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Friday, September 5, 2025

• Global IP Core Announces the Availability of the NavIC LDPC/BCH Decoder FEC IP for Immediate Integration
• Gen 5 NVMe Host IP on AGILEX 7 R-Tile !
• Silvaco Names Chris Zegarelli as Chief Financial Officer
• Xiphera Builds Faster and More Secure Data Processing – Business Finland Supports Development
• Leader And IntoPIX Boost IP Stream Monitoring With JPEG XS Integration

Thursday, September 4, 2025

• Time-Sensitive Networking IP Core CAST RANiX Automotive Antenna System
• Synopsys Announces Expanding AI Capabilities for its Leading EDA Solutions
• IntoPIX And Arkona Technologies Double JPEG XS Densityfor Next-Generation IP Broadcast Workflows
• Andes Technology Announces D23-SE: A Functional Safety RISC-V Core with DCLS and Split-Lock for ASIL-B/D Automotive Applications
• BOS Semiconductors Introduces the Industry's First Chiplet-Based NPU Samples, Expanding Supply to Global Automotive OEMs

Wednesday, September 3, 2025

• Fraunhofer IIS receives EMMY® Award for its JPEG XS high-quality, low-latency video codec
• Chip Interfaces and Soliton Technologies jointly test their I3C Solution at MIPI Plugfest in Poland
• OPENEDGES Technology Expands ISO 26262 ASIL-B Certification to Network-on-Chip IP
• Silicon Creations Named GlobalFoundries Analog Mixed Signal IP Partner of the Year

Tuesday, September 2, 2025

• Global foundry revenue surged to $41.7 billion in Q2 2025, with TSMC capturing a record 70 percent market share
• IBM and AMD to merge AI accelerators, quantum computers, and HPC development
• TSMC hits record 70% foundry market share, making a synapse singeing $30.24 billion in revenue last quarter alone
• Synopsys Deploys AI-Optimized NVIDIA RTX PRO Servers for Advanced Simulation Workloads
• Securing the future of Terabit Ethernet: introducing the Rambus Multi-Channel Engine MACsec-IP-364

Monday, September 1, 2025

• CXL 3.1 MXC and the Future of Data Center Memory Architecture
• Rapidus 2HP Reportedly Surpasses Intel 18A Logic Density Impacted by BSPDN, Rivals TSMC
• Ethernet PHY IP Cores - Unmatched Leadership from 1G to 10G
• EXTOLL received GlobalFoundries Award for "Interface IP Partner of the Year"
• AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset

Sunday, August 31, 2025

• BOS CSO Wonju Park to Speak at 12th AI Semiconductor Forum

Friday, August 29, 2025

• ENISA to manage €36M EU Cybersecurity Reserve
• SMIC 1H25 Net Profit Rises 35.6%, 7nm Capacity Reportedly to Double in 2026
• TSMC reportedly cuts Chinese chipmaking tools from 2nm fabs as suppliers face scrutiny due to emerging new US restrictions
• GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
• Andes Technology Further Expands Long-term Collaboration with Sequans Communications with AndesCore™ A25MP and N25F RISC-V CPU Core Licenses
• Weebit Nano quadruples revenue to $4.4 million

Thursday, August 28, 2025

• Intel receives $5.7bn as Trump administration buys 10 percent stake
• GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
• TSMC's first 1.4nm chip facility ahead of schedule, initial investment could be close to $50B
• Industry’s first high-performance complementary BiCMOS technology delivers performance and power advantages for essential markets and applications
• Dnotitia Paper on Korean Cultural Dataset Accepted to ACM Multimedia 2025 Dataset Track
• Aion Silicon Joins Intel Foundry Accelerator Value Chain Alliance to Design and Deliver Best-in-Class ASIC and SOC Solutions
• Perceptia Appoints Running Springs Technology as Representative for Taiwan and China

Wednesday, August 27, 2025

• Cadence Completes Acquisition of Arm Artisan Foundation IP Business
• Arm develops low-power AI infrastructure in collaboration with Korean firms
• QuickLogic Showcases eFPGA Hard IPs at GlobalFoundries Technology Summit
• Arasan MIPI DSI-2 Rx Controller ISO 26262 ASIL-B Certification
• Chips&Media's 'WAVE' IP Successfully Enters the Global Mobile Market
• Chip Interfaces, through its JESD204C IP, supports Extoll's collaboration in the development of Eridan's next-generation ASIC
• Arteris Joins UALink Consortium to Accelerate High-Performance AI Networks Scale Up

Tuesday, August 26, 2025

• Keysight and USM Collaborate to Advance Semiconductor and Photonics Education in Malaysia
• Presto Engineering Announces New VP Sales & Marketing to Accelerate Growth in Turnkey ASIC Services
• How Smart Data Unlocks the Next Era of AI-Enhanced Design
• proteanTecs and Dream Chip Technologies Announce Collaboration to Advance Functional Safety in Automotive and HPC Markets
• Will New Ultra-High-Performance AI Inference Chips Make AI Data Centers Cost-Effective?
• HBM Innovation Outpaces Standards Development
• How Synopsys De-Risks The Road From Concept To Chip
• Rapidus Announces Strategic Collaboration with Keysight To Improve Yield and Achieve High-Precision PDK For 2nm GAA Semiconductors
• EXTOLL collaborates with ERIDAN as a Key Partner for Lowest Power High-Speed SerDes IP on GlobalFoundries 22FDX
• Intel and Trump Administration Reach Historic Agreement to Accelerate American Technology and Manufacturing Leadership
• Aion Silicon Marks Completion of Leadership Transition

Monday, August 25, 2025

• GlobalFoundries Champions 'Essential Technologies' over Moore's Law
• The Qualcomm AMR Reference Platform driven by ST Technology
• Network Interconnect IP Core: High Bandwidth, Low Power, Future-Ready for Complex Semiconductor SoCs

Sunday, August 24, 2025

• Rambus Launches MACsec-IP-364 (+363) Engine to Secure Terabit Ethernet Networks