Process Detector (For DVFS and monitoring process variation), TSMC 12FFC
3.3V 32kHz Oscillator IO Inline Pad Set
These 22nm libraries are available in inline and staggered CUP wire bond implementations with a flip chip option.
To utilize these cells in the pad ring, an additional library is required – 3.3V Support: Power. That library contains the DVDD/DVSS power cells necessary for ESD protection, the POC and VREF cells, and a rail splitter to isolate the oscillator in its own power domain as recommended. It also contains an input-only buffer, isolated analog I/O, and a full complement of power cells along with corner and spacer cells to assemble a complete pad ring by abutment. The rail splitter allows multiple power domains to be isolated in the same pad ring while maintaining continuous VDD/VSS for robust ESD protection.
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ESD IP
- on-chip ESD protection
- IO & ESD solutions supporting GPIO, I2C,RGMII, SD, LVDS, HDMI & analog/RF across multiple technology nodes
- High-voltage solutions in baseline TSMC and GlobalFoundries technology
- 5V ESD Clamp in GlobalFoundries 180nm LPe
- 5.5V ESD Clamp Cell and 7V HV ESD Protection
- 6.5V ESD Clamp in 180nm Technology