UCIe/BoW BlueLynx™ Dual Mode PHY and subsystem IP for chiplet interconnect

Blue Cheetah is a leader in Die-to-Die (D2D) interconnect solutions for chiplets in very advanced and low-cost packaging applications. BlueLynx™ is a revolutionary D2D subsystem architecture enabling best in class optimized Power-Performance-Area (PPA) and drastically reduces customer time-to-market.

BlueLynx™ interconnect IP subsystem includes physical (PHY) and optional link layer for chiplet interfaces and supports Universal Chiplet Interconnect Express (UCIe), OpenCompute Project (OCP) Bunch of Wires (BoW), as well as custom applications.
The BlueLynx™ link layers connect to on-die buses/Networks-on-Chip (NoCs) with various standards, including AXI4, AXI5 lite, CHI, ACE, and more.

Customers receive industry-standard ASIC integration views with reference silicon bring up platform and software required for first-pass silicon success in the shortest amount of time. Die-to-Die subsystem solutions have been delivered in over 7 different process nodes to date across multiple semiconductor foundries.

• see the entire UCIe/BoW BlueLynx™ Dual Mode PHY and subsystem IP for chiplet interconnect datasheet
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