Foundries News

• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation (Monday Mar. 31, 2025)
  Tower Semiconductor, the leader in high-value analog semiconductor foundry solutions, and Alcyon Photonics, a leader in integrated photonics design, today announced their collaboration to accelerate photonics integration.
  
  
• X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow for next-generation optical transceivers at OFC (Monday Mar. 31, 2025)
  Collaborative platform combines InP chiplets with SOI technology via Micro-Transfer-Printing for high-speed, energy-efficient optical transceivers
  
  
• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation (Thursday Mar. 27, 2025)
  Through this partnership, Alcyon Photonics will provide customers with silicon-validated, high-performance photonic building blocks (BBs) and circuits to accelerate the development of next-generation optical applications.
  
  
• Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era (Thursday Mar. 27, 2025)
  Quest Global customers will be able to leverage Rapidus’ 2nm gate-all-around (GAA) manufacturing process to develop engineering design and manufacturing solutions that will support growing industry demand for low-power artificial intelligence (AI) semiconductors.
  
  
• TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology (Monday Mar. 17, 2025)
  MediaTek and TSMC (TWSE: 2330, NYSE: TSM) announced today that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
  
  
• TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI (Monday Mar. 10, 2025)
  Company plans to increase U.S. investment in advanced semiconductor manufacturing by $100 billion with three new fabs, two advanced packaging facilities and an R&D center added to U.S. plans
  
  
• indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption (Thursday Mar. 06, 2025)
  Silicon, software and proprietary radar system design innovation delivers step-change in radar performance enabling industry’s lowest solution cost or BOM (Bill of Materials) with smallest footprint
  
  
• Pragmatic Semiconductor launches next-generation platform for mixed-signal flexible ASIC design with early-access programme (Wednesday Mar. 05, 2025)
  The platform comprises a process design kit (PDK) – compatible with standard electronic design automation (EDA) tools – and standard cell libraries, enabling innovators to swiftly design and manufacture custom FlexICs – the company’s ultra-thin, physically flexible application-specific integrated circuits (ASICs) with a low carbon footprint.
  
  
• GlobalFoundries and MIT Collaborate to Advance Research and Innovation on Essential Chips for AI (Monday Mar. 03, 2025)
  GlobalFoundries and the Massachusetts Institute of Technology (MIT) today announced a new master research agreement to jointly pursue advancements and innovations for enhancing the performance and efficiency of critical semiconductor technologies.
  
  
• SkyWater to Acquire Infineon's Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips (Thursday Feb. 27, 2025)
  SkyWater Technology has entered into an agreement with Infineon Technologies AG for SkyWater to purchase Infineon’s 200 mm fab in Austin, Texas (“Fab 25”) and a corresponding long-term supply agreement. SkyWater will operate the fab as a foundry, increasing available capacity in the U.S. for foundational chips on nodes from 130 nanometers down to 65 nanometers that are critical for many industrial, automotive and defense applications.
  
  
• GlobalFoundries Announces New York Advanced Packaging and Photonics Center (Friday Jan. 17, 2025)
  GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility
  
  
• Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles (Monday Dec. 16, 2024)
  As part of the agreement, Synopsys will develop advanced design flows leveraging its AI-driven EDA suite and enable a broad IP portfolio on Rapidus’ 2nm gate-all-around (GAA) process.
  
  
• X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology (Wednesday Dec. 04, 2024)
  X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has just announced a major innovation in NVM data storage which draws on the company’s best-in-class SONOS technology.
  
  
• GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile (Wednesday Oct. 23, 2024)
  Building on years of collaboration, this new process technology collaboration will provide power-efficient and secure connectivity solutions for essential consumer and industrial applications manufactured both in Europe and the U.S.
  
  
• Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing (Tuesday Sep. 17, 2024)
  Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, Multi-Billion-Dollar Collaboration Accelerates Development of Chip Manufacturing in Ohio
  
  
• ESMC Breaks Ground on Dresden Fab (Wednesday Aug. 21, 2024)
  ESMC – a joint venture between TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. – today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany.
  
  
• Building Intel's Foundry Ecosystem for the AI Era (Monday Jul. 01, 2024)
  Today marks a new milestone in the growth of Intel Foundry’s design ecosystem as key partners Ansys, Cadence, Siemens, and Synopsys have announced the availability of reference flows for Intel’s embedded multi-die interconnect bridge (EMIB) advanced packaging technology.
  
  
• CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative (Tuesday Jun. 25, 2024)
  CEA-Leti is proud to announce the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe. This initiative aligns with the ambition of the EU Chips Act, which seeks to bolster EU semiconductor capabilities and ensure technological sovereignty.
  
  
• Rapidus Set to Open 2-nm Pilot Fab, CEO Says (Wednesday Jun. 19, 2024)
  Japanese startup foundry Rapidus is set to open the company’s 2-nm pilot fab in April 2025, CEO Atsuyoshi Koike told EE Times in an interview.
  
  
• Intel 3 Represents an Intel Foundry Milestone (Tuesday Jun. 18, 2024)
  At the 2024 IEEE Symposium on VLSI Technology & Circuits in Hawaii, Intel provided details of the Intel 3 semiconductor process node, the third of five nodes in four years promised under CEO Pat Gelsinger’s IDM 2.0 manufacturing strategy.
  
  
• Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024 (Monday Jun. 17, 2024)
  Under the theme “Empowering the AI Revolution,” Samsung announced its reinforced process technology roadmap, including two new cutting-edge nodes — SF2Z and SF4U — as well as its integrated Samsung AI Solutions platform harnessing the unique strengths of its Foundry, Memory and Advanced Package (AVP) businesses.
  
  
• Crucial role for imec in EU Chips Act (Tuesday May. 21, 2024)
  imec announces it will host the NanoIC pilot line. This pilot line taps into the EU Chips Act vision to accelerate innovation, drive economic growth, and strengthen Europe's semiconductor ecosystem.
  
  
• TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership (Wednesday Apr. 24, 2024)
  TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
  
  
• TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix (Tuesday Apr. 09, 2024)
  Third fab will produce the most advanced leading-edge semiconductors in the U.S., bringing TSMC’s total investment in Arizona to over US$65 Billion
  
  
• Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion (Wednesday Apr. 03, 2024)
  Intel Corporation today outlined a new financial reporting structure that is aligned with the company’s previously announced foundry operating model for 2024 and beyond. This new structure is designed to drive increased cost discipline and higher returns by providing greater transparency, accountability and incentives across the business.
  
  
• NEDO Approves Rapidus' FY2024 Plan and Budget for "Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration" (Tuesday Apr. 02, 2024)
  Rapidus today announced that the New Energy and Industrial Technology Development Organization (NEDO) has approved its FY2024 plan and budget for “Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration” under ” Post 5G Information and Communication Systems Infrastructure Enhancement R&D Project / Development of Advanced Semiconductor Manufacturing Technology (Commissioned).”
  
  
• TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production (Tuesday Mar. 19, 2024)
  NVIDIA today announced that TSMC and Synopsys are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.
  
  
• M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event (Thursday Feb. 22, 2024)
  M31 Technology Corporation (M31), a founding member of the Intel Foundry Services (IFS) Accelerator IP Alliance, today showcased M31's advanced process IP R&D capabilities at Intel's inaugural IFS Direct Connect event.
  
  
• Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process (Wednesday Feb. 21, 2024)
  Synopsys, Inc. (Nasdaq: SNPS) today announced its AI-driven digital and analog design flows are certified by Intel Foundry for the Intel 18A process.
  
  
• Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology (Tuesday Feb. 20, 2024)
  Samsung Electronics today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology.