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• WiLAN Signs Wireless License with LG (Monday Nov. 25, 2019)
  Wi-LAN Inc. ("WiLAN"), a Quarterhill Inc. ("Quarterhill") company (TSX: QTRH) (NASDAQ: QTRH), today announced that WiLAN has entered into a license agreement and settled all pending wireless patent litigation with LG Electronics ("LG").
  
  
• TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License (Tuesday Oct. 29, 2019)
  TSMC and GLOBALFOUNDRIES (GF) today announced they are dismissing all litigation between them as well as those that involve any of their customers.
  
  
• TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide (Tuesday Oct. 01, 2019)
  TSMC, the world’s leading global innovator in semiconductor manufacturing, filed multiple lawsuits on September 30, 2019 against GlobalFoundries in the United States, Germany and Singapore for its ongoing infringement of 25 TSMC patents by at least its 40nm, 28nm, 22nm, 14nm, and 12nm node processes.
  
  
• Qualcomm And LGE Enter Into a New Global Patent License Agreement (Wednesday Aug. 21, 2019)
  Under the terms of the five-year, royalty-bearing agreement, Qualcomm has granted LGE a patent license to develop, manufacture and sell 3G, 4G and 5G single-mode and multimode complete devices
  
  
• Sofics' clipping/scaling circuit enhances reliability of Near Field Communication (NFC) and other wireless interfaces (Tuesday May. 28, 2019)
  Sofics announced that its technology to protect wireless antenna pads is now published as a patent by the European Patent Office. The clipping/scaling circuit is used to protect the Near Field Communication (NFC) antenna pads in an ultra-low power Bluetooth chip with 'Touch-to-pair' functionality.
  
  
• Eta Compute Awarded Additional Patent For Asynchronous Microprocessor Technology (Tuesday May. 14, 2019)
  Eta Compute announces today that the company has been issued an additional patent by the US Patent and Trademark Office for novel self-timed technology which supports dynamic voltage scaling.
  
  
• Qualcomm and Apple agree to drop all litigation (Wednesday Apr. 17, 2019)
  Qualcomm and Apple today announced an agreement to dismiss all litigation between the two companies worldwide. The settlement includes a payment from Apple to Qualcomm.
  
  
• Sonics and Arteris IP Agree to Dismiss Litigation (Thursday Mar. 21, 2019)
  Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Case # 11-cv-5311-SBA was dismissed with prejudice by the Northern District of California Court with support of all parties involved
  
  
• WiLAN and Several Subsidiaries Sign Comprehensive Semiconductor License Agreement with SK hynix (Thursday Feb. 28, 2019)
  The licensed patents generally cover dynamic random-access memory (DRAM), NAND flash memory and other related semiconductor technologies.
  
  
• Huawei Enters into MPEG LA's AVC Patent Portfolio License (Wednesday Feb. 20, 2019)
  MPEG LA announced today that Huawei Technologies Co., Ltd., Huawei Device Co., Ltd and Huawei Device (Shenzhen) Co., Ltd (“Huawei”) have become Licensees to MPEG LA’s AVC Patent Portfolio License (“AVC License”).
  
  
• Rambus and Phison Sign Patent License (Wednesday Oct. 10, 2018)
  Under the terms of the agreement, Rambus will license Phison the use of a wide range of innovations in the Rambus patent portfolio, including technologies for DRAM and NAND Flash memory controllers, as well as serial links.
  
  
• Rambus Renews Patent License with NVIDIA (Monday Oct. 08, 2018)
  Rambus today announced it has renewed a patent license agreement with NVIDIA. The agreement allows NVIDIA’s use of innovations in the Rambus patent portfolio, including those covering memory controllers and serial links.
  
  
• Rambus and Infineon Renew Patent License Agreement (Wednesday Aug. 29, 2018)
  Today, Rambus Inc. (NASDAQ: RMBS) announced that it has renewed its patent license agreement with Infineon Technologies. Under the terms of the ten-year extension of its previous agreement, Infineon will license Rambus’ Differential Power Analysis (DPA) Countermeasure portfolio.
  
  
• WiLAN Provides Litigation Update (Thursday Aug. 02, 2018)
  In a trial verdict rendered on August 1, 2018 in the United States District Court for the Southern District of California a jury awarded WiLAN $145.1 million in damages against Apple Inc. for infringement of WiLAN's US patent Nos 8,457,145 and 8,537,757.
  
  
• WiLAN Subsidiary Acquires Patent Portfolio from MagnaChip (Monday Jun. 25, 2018)
  Wi-LAN today announced that its wholly-owned subsidiary Atria Technologies Inc. has acquired a portfolio of more than 85 patents and applications from MagnaChip Semiconductor Corporation.
  
  
• Cortus Asserts Intellectual Property Claims Against Microsemi, a Wholly Owned Subsidiary of Microchip Technology Inc. (Nasdaq: MCHP) (Thursday Jun. 07, 2018)
  Cortus S.A.S (“Cortus”) has asserted breach of contract, copyright infringement and trade secret misappropriation claims in ICC arbitration against Microsemi, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), which is a Licensee of Cortus under a Software License Agreement.
  
