Foundries News

• UMC Board Resolves to Enter a Joint Venture Agreement for a 12" Fab in China (Thursday Oct. 09, 2014)
  The Board of Directors of UMC today resolved to participate in a 3-way agreement for a joint venture company focused on 12" wafer foundry services with Xiamen Municipal People's Government and FuJian Electronics & Information Group.
  
  
• TSMC launches ultra-low power technology platform for IoT and wearable device applications (Monday Sep. 29, 2014)
  TSMC today announced the foundry segment’s first and most comprehensive ultra-low power technology platform aimed at a wide range of applications for the rapidly evolving Internet of Things (IoT) and wearable device markets that require a wide spectrum of technologies to best serve these diverse applications.
  
  
• TSMC delivers first fully functional 16FinFET networking processor (Thursday Sep. 25, 2014)
  TSMC today announced that its collaboration with HiSilicon Technologies Co, Ltd. has successfully produced the foundry segment’s first fully functional ARM-based networking processor with FinFET technology.
  
  
• TSMC 28HPC Process in Volume Production (Friday Sep. 12, 2014)
  TSMC today announced its 28-nanometer High Performance Compact (28HPC) process is in volume production, making it the most power- and cost-efficient solution among all 28-nanometer technologies in the foundry segment.
  
  
• SMIC Introduces Independently Developed 38nm NAND Process Technology (Wednesday Sep. 10, 2014)
  SMIC announced the readiness of 38nm NAND Flash process technology, making it the only foundry to manufacture NAND products for its customers. This process platform has been independently developed in its entirety by SMIC.
  
  
• QuickLogic and GLOBALFOUNDRIES Collaborate to Deliver Next-Generation Sensor Hub for Smartphones and Wearables (Tuesday Sep. 09, 2014)
  QuickLogic and GLOBALFOUNDRIES today announced that QuickLogic’s next-generation ArcticLink 3 S2 Ultra-low Power Sensor Hub is sampling on GLOBALFOUNDRIES’ low-power 65nm process technology.
  
  
• NJR Analog ICs Manufactured at UMC Adopted by Major Japanese Auto OEM (Wednesday Sep. 03, 2014)
  New Japan Radio Co., Ltd. (New JRC) and UMC today announced that they have begun supplying automotive ICs to major Tier-1 Japanese auto suppliers.
  
  
• UMC Joins Fujitsu's New Foundry Company (Friday Aug. 29, 2014)
  UMC and Fujitsu Semiconductor today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan. UMC’s advanced 40nm technology will be also licensed to Fujitsu Semiconductor.
  
  
• Himax Imaging chooses TowerJazz Panasonic Semiconductor's State of the Art 65nm process with Outstanding 1.12µm Pixel for its Next Generation Cameras for Smart Phone Applications (Thursday Aug. 28, 2014)
  TowerJazz and TowerJazz Panasonic Semiconductor today announced its first major third party CMOS image sensor (CIS) customer, Himax Imaging, that is developing its next generation high end cameras for smart phone applications using TPSCo's state of the art 1.12µm-pixel CMOS image sensor (CIS) 65nm process.
  
  
• Intel Outlines 14nm, Broadwell (Tuesday Aug. 12, 2014)
  Intel provided the first details of its 14nm process technology, now qualified for volume production in an Oregon fab, and gave a sneak peak at Broadwell, its first CPU to use it.
  
  
• SMIC and JCET Establish a Joint Venture in Jiangyin National High-Tech Industrial Development Zone (Friday Aug. 08, 2014)
  SMIC and JCET jointly announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.
  
  
• NJR and UMC Extends Collaboration to MEMS Microphone Manufacturing (Wednesday Aug. 06, 2014)
  New Japan Radio Co., Ltd. (New JRC) and United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR’s MEMS (micro electro mechanical system) microphone products.
  
  
• HED Launches the First 55nm Smart Card Chip Based on SMIC's 55nm LL eFlash Platform (Monday Aug. 04, 2014)
  SMIC and HED jointly announced today that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL (low leakage) eFlash (embedded flash) platform.
  
  
• Intel's Custom Foundry Will Manufacture Future Panasonic System-on-Chips Using Intel's 14nm Low-Power Process (Tuesday Jul. 08, 2014)
  Intel today announced that it has entered into a manufacturing agreement with Panasonic Corporation’s System LSI Business Division. Intel’s custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel’s 14nm low-power manufacturing process.
  
  
• SMIC and Qualcomm Collaborate on 28nm Wafer Production in China (Thursday Jul. 03, 2014)
  SMIC and Qualcomm have announced that SMIC and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, are working together in connection with 28nm process technology and wafer manufacturing services in China to manufacture Qualcomm® Snapdragon™ processors.
  
  
• SMIC Establishes the First 12 inch CIS Supply Chain in China (Tuesday Jun. 24, 2014)
  SMIC, China's largest and most advanced semiconductor foundry, today announced that the first 12" color filter & micro lens array production line in mainland China has been completed and put into production by Toppan SMIC Electronics (Shanghai) Co., Ltd. ("TSES"), a joint venture of SMIC and Toppan Printing Co., Ltd. ("Toppan").
  
