sep. 08, 2009)
  Integrated Dual 866MHz Cable Tuners, DOCSIS(R)/EuroDOCSIS(TM) and MoCA(R) 1.1 Technology Enable IP Video and Multi-Room High Definition DVR TV Services
  
  
• Black Sand Technologies Announces World's First 3G CMOS RF Power Amplifier (Tuesday Sep. 08, 2009)
  Black Sand Technologies, Inc., a fabless semiconductor company specializing in advanced power amplifier technology for wireless applications, today announced that it has produced the world’s first 3G CMOS RF Power Amplifier (PA).
  
  
• NXP Brings Unrivalled Performance to Mainstream HD DVRs and Set-Top Boxes with Industry's First Fully Integrated 45nm SoC Platform (Friday Sep. 04, 2009)
  Having developed the industry’s first 45nm digital TV platform, NXP is maintaining its leadership in manufacturing innovation by introducing the world’s first 45nm set-top box SoC solution integrating multi-channel broadcast receivers.
  
  
• NEC Electronics Introduces new SoCs for Set-Top Boxes with Extensive Multi-Format Video Support (Monday Aug. 24, 2009)
  NEC Electronics today announced the availability of a new image-processing solution, the EMMA3™SL/P system-on-chip (SoC) based on NEC Electronics’ enhanced multimedia architecture (EMMA) platform.
  
  
• Infineon Introduces Energy Efficient Single-Chip XWAY WAVE100 Family for Low-Cost 802.11n WLAN Home Gateways (Thursday Aug. 13, 2009)
  The new XWAY™ WAVE100 ICs provide a high-performance and cost-effective solution for wireless network access points that are compliant to the 802.11n draft standard for data rates up to 150Mbit/s as well as the 802.11 b/g standard.
  
  
• Atmel Announces SiliconCity Flexible Architecture for Low-Cost Custom Defined SoC Development (Tuesday Aug. 11, 2009)
  Atmel announced today a new custom architecture for 90nm SiliconCity ASIC development, providing up to 350K gates/mm2, offering customers gate densities in the range of a standard cell ASIC.
  
  
• STMicroelectronics Introduces Silicon Tuner Supporting Digital-Terrestrial TV Standard as Analog Switch-Off Gathers Pace (Friday Aug. 07, 2009)
  As demand grows for economical equipment allowing households to access digital terrestrial television services, STMicroelectronics has introduced a single-chip DVB-T silicon tuner that enables manufacturers to simplify product assembly and supply-chain management.
  
  
• Global Unichip Provides High Speed Interface Total Solution (Thursday Aug. 06, 2009)
  Global Unichip announced its Gbps level high speed production-proven total solution. The total solution includes comprehensive IP portfolio, ASIC implementation, chip + package co-design, and production testing solution.
  
  
• Physical layer and protocols provide complete MIPI IP solution for SoC development (Tuesday Jul. 28, 2009)
  The latest intellectual property (IP) from Toshiba Electronics Europe’s ASIC & Foundry Business Unit will simplify and speed the implementation of MIPI®-compliant system-on-chip (SoC) designs for mobile phones and associated devices. The Toshiba MIPI (Mobile Industry Processor Interface) offering comprises a physical layer and protocols that build on this layer to support the rapid development of complete MIPI-compliant transmit and receive solutions.