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Deals / Success Stories News

• DVB-S2X/S2/S Demodulator IP Core licensed to a Major Chinese Semiconductor company for integration into an 8K TV SOC (Tuesday Aug. 03, 2021)
  T2MIP, the global independent semiconductor IP Cores provider and Technology experts, is pleased to announce the licensing of its partners mass production proven DVB-S2X/S2/S Narrowband Demodulator IP Core to a leading Chinese Semiconductor company for integration into its 8K TV Chipset.
  
  
• TU Dresden, University of Manchester and GlobalFoundries Announce SpiNNaker2, a Breakthrough in AI Cloud Systems, Bringing Real-Time AI with below Millisecond Latency and high Energy Efficiency to Cloud Scale (Tuesday Jul. 27, 2021)
  TU Dresden, University of Manchester and GlobalFoundries Announce SpiNNaker2, a Breakthrough in AI Cloud Systems, Bringing Real-Time AI with below Millisecond Latency and high Energy Efficiency to Cloud Scale
  
  
• CAES Receives Contract from Vinnova to Advance High Performance RISC-V Space Computing (Tuesday Jul. 20, 2021)
  CAES, a leader in advanced mission-critical electronics for aerospace and defense, announced today that it has been awarded a contract from Vinnova, a Swedish government agency dedicated to promoting innovation, to develop next generation RISC-V based space computing capabilities.
  
  
• Realtek selects Imagination GPU for use in DTV (Thursday Jul. 15, 2021)
  Imagination Technologies announces that Realtek has licensed the IMG B-Series BXE-4-32 GPU for inclusion in their latest System-on-Chip (SoC) for use in mass market Digital Television (DTV), continuing the companies’ longstanding relationship.
  
  
• Faraday Succeeds in 5G NR mmWave ASIC (Thursday Jul. 08, 2021)
  Faraday Technology today announced that it has successfully delivered 5G NR mmWave ASIC projects for small cell baseband/IF and RRU (Remote Radio Unit).
  
  
• Arteris IP FlexNoC Interconnect Again Licensed by AutoChips for Automotive SoC Product Line (Tuesday Jun. 29, 2021)
  Arteris IP today announced that Chinese automotive semiconductor vendor AutoChips has again licensed FlexNoC interconnect IP for use in automotive systems-on-chip (SoCs).
  
  
• AST & Science Selects Omni Design to Provide High Performance Data Converter Solutions for its Cellular Broadband Network (Thursday Jun. 24, 2021)
  Omni Design Technologies today announced that AST & Science, LLC, a company building the first and only space-based cellular broadband network accessible directly by standard mobile phones, has selected Omni Design to provide Analog-to-Digital Converter (ADC), Digital-to-Analog Converter (DAC) and process, voltage, and temperature (PVT) monitor IP cores that will be incorporated in the SoCs for its SpaceMobile network.
  
  
• GUC and Omni Design Tape Out 16nm LiDAR SoC (Thursday Jun. 24, 2021)
  Global Unichip Corporation and Omni Design Technologies today announced the successful tape out of a 16nm LiDAR SoC by GUC incorporating Omni Design's multi-Giga sample Analog-to-Digital Converters (ADC) and other signal chain IP cores.
  
  
• StarFive Adopts Valtrix STING for Verification of Next-generation RISC-V Processors (Wednesday Jun. 23, 2021)
  Valtrix Systems announced today that StarFive, a leading provider of RISC-V processors, platforms and solutions in China, has licensed STING for verification of the next generation of RISC-V processors.
  
  
• Socionext Licenses Flex Logix's Embedded FPGA (eFPGA) for 5G Wireless Base Station Platform (Monday Jun. 21, 2021)
  Flex Logix® Technologies, Inc. announced today that it has entered into a license agreement with Socionext, Inc. to use Flex Logix’s EFLX® 4K eFPGA in a 7nm ASIC being developed for a major communication company’s 5G platform.
  
  
• Silex Insight's TRNG selected for MiG-V from HENSOLDT Cyber (Thursday Jun. 17, 2021)
  Silex Insight, a leading provider of embedded security IP cores, has entered into an agreement with HENSOLDT Cyber, a leading developer of secure embedded systems for the IT market, to use Silex Insight’s True Random Number Generator (TRNG) as part of the highly secure RISC-V processor “Made in Germany”.
  
  
• Hardent VESA DSC and FEC IP Cores Licensed by Kinetic Technologies (Thursday Jun. 10, 2021)
  Hardent, Inc., a leading provider of video compression IP cores, today announced that Kinetic Technologies has licensed Hardent’s VESA® Display Stream Compression (DSC) and Forward Error Correction (FEC) IP for use in the new KTM5000 product family.
  
  
• Arteris IP FlexNoC Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips (Tuesday Jun. 08, 2021)
  Arteris IP today announced that Black Sesame Technologies has again licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its ISO 26262-compliant automotive advanced driver assistance systems (ADAS) chips.
  