  
• SMIC and Brite Creates New Network Platform SMIC-ASIC.com (Thursday Jun. 05, 2014)
  Established by Brite and supported by SMIC and Brite, the key purpose of the platform is to build a professional network community in the semiconductor industry. SMIC-ASIC.com has multiple functions, ranging from the delivery of ASIC information, to supporting engineering, technical and business related enquires.
  
  
• Scaleo chip and GLOBALFOUNDRIES Announce First Automotive MCU Manufactured Using 55nm Automotive-Specific Semiconductor Platform (Wednesday Jun. 04, 2014)
  Scaleo chip today announced that they are the first fabless company to introduce an automotive microcontroller manufactured with the new GLOBALFOUNDRIES 55nm automotive-specific advanced semiconductor manufacturing platform.
  
  
• Samsung's 14nm FinFET Process Technology Ecosystem Solidly in Place for Mobile Consumer and IT Infrastructure SoC Applications (Monday Jun. 02, 2014)
  Stating that not all FinFETs are created equal, Samsung Electronics Co., Ltd., a global leader in advanced semiconductor solutions, today announced that the IP and design enablement ecosystem for its foundry’s 14nm FinFET process technology is firmly in place as customers begin their early design work.
  
  
• SMIC Offers Stable and Robust Wafer Productions for Fingerprint Sensors (Tuesday May. 20, 2014)
  SMIC today announced that the company has ramped up wafer productions for fingerprint sensors with stable and robust solutions. Fingerprint sensor is the key device of fingerprint identification and automatic collection.
  
  
• SMIC and Other Groups Collaborate to Setup the "IC Advanced Technology Research Institute" to Put Research Into the Fast Lane (Friday May. 16, 2014)
  SMIC today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.
  
  
• Samsung and STMicroelectronics Sign Strategic Agreement to Expand 28nm FD-SOI Technology (Thursday May. 15, 2014)
  STMicroelectronics and Samsung Electronics today announced the signing of a comprehensive agreement on 28nm Fully Depleted Silicon-on-Insulator (FD-SOI) technology for multi-source manufacturing collaboration.
  
  
• ON Semiconductor Introduces New Qualified IP Blocks on its 180 nm Process Leading to Reduced Time to Market (Friday May. 09, 2014)
  ON Semiconductor has announced the availability of new qualified intellectual property (IP) on its proprietary ONC18 180 nanometer (nm) process technology. The newly qualified circuit blocks will help ON Semiconductor’s foundry (GDS2) interface customers minimize the risk of the need for silicon re-spins and therefore help reduce development costs and shorten time-to-market for new designs.
  
  
• UMC Reports Sales for April 2014 (Friday May. 09, 2014)
  UMC today reported unaudited net sales for the month of April 2014.
  
  
• GLOBALFOUNDRIES Introduces 55nm Automotive-Specific Advanced Semiconductor Manufacturing Platform (Wednesday May. 07, 2014)
  Built on the company’s 55-nanometer (nm) Low Power process and AEC-Q100 Group D qualified, the solution includes a comprehensive set of technology and design enablement capabilities tailored to improve the efficiency, performance, and power consumption of automotive ICs while maintaining adherence to the industry’s strict safety and quality standards.
  
  
• Toshiba Joins GLOBALSOLUTIONS Ecosystem as Worldwide ASIC Partner (Tuesday Apr. 22, 2014)
  GLOBALFOUNDRIES today announced that Toshiba Corporation will join the company’s GLOBALSOLUTIONS ecosystem of partners. As a worldwide ASIC partner, Toshiba will enable its Fit Fast Structured Array (FFSATM) and ASIC solutions based upon GLOBALFOUNDRIES’ technologies and services for customers across the globe.
  
  
• Samsung and GLOBALFOUNDRIES Forge Strategic Collaboration to Deliver Multi-Sourced Offering of 14nm FinFET Semiconductor Technology (Thursday Apr. 17, 2014)
  Samsung Electronics Co., Ltd. and GLOBALFOUNDRIES today announced a new strategic collaboration to deliver global capacity for 14 nanometer (nm) FinFET process technology. For the first time, the industry’s most advanced 14nm FinFET technology will be available at both Samsung and GLOBALFOUNDRIES, giving customers the assurance of supply that can only come from true design compatibility at multiple sources across the globe.
  
  
• TSMC to Sell 5% of Vanguard International Semiconductor (Friday Apr. 11, 2014)
  The TSMC Board of Directors today approved the sale of 82 million common shares of Vanguard International Semiconductor Corporation (VIS), approximately 5% of VIS’ paid-in-capital, at a price of about NT$42.55 per share and a total price of approximately NT$3.49 billion.
  
  
• Common Platform in Preparation for SOI, FinFETs at 10nm (Wednesday Apr. 09, 2014)
  A team of engineers from IBM Microelectronics, Globalfoundries, Samsung, STMicroelectronics and UMC are due to present a 10nm logic platform that supports FinFETs on both bulk CMOS and on silicon-on-insulator wafers.
  
  
• AMD Amends Wafer Supply Agreement with GLOBALFOUNDRIES (Thursday Apr. 03, 2014)
  AMD today announced that it amended its Wafer Supply Agreement (WSA) with GLOBALFOUNDRIES Inc. for 2014. Under the terms of the amendment, AMD and GLOBALFOUNDRIES agreed on purchase commitments for 2014 and established fixed pricing and other terms of the WSA which apply to products AMD will purchase from GLOBALFOUNDRIES.