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FPGA / CPLD News

• Lattice Semiconductor and Synopsys Renew Partnership on FPGA Synthesis Tools (Thursday Sep. 26, 2019)
  Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, and Synopsys, Inc. (NASDAQ: SNPS) today announced the extension of their multi-year OEM licensing agreement for Synopsys' Synplify® FPGA synthesis tools.
  
  
• Intel Ships Stratix 10 DX FPGAs; VMware Among Early Partners (Friday Sep. 20, 2019)
  Intel today announced shipments of new Intel® Stratix® 10 DX field programmable gate arrays (FPGA). The new FPGAs are designed to support Intel® Ultra Path Interconnect (Intel® UPI), PCI-Express (PCIe) Gen4 x16, and a new controller for Intel® Optane™ memory to provide flexible, high performance acceleration. VMware is one of many early access program participants.
  
  
• GOWIN Semiconductor Announces their GoAI Solution for AI Acceleration at the Edge (Monday Sep. 16, 2019)
  GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of its latest solution called GoAI, providing acceleration for artificial intelligence at the edge on GOWIN FPGAs.
  
  
• Intel Ships First 10nm Agilex FPGAs (Friday Aug. 30, 2019)
  Intel today announced that it has begun shipments of the first Intel® Agilex® field programmable gate arrays (FPGAs) to early access program customers. Participants in the early access program include Colorado Engineering Inc., Mantaro Networks, Microsoft and Silicom.
  
  
• Xilinx Announces the World's Largest FPGA Featuring 9 Million System Logic Cells (Wednesday Aug. 21, 2019)
  Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced the expansion of its 16 nanometer (nm) Virtex® UltraScale+™ family to now include the world's largest FPGA — the Virtex UltraScale+ VU19P.
  
  
• Intel Expands Workload Acceleration with Hewlett Packard Enterprise in New Programmable Acceleration Card (Monday Aug. 05, 2019)
  Intel announced today it is working with Hewlett Packard Enterprise* (HPE) to provide increased workload acceleration capacity for the HPE ProLiant DL380 Gen10 server.
  
  
• Lattice Semiconductor Delivers Flexible Connectivity for Industrial Vision Applications with New CrossLink Reference Design (Wednesday Jul. 17, 2019)
  The SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design provides industrial device customers with a flexible, easy-to-implement solution for connecting advanced application processors (APs) with many of the image sensors currently used in today’s machine vision applications for industrial environments.
  
  
• Accelerate Smart Embedded Vision Designs with Microchip's Expanding Low-Power FPGA Video and Image Processing Solutions (Monday Jul. 15, 2019)
  To help developers accelerate designs, Microchip Technology Inc. (Nasdaq: MCHP), via its Microsemi subsidiary, today announced its Smart Embedded Vision initiative that provides solutions for designing intelligent machine vision systems with Microchip's low-power PolarFire® FPGAs.
  
  
• GOWIN Semiconductor Introduces Their latest FPGA Product Line with Built-In Security (Monday Jul. 01, 2019)
  GOWIN Semiconductor announces the release of it’s latest product line called SecureFPGA. SecureFPGA is targeted for endpoint and server management applications utilizing built-in security functions to eliminate the rise of security attacks and breaches in edge computing.
  
  
• Magewell Selects Lattice Semiconductor ECP FPGA Family For Video Capture Devices (Wednesday Jun. 12, 2019)
  Lattice today announced that Nanjing Magewell Electronics Co., Ltd. (“Magewell”) selected the Lattice ECP™ FPGA family to enable video processing in multiple Magewell USB 3.0 video capture devices, including the USB Capture Plus series.
  
  
• Lattice Diamond 3.11 Software Adds Support for New MachXO3D FPGA (Thursday Jun. 06, 2019)
  Lattice Semiconductor today announced version 3.11 of its Lattice Diamond® design software, a complete GUI-based FPGA design and verification environment that offers leading-edge design and implementation tools optimized for low-power Lattice FPGAs.
  
  
• Achronix Introduces Ground-Breaking FPGA Family, Delivering New Levels of Performance with Adaptability for High-Bandwidth Data Acceleration Applications (Tuesday May. 21, 2019)
  The Achronix Speedster®7t family – based on a new, highly optimized architecture – goes beyond traditional FPGA solutions featuring ASIC-like performance, FPGA adaptability and enhanced functionality to streamline design.
  
  
• Lattice's New MachX03D FPGA Enhances Security with Hardware Root-of-Trust Capabilities (Monday May. 20, 2019)
  Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the MachXO3D™ FPGA for securing systems against a variety of threats.
  
  
• GOWIN Semiconductor Joins Arm DesignStart Offering Free Arm Cortex-M Processors for its FPGA Product Families (Wednesday May. 08, 2019)
  GOWIN will be joining the Arm DesignStart™ FPGA program, offering embedded developers a no license fee, no royalty access model to use Arm Cortex®-M processors for enabling FPGA projects with proven Arm IP and software products.
  
  
• GOWIN Adopts HyperBus for built-in PSRAM and HyperRAM Interfacing (Tuesday Apr. 30, 2019)
  GOWIN Semiconductor announces HyperBus interface specification support for their FPGA and programmable SoC products. The HyperBus interface is used to support external low pin count memories and the PSRAM provided internally within GOWIN programmable devices.
  
