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Friday, October 17, 2025

• TSN Technology from CAST Powers Advanced Cancer Treatment

Thursday, October 16, 2025

• Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities
• MIPI Alliance Releases New Groundbreaking Audio Interface Specification for High-Bandwidth, Low-Latency Consumer Electronics, Automotive and Industrial Applications
• Ceva Leads Next Gen Location: First IP Provider to Achieve Bluetooth 6.0 Qualification with Channel Sounding, Strong Momentum with 10+ Customers
• Milestone in strengthening Europe's semiconductor manufacturing capacity under Chips Act reached
• Nordic Semiconductor simplifies cellular IoT connectivity with nuSIM solution for nRF91 Series
• Keysight Introduces Optical Automotive Ethernet Transmitter Test Solution for nGBASE-AU Standard
• Cadence Giving Foundation Announces Multi-Year Commitment to Expand the AI Hub at San José State University
• Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
• Intel's 18A production starts before TSMC’s competing N2 tech — here's how the two process nodes compare
• Samsung to buy ASML's most advanced lithography tools to rival TSMC
• Foundry Market Set to Grow as AI and Advanced Packaging Drive Demand
• GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program
• Arm and Meta Deepen Strategic Partnership to Power the Next Era of AI, from Megawatts to Milliwatts, for Billions Worldwide
• Why RISC-V + Blockchain Is the Conversation I've Been Waiting to Have
• Open Compute Project Expands Open Chiplet Economy Ecosystem

Wednesday, October 15, 2025

• Arm Sets the Standard for Open, Converged AI Data Centers

Tuesday, October 14, 2025

• Secure-IC Enables World's First PSA Level 4 Certification within Silicon Labs Series 3's Secure Vault
• Andes and Arculus System Collaborate to Integrate iPROfiler™ into AndeSysC, Expanding Virtual Platform Support for RISC-V SoC Design
• InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem

Monday, October 13, 2025

• 16-Bit 5Msps SAR ADC IP Core on 40nm Node Sets a New Benchmark in Precision and Power Efficiency
• Quintauris and Andes Technology Partner to Scale RISC-V Ecosystem
• Chips&Media Completes RTL for 'WAVE-P,' the World's First Standalone APV HW CODEC IP, Ready

Friday, October 10, 2025

• Synopsys Receives Final Regulatory Approval to Close Planned Divestitures of Synopsys Optical Solutions Group and Ansys PowerArtist
• Andes Technology Hosts First-Ever RISC-V CON in Munich, Powering Next-Gen AI and Automotive Solutions

Thursday, October 9, 2025

• Semiconductor Tech Leaks Heat Up: Latest on Samsung, SK hynix, and TSMC Trade Secret Cases
• Intel's Confidence Shows As It Readies New Processors on 18A
• 6G migration challenges
• RISC-V set to announce 25% market penetration - open-standard ISA is ahead of schedule, securing fast-growing silicon footprint
• Europe Achieves a Key Milestone with the Europe's First Out-of-Order RISC-V Processor chip, with the eProcessor Project
• Everything Is Quantum
• EU Member States back Chips Act 2.0
• Samsung May Make 2nm AI Chips for Another Client
• The Things Conference 2025: IoT Depends on an Intelligent and Secure Edge
• Keysight Enables 6G Digital Twin Research at the University of Texas at Austin
• EU funds 83 Digital Hubs with €342M to boost AI innovation
• What Meta's Purchase of Rivos Says About RISC-V
• Sumitomo Riko Leverages Ansys AI Technology to Accelerate Simulation Over 10x for Automotive Component Design and Manufacturing
• IntoPIX Accelerates Automotive Innovation With TicoRAW & JPEG XS On Lattice Low Power FPGAs
• Perceptia's pPLL08W Deployed in Production Tapeout of 5G Radio Chip for Smartphones

Wednesday, October 8, 2025

• Korea, U.S. DRAM Giants Reportedly Halt Pricing for a Week, Memory Module Makers Follow
• VeriSilicon Soars with AI Surge: Quarterly Revenue Doubles as Demand for Specialized Silicon Skyrockets