D&R Headline News | Most Popular | SoC News Alerts | |

FPGA / CPLD News

• Xylon Unveils New Panoramic Multi-Sensor Camera Demo at Xilinx Developer Forum (Thursday Oct. 11, 2018)
  The new 360 degrees panoramic camera demo from Xylon showcases simultaneous video processing of 2 to 6 multi-megapixel camera sensors that can be upgraded by AI algorithms and implemented in a single Xilinx Zynq UltraScale+ MPSoC
  
  
• Xilinx Unveils Versal: The First in a New Category of Platforms Delivering Rapid Innovation with Software Programmability and Scalable AI Inference (Wednesday Oct. 03, 2018)
  Enabling a new era of rapid innovation for any application by any developer, Xilinx, Inc. (NASDAQ: XLNX) CEO Victor Peng unveiled Versal™ – the industry's first adaptive compute acceleration platform (ACAP).
  
  
• Xilinx Launches the World's Fastest Data Center and AI Accelerator Cards (Tuesday Oct. 02, 2018)
  Xilinx the leader in adaptive and intelligent computing, today launched Alveo, a portfolio of powerful accelerator cards designed to dramatically increase performance in industry-standard servers across cloud and on-premise data centers.
  
  
• Intel Adds to Portfolio of FPGA Programmable Acceleration Cards to Speed Up Data Center Computing (Tuesday Sep. 25, 2018)
  Intel today extended its field programmable gate array (FPGA) acceleration platform portfolio with the addition of the new Intel® Programmable Acceleration Card (PAC) with Intel® Stratix® 10 SX FPGA, Intel’s most powerful FPGA.
  
  
• Lattice Expands Ultra-Low Power sensAI Stack with Optimized Solutions for Always-On, On-Device AI (Tuesday Sep. 25, 2018)
  Lattice today unveiled expanded features of the company’s popular Lattice sensAI™ stack designed to speed time-to-market for developers of flexible machine learning inferencing in consumer and industrial IoT applications.
  
  
• Gowin Semiconductor Unveils the Latest Embedded Memory Products for their Families of Programmable Logic Devices (Monday Sep. 17, 2018)
  GOWIN Semiconductor announces 2 new additions to the current families of embedded memory FPGA devices, the GW1NR-LV4MG81 and GW1NSR-LX2CQN48.
  
  
• Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification (Tuesday Aug. 28, 2018)
  Microsemi today announced its RTG4™ high-speed signal processing radiation-tolerant field programmable gate arrays (FPGAs) have achieved Qualified Manufacturers List (QML) Class V qualification by the Defense Logistics Agency (DLA).
  
  
• GOWIN Semiconductor Corp. Announces RISC-V Microprocessor Implementation for GOWIN FPGA Solutions and Expands Sales Channels in the Americas Region (Monday Aug. 27, 2018)
  GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, announces their development of RISC-V Microprocessor IP implemented in their current ARORA® Family GW-2A FPGA products.
  
  
• Xilinx Unveils its Vision for the Future of Computing, Details New Programmable Engine Fabric and Multiple AI Technologies (Monday Aug. 20, 2018)
  At the 2018 Hot Chips conference this week, Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, will present a tutorial, three technical sessions and a keynote by Xilinx CEO Victor Peng, all highlighting the company's vision for the future of computing and how Xilinx is uniquely positioned to address it.
  
  
• SK Telecom Deploys Xilinx FPGAs for AI Acceleration, Achieves 5X Performance/16X Performance-per-watt over GPUs (Thursday Aug. 16, 2018)
  Xilinx and SK Telecom (SKT) today jointly announced that SKT has deployed Xilinx® FPGAs as their artificial intelligence (AI) accelerators in its data center.
  
  
• Gowin Semiconductor Corp. announces LittleBee Family GW1NS Series GW1NS-2K FPGA SoC Device Engineering Samples and Development Board Available (Tuesday Jul. 24, 2018)
  WIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces Gowin first FPGA SoC devices LittleBee™ family GW1NS series, GW1NS-2, engineering samples and development board available now.
  
  
• Daimler AG Selects Xilinx to Drive Artificial Intelligence-Based Automotive Applications (Tuesday Jun. 26, 2018)
  Xilinx and Daimler AG today announced that the two companies are collaborating on an in-car system using Xilinx technology for artificial intelligence (AI) processing in automotive applications.
  
  
• C-SKY Microsystems Selects QuickLogic as Their Strategic eFPGA Partner by Signing Master Technology License Agreement (Monday Jun. 25, 2018)
  QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power embedded FPGA (eFPGA) IP, Multi-core Voice-enabled SoC, display bridge and programmable logic solutions, today announced that C-SKY Microsystems Co., Ltd. has signed a Master Technology License Agreement for its ArcticPro™ Embedded FPGA (eFPGA) IP.
  
  
• Microsemi Collaborates with MathWorks to Deliver First Integrated FPGA-in-the-Loop Workflow for PolarFire and SmartFusion2 FPGA Development Boards (Thursday Apr. 19, 2018)
  Microsemi today announced its collaboration with MathWorks to launch hardware support for field programmable gate array (FPGA)-in-the-loop (FIL) verification workflow with Microsemi FPGA development boards.
  
  
• Intel Chip Performs 10 Trillion Calculations per Second (Thursday Apr. 19, 2018)
  Because of the Intel® Stratix® 10’s unique design, it can whip through calculations at blinding speeds – often 10 to 100 times faster than the chips in consumer devices. Intel Stratix 10 FPGAs – the latest version came out in February – are capable of 10 TFLOPS, or 10 trillion floating point operations per second. The Stratix 10 is the fastest chip of its kind in the world.
  
