Foundries News

• Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles (Monday Dec. 16, 2024)
  As part of the agreement, Synopsys will develop advanced design flows leveraging its AI-driven EDA suite and enable a broad IP portfolio on Rapidus’ 2nm gate-all-around (GAA) process.
  
  
• X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology (Wednesday Dec. 04, 2024)
  X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has just announced a major innovation in NVM data storage which draws on the company’s best-in-class SONOS technology.
  
  
• GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile (Wednesday Oct. 23, 2024)
  Building on years of collaboration, this new process technology collaboration will provide power-efficient and secure connectivity solutions for essential consumer and industrial applications manufactured both in Europe and the U.S.
  
  
• Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing (Tuesday Sep. 17, 2024)
  Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, Multi-Billion-Dollar Collaboration Accelerates Development of Chip Manufacturing in Ohio
  
  
• ESMC Breaks Ground on Dresden Fab (Wednesday Aug. 21, 2024)
  ESMC – a joint venture between TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. – today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany.
  
  
• Building Intel's Foundry Ecosystem for the AI Era (Monday Jul. 01, 2024)
  Today marks a new milestone in the growth of Intel Foundry’s design ecosystem as key partners Ansys, Cadence, Siemens, and Synopsys have announced the availability of reference flows for Intel’s embedded multi-die interconnect bridge (EMIB) advanced packaging technology.
  
  
• CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative (Tuesday Jun. 25, 2024)
  CEA-Leti is proud to announce the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe. This initiative aligns with the ambition of the EU Chips Act, which seeks to bolster EU semiconductor capabilities and ensure technological sovereignty.
  
  
• Rapidus Set to Open 2-nm Pilot Fab, CEO Says (Wednesday Jun. 19, 2024)
  Japanese startup foundry Rapidus is set to open the company’s 2-nm pilot fab in April 2025, CEO Atsuyoshi Koike told EE Times in an interview.
  
  
• Intel 3 Represents an Intel Foundry Milestone (Tuesday Jun. 18, 2024)
  At the 2024 IEEE Symposium on VLSI Technology & Circuits in Hawaii, Intel provided details of the Intel 3 semiconductor process node, the third of five nodes in four years promised under CEO Pat Gelsinger’s IDM 2.0 manufacturing strategy.
  
  
• Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024 (Monday Jun. 17, 2024)
  Under the theme “Empowering the AI Revolution,” Samsung announced its reinforced process technology roadmap, including two new cutting-edge nodes — SF2Z and SF4U — as well as its integrated Samsung AI Solutions platform harnessing the unique strengths of its Foundry, Memory and Advanced Package (AVP) businesses.
  
  
• Crucial role for imec in EU Chips Act (Tuesday May. 21, 2024)
  imec announces it will host the NanoIC pilot line. This pilot line taps into the EU Chips Act vision to accelerate innovation, drive economic growth, and strengthen Europe's semiconductor ecosystem.
  
  
• TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership (Wednesday Apr. 24, 2024)
  TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
  
  
• TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix (Tuesday Apr. 09, 2024)
  Third fab will produce the most advanced leading-edge semiconductors in the U.S., bringing TSMC’s total investment in Arizona to over US$65 Billion
  
  
• Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion (Wednesday Apr. 03, 2024)
  Intel Corporation today outlined a new financial reporting structure that is aligned with the company’s previously announced foundry operating model for 2024 and beyond. This new structure is designed to drive increased cost discipline and higher returns by providing greater transparency, accountability and incentives across the business.
  
  
• NEDO Approves Rapidus' FY2024 Plan and Budget for "Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration" (Tuesday Apr. 02, 2024)
  Rapidus today announced that the New Energy and Industrial Technology Development Organization (NEDO) has approved its FY2024 plan and budget for “Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration” under ” Post 5G Information and Communication Systems Infrastructure Enhancement R&D Project / Development of Advanced Semiconductor Manufacturing Technology (Commissioned).”
  
  
• TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production (Tuesday Mar. 19, 2024)
  NVIDIA today announced that TSMC and Synopsys are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.
  
  
• M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event (Thursday Feb. 22, 2024)
  M31 Technology Corporation (M31), a founding member of the Intel Foundry Services (IFS) Accelerator IP Alliance, today showcased M31's advanced process IP R&D capabilities at Intel's inaugural IFS Direct Connect event.
  
  
• Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process (Wednesday Feb. 21, 2024)
  Synopsys, Inc. (Nasdaq: SNPS) today announced its AI-driven digital and analog design flows are certified by Intel Foundry for the Intel 18A process.
  
  
• Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology (Tuesday Feb. 20, 2024)
  Samsung Electronics today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology.
  
  
• GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing (Monday Feb. 19, 2024)
  The U.S. Department of Commerce today announced $1.5 billion in planned direct funding for GlobalFoundries (Nasdaq: GFS) (GF) as part of the U.S. CHIPS and Science Act.
  
  
• Intel and UMC Announce New Foundry Collaboration (Thursday Jan. 25, 2024)
  Intel Corp. (Nasdaq: INTC) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets such as mobile, communication infrastructure and networking.
  
  
• Infineon and GlobalFoundries extend long-term agreement with focus on automotive microcontrollers (Tuesday Jan. 23, 2024)
  Infineon Technologies AG and GlobalFoundries (GF) today announced a new multi-year agreement on the supply of Infineon’s AURIX™ TC3x 40 nanometer automotive microcontrollers as well as power management and connectivity solutions.
  
  
• ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM (Thursday Jan. 18, 2024)
  ITRI has joined forces with Taiwan Semiconductor Manufacturing Company (TSMC) for pioneering research into the development of a spin-orbit-torque magnetic random-access memory (SOT-MRAM) array chip.
  
  
• Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product (Tuesday Jan. 09, 2024)
  Valens Semiconductor and Intel Foundry Services (IFS) announce that IFS will fabricate Valens Semiconductor's MIPI A-PHY chipsets using its advanced process nodes, aiming to address the robust demand in the market for this innovative connectivity solution.
  
  
• SkyWater Announces Availability of Cadence Open-Source PDK and Reference Design for SkyWater's 130 nm Process (Monday Nov. 06, 2023)
  SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced a new SkyWater open-source 130 nm process design kit (PDK) from Cadence Design Systems, Inc., which will be available in the Cadence® VLSI (very large-scale integration) Fundamentals Education Kit.
  
  
• UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI (Tuesday Oct. 31, 2023)
  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.
  
  
• Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU (Thursday Oct. 19, 2023)
  Samsung Electronics today unveiled its advanced and wide ranging automotive process solutions, from the most advanced 2-nanometer process to the 8-inch legacy process.
  
  
• TSMC Announces Breakthrough Set to Redefine the Future of 3D IC (Thursday Sep. 28, 2023)
  TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform® (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.
  
  
• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit (Wednesday Sep. 27, 2023)
  The new features include ultra-low power memory, designed to operate with exceptional energy efficiency, even in the most power-sensitive environments. Additionally, GF’s 22FDX platform introduces advanced temperature-resistant capabilities, which are critical for the auto industry as they ensure the long-term durability, reliability and safety of vehicle electronic systems, particularly in high-heat environments found under the hood and during demanding operations.
  
  
• GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations (Tuesday Sep. 26, 2023)
  GlobalFoundries (Nasdaq: GFS) (GF) today announced the official opening of a new hub facility in Penang, Malaysia. This new facility will create 300 high-value manufacturing support roles, including technicians, engineers, administrative and support functions.