  
• Flex Logix Co-Founders Awarded Interconnect Patent For Connecting Any Kind Of RAM Between eFPGA Cores To Create Application-Optimized eFPGA Arrays (Tuesday May. 15, 2018)
  Flex Logix® Technologies announced that an additional switch interconnect patent, U.S. Patent 9,973,194, was issued today to Flex Logix, naming its co-founders Cheng Wang and Geoff Tate as the inventors.
  
  
• Everspin Signs Long-term Patent License Agreement with Alps Electric (Monday Mar. 19, 2018)
  Under the agreement, Alps and Everspin will mutually grant licenses to magnetoresistive-based 3D sensor patent portfolios for magnetoresistive sensor products. The terms of the agreement include an up-front license fee to Everspin as well as future royalties.
  
  
• Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling of eFPGA Cores to Create Wide Range of Larger eFPGA Arrays (Tuesday Feb. 27, 2018)
  Flex Logix Technologies announced that an additional switch interconnect patent, U.S. Patent 9,906,225, was issued today to Flex Logix, naming its co-founder Cheng Wang as the inventor.
  
  
• Rambus and Marvell Sign Patent License Agreement (Thursday Jan. 25, 2018)
  Rambus today announced that Marvell Technology Group Ltd., a leader in storage, networking and connectivity semiconductor solutions, has signed a patent license agreement.
  
  
• UMC Files Patent Infringement Lawsuit against Micron (Friday Jan. 12, 2018)
  The lawsuit covers three areas that allegedly infringe upon UMC’s patent rights in China, including specific memory applications that relate to DDR4, SSD and memory used in graphics cards.
  
  
• WiLAN Reaches IP Framework Agreement with TSMC (Friday Jan. 05, 2018)
  Wi-LAN announced today that it has entered into a new seven‑year intellectual property framework agreement with Taiwan Semiconductor Manufacturing Company, Ltd. ("TSMC"), the world's leading semiconductor foundry.
  
  
• Rambus Renews Patent License Agreement with Panasonic (Thursday Dec. 21, 2017)
  Rambus today announced that Panasonic has renewed its patent license agreement. Under the terms of the five-year extension of Panasonic’s agreement, Rambus will license Panasonic a broad range of technologies to cover products that include SoCs with DRAM memory controllers.
  
  
• Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents (Monday Nov. 27, 2017)
  Flex Logix Technologies announced today that three interconnect patents have been issued to Cheng Wang, co-founder of Flex Logix. These patents highlight the breakthrough interconnect technology that enables Flex Logix to design eFPGA in a new process node in ~six months and achieve high densities similar to FPGA chips.
  
  
• Spin Transfer Technologies Announces Allowance of U.S. Patent For Next-Gen MRAM (Tuesday Nov. 14, 2017)
  Spin Transfer today announced allowance of a United States patent application for its Precessional Spin Current (PSC) structure for MRAM.
  
  
• HEVC Advance Announces Revised Royalty Rates for Lower-Priced Devices (Tuesday Oct. 24, 2017)
  HEVC Advance, an independent licensing administrator, today announced that it has added a discounted royalty rate category for lower-priced set-top boxes, surveillance cameras and certain other devices, and simplified its Patent License Agreement (PPL) to reduce costs for licensees.
  
  
• Tessera Files Legal Proceedings Against Samsung for Patent Infringement (Monday Oct. 02, 2017)
  Tessera Technologies, Inc. ("Tessera") and certain of its subsidiaries filed legal proceedings today against Samsung Electronics, Co., Ltd. ("Samsung") and certain of its affiliates, alleging infringement of 24 patents that cover a wide range of semiconductor processing, bonding, and packaging technologies, as well as imaging technologies.
  
  
• Conversant Announces Semiconductor Memory Patent License Agreement With Toshiba (Monday Sep. 18, 2017)
  Conversant Intellectual Property Management Inc. announced today a semiconductor memory patent license agreement with Toshiba Corporation.
  
  
• Conversant Announces Semiconductor Patent License Agreement With SK hynix (Wednesday Sep. 06, 2017)
  Conversant Intellectual Property Management Inc. announced today a semiconductor patent license agreement with SK hynix Inc. SK hynix is the global leader in producing semiconductors, such as DRAM and NAND flash and System IC, including CMOS Image Sensors.
  
  
• USITC Institutes Section 337 Investigation of Certain Mobile Electronic Devices and Radio Frequency and Processing Components Thereof (Wednesday Aug. 09, 2017)
  The U.S. International Trade Commission (USITC) has voted to institute an investigation of certain mobile electronic devices and radio frequency and processing components thereof. The products at issue in the investigation are mobile electronic devices, such as the iPhone 7, and specific components for such devices, such as baseband processor modems.