1.8V Fault Tolerant General Purpose I/O Inline Pad Set
These 22nm libraries are available in inline and staggered CUP wire bond implementations with a flip chip option.
To design a functional I/O power domain with these cells, an additional library is required – 1.8V Support: Power. That library contains an input-only buffer, isolated analog I/O, and a full complement of power cells along with corner and spacer cells to assemble a complete pad ring by abutment. An included rail splitter allows multiple power domains to be isolated in the same pad ring while maintaining continuous VDD/VSS for robust ESD protection.
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IO IP
- TSMC 12 FFC Combo Power On Reset_POR_COMBO, IO voltage=1.8V / Core voltage=0.8V
- TSMC 12 FFC 1.2V_Power On Reset_POR12, IO voltage=1.2V
- TSMC 12 FFC 1.8V_Power On Reset_POR18, IO voltage=1.8V
- ONFI 4.1 NAND Flash Controller & PHY & IO Pads on 16nm
- ONFI 4.1 NAND Flash Controller & PHY & IO Pads on 12nm
- ONFI 4.1 NAND Flash Controller & PHY & IO Pads on 28nm