400G ultra low latency 56/112G FEC and SERDES IP sub 10ns latency
1.8V General Purpose Staggered I/O Pad Set
These libraries are offered at both 16nm and a 12nm shrink. They
are available in inline and staggered CUP wire bond implementations with a flip chip option.
To design a functional I/O power domain with these cells, an additional library is required – 1.8V Support: Power. That library contains an input-only buffer, isolated analog I/O, and a full complement of power cells along with corner and spacer cells to assemble a complete pad ring by abutment. An included rail splitter allows multiple power domains to be isolated in the same pad ring
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