Foundries News

• UMC Collaborates with ARM to Validate UMC 14nm FinFET Process (Monday Jun. 22, 2015)
  UMC today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC’s 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node.
  
  
• Hua Hong Semiconductor Launches 0.11um Ultra-Low-Leakage Embedded Flash Process Platform That Delivers Powerful MCU Solutions for IoT (Friday Jun. 12, 2015)
  Hua Hong Semiconductor announced today to launch its latest process platform for 0.11μm Ultra-Low-Leakage (ULL) eFlash and EEPROM.
  
  
• Leti launches new Silicon Impulse FD-SOI Development Program, to Help Designers Broaden the Use of FD-SOI for Low-power Applications (Tuesday Jun. 09, 2015)
  CEA-Leti announced today that seven partners have joined its new FD-SOI IC development program, Silicon Impulse, launched to provide a comprehensive IC technology platform that offers IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.
  
  
• GLOBALFOUNDRIES Solidifies 14nm FinFET Design Infrastructure for Next-Generation Chip Designs (Tuesday Jun. 02, 2015)
  GLOBALFOUNDRIES today announced it has reached a critical milestone in providing a robust design infrastructure for its 14-nanometer (nm) FinFET process technology, supporting customer’s design starts on the foundry's latest manufacturing technology node.
  
  
• UMC Unveils UMC Auto Platform to Enable Automotive IC Designs (Tuesday May. 26, 2015)
  UMC Auto is a comprehensive platform that consists of a broad portfolio of automotive AEC-Q100 qualified technology solutions ranging from 0.5um to 28nm nodes, backed by robust manufacturing processes that comply with rigorous ISO TS-16949 automotive quality standards for all UMC fabs.
  
  
• GLOBALFOUNDRIES Offers New Low-Power 28nm Solution for High-Performance Mobile and IoT Applications (Wednesday May. 20, 2015)
  GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced it is offering a 28nm High-k Metal Gate (HKMG) radio frequency (RF) process technology that will provide power-efficient solutions for highly integrated mobile applications and connected devices.
  
  
• TowerJazz and UCSD Demonstrate First 5G 256-Element 60 GHz Silicon Wafer-Scale Phased Array Transmitter (Friday May. 15, 2015)
  TowerJazz and The University of California, San Diego (UCSD) today announced they have collaborated to demonstrate the first 256-element (16 x 16) wafer-scale phased array transmitter with integrated high-efficiency antennas operating at 56-65 GHz frequency range.
  
  
• Samsung Breaks Ground on $14 Billion Fab (Monday May. 11, 2015)
  The world's most expensive semiconductor fabrication plant--at over $14 billion--was announced at the ground breaking ceremony Thursday (May 7) by Samsung.
  
  
• Silicon Storage Technology and GLOBALFOUNDRIES Announce Qualification of Automotive Grade 55nm Embedded Flash Memory Technology (Tuesday May. 05, 2015)
  Microchip and GLOBALFOUNDRIES today announced the full qualification and availability of SST’s 55nm embedded SuperFlash® non-volatile memory (NVM) on GLOBALFOUNDRIES’ 55nm Low Power Extended (LPx)/ RF enabled platform.
  
  
• NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology (Tuesday Mar. 24, 2015)
  GLOBALFOUNDRIES and NXP Semiconductor today announced that they have jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on GLOBALFOUNDRIES’ 40-nanometer (nm) process technology platform.
  
  
• SMIC Achieves 8M Pixel CIS Production on 0.13-Micron BSI with Cista (Friday Feb. 27, 2015)
  SMIC and Cista have jointly announced the achievement of mass production for two CIS-BSI products, of 1.3MP resolution with 1.75-micron pixel and 8MP resolution with 1.4-micron pixel, respectively.
  
  
• GLOBALFOUNDRIES Joins imec to Develop Innovative RF Solutions for Internet of Things Applications (Tuesday Feb. 17, 2015)
  
  
  
• Samsung Announces Mass Production of Industry's First 14nm FinFET Mobile Application Processor (Monday Feb. 16, 2015)
  Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.
  
  
• MagnaChip to Offer Enhanced 0.13 Micron Embedded EEPROM Process Technology (Monday Feb. 02, 2015)
  MagnaChip announced today that it now offers a high voltage option for its 0.13 micron embedded EEPROM technology. This enhanced process increases noise immunity by improving the signal-to-noise ratio (SNR), a critical factor in touch sensing IC performance.
  
  
• Sony Joins FDSOI Club (Monday Feb. 02, 2015)
  Sony Corp. revealed that the company’s next-generation Global Navigation Satellite System (GNSS) chip will use 28-nm Fully Depleted Silicon On Insulator (FDSOI) process.
  
  
• UMC First Foundry in Taiwan to Receive ISO 15408-EAL6 Certification (Monday Jan. 12, 2015)
  UMC today announced that its Fab 12A has obtained ISO 15408-EAL6 certification issued by the German Government’s Federal Office for IT Security (BSI), making UMC the first foundry in Taiwan to provide IC manufacturing services that comply with the ISO 15408 Common Criteria.
  