  
• Radiant 1.1 Lattice FPGA Design Tools Release Accelerates Design Reuse (Tuesday Apr. 23, 2019)
  This new release adds an Intellectual Property (IP) packaging capability that enables external IP developers, including third party IP providers and customers, to prepare and package encrypted IP in the Radiant Software IP format.
  
  
• Intel driving Data-Centric World with new 10nm Intel Agilex FPGA Family (Wednesday Apr. 03, 2019)
  Intel announced today a brand-new product family, the Intel® Agilex™ FPGA. This new family of field programmable gate arrays (FPGA) will provide customized solutions to address the unique data-centric business challenges across embedded, network and data-center markets.
  
  
• Efinix Transitions Trion T20 FPGAs to High-Volume Production (Thursday Mar. 28, 2019)
  Efinix®, an innovator in programmable product platforms and technologies, today announced the transition of its Trion™ T20 FPGAs to high-volume production. Launching T20 samples a few short months ago, Efinix has achieved this milestone swiftly, meeting customers’ orders for millions of units.
  
  
• Intel Announces First 58Gbps FPGA Transceiver in Volume Production Enabling 400G Ethernet Deployment (Wednesday Mar. 06, 2019)
  At the OFCconference, Intel’s Programmable Solutions Group is showcasing market-leading 58Gbps transceiver technology integrated on the Intel® Stratix® 10 TX FPGA — the world’s first field programmable gate array (FPGA) with 58Gbps PAM4 transceiver technology now shipping in volume production and enabling 400Gb Ethernet deployment.
  
  
• Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment (Monday Feb. 25, 2019)
  Xilinx and Samsung Electronics today announced an expanded collaboration that has resulted in the world's first 5G New Radio (NR) commercial deployment.
  
  
• GOWIN Semiconductor Announces Release of the New GOWIN EDA Tools for Improved Performance on New FPGA Product Families (Monday Feb. 25, 2019)
  GOWIN Semiconductor announces the release of GOWIN’s new EDA tool, YunYuan 1.9. With the release of this new toolchain, GOWIN will enable enhanced features and performance capabilities on their current and future FPGA product families.
  
  
• Xilinx Extends its Breakthrough Zynq UltraScale+ RFSoC Portfolio to Full sub-6GHz Spectrum Support (Thursday Feb. 21, 2019)
  Xilinx, the leader in adaptive and intelligent computing, today announced it has extended its award-winning Zynq® UltraScale+™ Radio Frequency (RF) System-on-Chip (SoC) portfolio with greater RF performance and scalability.
  
  
• Xilinx Technology to Power Baidu Brain Edge AI Applications (Thursday Jan. 17, 2019)
  Xilinx (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced that the newly unveiled EdgeBoard, Baidu's edge acceleration computing solution is enabled by Xilinx. The EdgeBoard is a turn-key solution which is available fully configured directly from Baidu.
  
  
• Gowin Semiconductor Corp.'s Cumulative Shipments Reach 10 Million Pieces (Monday Jan. 07, 2019)
  Gowin Semiconductor announces that its cumulative shipments have reached 10 million pieces. Among them, Gowin’s overall device sales in 2018 exceeded 8 million units, 8 times greater year over year compared to 2017.
  
  
• Efinix Drives AI Edge Computing with Trion T20 FPGA Samples and Expansion of Product Offering to 200K LEs with T200 FPGA (Thursday Dec. 13, 2018)
  Efinix today announced the availability of Trion™ T20 FPGA samples and the expansion of the company’s product offering to 200K logic elements (LEs) with the T200 FPGA to support demands by major customers and markets.
  
  
• Industry's First RISC-V SoC FPGA Architecture Brings Real-Time to Linux, Giving Developers the Freedom to Innovate in Low-Power, Secure and Reliable Designs (Tuesday Dec. 04, 2018)
  Microsemi today extended its Mi-V ecosystem by unveiling the architecture for a new class of SoC FPGAs that combine the industry's lowest power mid-range PolarFire™ FPGA family with a complete microprocessor subsystem based on the open, royalty-free RISC-V instruction set architecture (ISA).
  
  
• Xilinx Extends Functional Safety into AI-class Devices (Tuesday Nov. 20, 2018)
  Xilinx, Inc. (NASDAQ: XLNX) today announced that its Zynq® UltraScale+™ MPSoC family has been assessed as SIL 3, HFT1 capable, according the IEC 61508 functional-safety specification, by Exida, the leading functional safety certification agency.
  
  
• Xilinx Advances State-of-the-Art in Integrated and Adaptable Solutions for Aerospace and Defense with Introduction of 16nm Defense-Grade UltraScale+ Portfolio (Thursday Nov. 15, 2018)
  Xilinx today announced the availability of its Defense-grade XQ UltraScale+ portfolio of products, providing the benefits of its UltraScale+ architecture plus extended temperature and ruggedized packages to address the needs of the aerospace and defense industry.
  
  
• Gowin Semiconductor Brings Ultra Low Power Programmable Logic Devices To Market (Monday Oct. 29, 2018)
  GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, introduces its latest family of small size and low power FPGA products, the GW1NZ “Mobile FPGA”.
  
  
• Xilinx and Huawei Announce the First FPGA Cloud-based Real-time Video Streaming Solution in China (Monday Oct. 15, 2018)
  Xilinx, Inc. (NASDAQ: XLNX), Huawei, and NGCodec, today announced the development of China’s first cloud-based high-efficiency video coding (HEVC) solution, which is uniquely enabled by Xilinx® Virtex UltraScale+™ FPGAs and NGCodec’s H.265 video encoder.