  
• Microsemi's Mi-V Ecosystem Continues to Expand as New Member Antmicro Joins to Develop Mi-V RISC-V Processor Subsystems for PolarFire FPGAs (Wednesday Apr. 18, 2018)
  Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced Antmicro, an international research and development company known for its work with emerging technologies in embedded and cyber-physical systems, has joined Microsemi's Mi-V™ RISC-V ecosystem.
  
  
• Adoption of Intel FPGAs for Acceleration of Enterprise Workloads Goes Mainstream (Wednesday Apr. 11, 2018)
  Today, Intel announced top-tier OEM adoption of Intel’s field programmable gate array (FPGA) acceleration in their server lineup. This is the first major use of reprogrammable silicon chips to help speed up mainstream applications for the modern data center.
  
  
• Xilinx Unveils Revolutionary Adaptable Computing Product Category (Monday Mar. 19, 2018)
  Xilinx today announced a new breakthrough product category called Adaptive Compute Acceleration Platform (ACAP) that goes far beyond the capabilities of an FPGA. An ACAP is a highly integrated multi-core heterogeneous compute platform that can be changed at the hardware level to adapt to the needs of a wide range of applications and workloads.
  
  
• Efinix Releases Trion Programmable Platform (Monday Mar. 05, 2018)
  Efinix™, an innovator in programmable product platforms and technology, today announced the release of its Trion™ programmable platform. The Trion platform was built using Efinix’s Quantum™ programmable technology, comprising logic, routing, embedded memory and DSP blocks
  
  
• Lattice Releases Next-Generation FPGA Software for Development of Broad Market Low Power Embedded Applications (Monday Feb. 26, 2018)
  Lattice today announced the release of its new FPGA software, Lattice Radiant™, targeted for the development of broad market low power embedded applications.
  
  
• Intel Ships Industry's First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV (Monday Feb. 26, 2018)
  Intel today announced it has begun shipping its Intel® Stratix® 10 TX FPGAs, the industry’s only field programmable gate array (FPGA) with 58G PAM4 transceiver technology. By integrating the FPGA with 58G PAM4 technology, Intel Stratix 10 TX FPGAs can double the transceiver bandwidth performance when compared to traditional solutions.
  
  
• Xilinx Announces Availability of Automotive Qualified Zynq UltraScale+ MPSoC Family (Monday Jan. 15, 2018)
  Xilinx today announced availability of the automotive qualified Zynq® UltraScale+™ MPSoC family, enabling development of safety critical ADAS and Autonomous Driving Systems.
  
  
• Microsemi and Future Electronics Announce Avalanche Board for Designing with Microsemi's PolarFire FPGAs (Tuesday Jan. 09, 2018)
  As the lowest cost entry development board available today for designing with Microsemi's lowest power, cost-optimized mid-range PolarFire FPGAs, Future's Avalanche board lowers the barrier to entry for PolarFire FPGAs and helps expand Microsemi's market opportunities for the device.
  
  
• Intel Unveils Industry's First FPGA Integrated with High Bandwidth Memory Built for Acceleration (Tuesday Dec. 19, 2017)
  Intel today announced the availability of the Intel® Stratix® 10 MX FPGA, the industry’s first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2).
  
  
• Lattice Diamond Software Receives Road Vehicles Functional Safety Qualification (ISO 26262) (Monday Dec. 11, 2017)
  Lattice Semiconductor today announced the qualification of its Lattice Diamond 2.1 software for Road Vehicles Functional Safety.
  
  
• Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost (Wednesday Nov. 22, 2017)
  Xilinx today announced a single-chip Zynq®-7000 All Programmable SoC functional safety solution to help customers shorten time to IEC 61508 compliance and certification across many industrial applications like IIoT Edge Controllers, Motor Drives, Intelligent IOs, Smart Sensors, Gateways, Industrial Transport, and Electrical Grids.
  
  
• Huawei Unveils Xilinx FPGA-Powered Cloud Server to North America at SC17 (Monday Nov. 20, 2017)
  Xilinx, Inc. (XLNX) and Huawei Technologies Co., Ltd. today jointly announced the North American debut of the Huawei FPGA Accelerated Cloud Server (FACS) platform at SC17. Powered by Xilinx high performance Virtex® UltraScale™+ FPGAs, the FACS platform is differentiated in the marketplace today.
  
  
• Intel Enables 5G, NFV and Data Centers with High-Performance, High-Density ARM-based Intel Stratix 10 FPGA (Thursday Oct. 26, 2017)
  Intel today announced it has begun shipping its Intel® Stratix® 10 SX FPGA – the only high-end FPGA family with an integrated quad-core ARM* Cortex*-A53 processor.
  
  
• Microsemi Launches Mi-V Ecosystem to Accelerate Adoption of RISC-V (Thursday Oct. 19, 2017)
  Microsemi today announced the company's new Mi-V™ ecosystem with industry leaders, to increase adoption of its RISC-V soft central processing unit (CPU) product family.
  
  
• Microsemi's Lowest Power, Cost-Optimized Mid-Range PolarFire FPGAs Achieve Key Milestone by Passing PCI SIG's PCIe Endpoint Compliance Suites (Tuesday Oct. 17, 2017)
  Microsemi today announced its PolarFire™ field programmable gate arrays (FPGAs) have achieved a key milestone by passing the Peripheral Component Interconnect Special Interest Group's (PCI SIG's) PCIe endpoint compliance suites, working at 5 Gbps.