  
• MagnaChip Offers Automotive Qualified 0.18um Semiconductor Manufacturing Process Technology (Monday Jan. 12, 2015)
  MagnaChip announced today that it has started to offer 0.18um automotive qualified process technology to foundry customers focused on high reliability automotive semiconductor applications.
  
  
• MEMSensing Launches the World's Smallest Commercial 3-Axis Accelerometer MSA330 with SMIC (Monday Jan. 05, 2015)
  MEMSensing and SMIC jointly announced the launch of the world's smallest 3-axis accelerometer MSA330, which utilizes SMIC's CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.
  
  
• SMIC Announces Co-investment Agreement and Investment Exit Agreement in Relation to Proposed Acquisition (Monday Dec. 22, 2014)
  
  
  
• SMIC Successfully Produces Qualcomm Snapdragon 410 processor in 28nm Process (Thursday Dec. 18, 2014)
  SMIC and Qualcomm today announced that its subsidiary, Qualcomm Technologies, Inc., and SMIC have achieved a major milestone in fabrication of 28nm Qualcomm® Snapdragon™ 410 processors.
  
  
• GLOBALFOUNDRIES and Cadence Deliver First SoC Enablement Solution Featuring ARM Cortex-A17 Processor in 28nm-SLP Process (Wednesday Dec. 17, 2014)
  Cadence and GLOBALFOUNDRIES today announced the delivery of quad-core silicon built around the ARM® Cortex®-A17 processor implemented using GLOBALFOUNDRIES’ 28nm Super Low Power (28nm-SLP) process with High-k Metal Gate (HKMG) technology.
  
  
• SMIC's Shenzhen Fab Goes into Operation (Wednesday Dec. 17, 2014)
  SMIC announced today it has begun operations at its Shenzhen 200mm wafer fab. This fab is the first 8-inch production line to be put into operation in Southern China, and is also the first domestic IC production line to be launched after the 'National Outline of Promoting the Development of IC Industry' was issued this year.
  
  
• Infineon and UMC Announce Manufacturing Agreement for Automotive Applications (Monday Dec. 15, 2014)
  Infineon Technologies and UMC today announced the extension of their manufacturing partnership into power semiconductors for automotive applications.
  
  
• TowerJazz Announces Successful Transfer of Fairchild Semiconductor’s Discrete Devices to TowerJazz Panasonic Semiconductor’s Japan Fab (Wednesday Dec. 10, 2014)
  TowerJazz announced today that Fairchild Semiconductor has started mass production at TowerJazz Panasonic Semiconductor Co.’s (TPSCo’s) fabrication facility in Tonami, Japan. This is a process transfer from Fairchild of their state of the art discrete devices for the industrial and consumer markets.
  
  
• Intel Custom Foundry Demonstrates Industry-Leading 32 Gbps SerDes on 14nm Process (Wednesday Nov. 19, 2014)
  Intel Corporation today unveiled silicon characterization results for its 1 to 32 Gbps high-speed SerDes on the 14nm process. This 32 Gbps SerDes is the second SerDes offering and adds to the previously announced 1 to 16 Gbps GP 14nm SerDes. It will be available by end of this year.
  
  
• TSMC 16FinFET Plus Process Achieves Risk Production Milestone (Wednesday Nov. 12, 2014)
  TSMC today announced its 16-nanometer FinFET Plus (16FF+) process is now in risk production. This enhanced version of TSMC’s 16FF process operates 40% faster than the company’s planar 20-nanometer system-on-chip (20SoC) process, or consumes 50% less power at the same speed.
  
  
• GLOBALFOUNDRIES and INVECAS Introduce New Dedicated Design Service Partner for Leading-Edge Technologies (Friday Nov. 07, 2014)
  GLOBALFOUNDRIES today announced a partnership with INVECAS Inc., a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies.
  
  
• UMC Enters Volume Production for Lantiq's Communication ICs (Tuesday Oct. 28, 2014)
  UMC today announced that UMC has entered volume production for Lantiq’s SPT170 high voltage Power Management ICs (PMIC) used for landline applications.
  
  
• Everspin and GLOBALFOUNDRIES partner to supply fully processed 300mm CMOS wafers with Everspin's ST-MRAM technology (Tuesday Oct. 28, 2014)
  Everspin Technologies, Inc., the world's leading developer and manufacturer of discrete and embedded MRAM, today announced that the company has partnered with GLOBALFOUNDRIES to build fully processed 300mm wafers with Everspin’s magnetic tunnel junction (MTJ) Spin-Torque Magnetoresistive Random-Access Memory (ST-MRAM) technology, starting with GLOBALFOUNDRIES 40 nanometer and 28 nanometer Low Power CMOS platforms.
  
  
• SMIC and ASML Sign a Volume Purchase Agreement Worth 450 Million Euros (Monday Oct. 27, 2014)
  SMIC and ASML announce the signing of a volume purchase agreement (VPA) that will provide SMIC with lithography systems from ASML. The VPA which is worth approximately 450 million Euros and is part of a strategic partnership between the companies that will help facilitate the timely expansion of SMIC's advanced technology capacities.