  
• Synopsys DesignWare IP Achieves Broad Industry Adoption with Multiple First-Pass Customer Silicon Successes on TSMC's N5 Process (Tuesday Jun. 01, 2021)
  Synopsys, Inc. today announced that its broad DesignWare® Interface, Logic Library, Embedded Memory and PVT monitor IP solutions have enabled customers to achieve multiple first-pass silicon successes on TSMC's N5 process, across more than 20 leading semiconductor companies.
  
  
• Sequans Licenses CEVA 5G Modem IP for Broadband IoT Platform (Tuesday Jun. 01, 2021)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Sequans Communications, a leading provider of 5G/4G chips and modules for IoT, has licensed the PentaG 5G New Radio (NR) IP to power its upcoming 5G platform.
  
  
• Oracle adds Arm Neoverse-based cloud instances with OCI Ampere A1 (Wednesday May. 26, 2021)
  The Arm ecosystem continues to leverage the freedom to build, design, and create solutions using Arm IP, enabling a new era of computing rooted in system innovation.
  
  
• Arm partners are shipping more than 900 Arm-based chips per second based on latest results (Monday May. 24, 2021)
  Arm's silicon partners shipped a record 7.3 billion Arm-based chips (up 22% y-o-y) in the last calendar quarter of 2020, equating to more than 900 chips per second and 70 millon chips a day.
  
  
• Avery Design Systems and Rambus Extend Memory Model and PCIe VIP Collaboration (Thursday May. 20, 2021)
  Avery Design Systems, a leader in functional verification solutions, and Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, announced today they are extending their long-term memory model and PCIe® Verification IP (VIP) collaboration.
  
  
• Think Silicon and Ambiq Enable Ultra-Low Power IoT Devices with Smartphone-Class, 3D-Like Graphics (Wednesday May. 19, 2021)
  To provide high-performance, low-power graphics, Ambiq’s newest Apollo4 SoC family now incorporates Think Silicon’s NEMA®|pico GPU and NEMA®|dc display controller IP. The Apollo4 SoC family is the fourth-generation processor solution built upon Ambiq’s proprietary Subthreshold Power-Optimized Technology (SPOT™) platform.
  
  
• Intrinsic ID's SRAM PUF Deployed by Avnet ASIC Solutions to Secure Advanced SoCs (Tuesday May. 18, 2021)
  Intrinsic ID, the world’s leading provider of Physical Unclonable Function (PUF) security IP for embedded systems, today announced that Avnet ASIC Solutions (Avnet) has licensed QuiddiKey® to create a strong root-of-trust to secure System on Chip (SoC) for its customers.
  
  
• Esperanto Technologies Adopts Movellus Maestro AI, Intelligent Clock Networks for Its ET-SoC-1 Chip (Tuesday May. 04, 2021)
  Movellus, Inc. today announced that Esperanto Technologies has adopted Movellus’ Maestro AI intelligent clocking solution for its ET-SoC-1 chips.
  
  
• Flex Logix And The Air Force Research Laboratory Sign A Broad License To Use EFLX Embedded FPGA IP In GLOBALFOUNDRIES' 12LP And 12LP+ Processes (Monday May. 03, 2021)
  Flex Logix® Technologies announced today that it has signed a broad license with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) to use Flex Logix's EFLX® eFPGA IP in GLOBALFOUNDRIES 12 nm process in any US Government program and activity.
  
  
• Thalia Design Automation successfully delivers voltage regulator in a 22nm process node with 45% reduction in design time using its AMALIA software (Friday Apr. 30, 2021)
  Thalia Design Automation, a leading IP reuse company, produced a temperature invariant reference voltage to replace a bandgap within an LDO migrated to a 22nm process node, using its AMALIA software with a 45% reduction in design time for the client.
  
  
• SiFive and Samsung Foundry Extend Partnership to Accelerate AI SoC Development (Thursday Apr. 29, 2021)
  Configurable SiFive RISC-V AI SoC Development Platform is built on 14nm Samsung process technology to accelerate custom Machine Learning solutions
  
  
• Astera Labs and Avery Design Partner on CXL 2.0 Verification for Smart Retimer Portfolio to Improve Performance in Data-Centric Applications (Wednesday Apr. 28, 2021)
  Avery Design Systems, a leader in functional verification solutions, today announced that Astera Labs, a pioneer in connectivity solutions for intelligent systems, successfully used Avery’s Compute Express Link™ (CXLTM) 2.0 and PCI Express® (PCIe®) 5.0 Verification IP (VIP) and services in developing its Aries Smart Retimer portfolio.
  
  
• Achronix Adopts eMemory IP for FPGA Hardware Root of Trust (Wednesday Apr. 28, 2021)
  eMemory, the semiconductor industry’s leading NVM IP provider, has partnered with Achronix Semiconductor Corporation, a leader in FPGA-based data accelerator devices and high-performance eFPGA IP, to enhance security at the semiconductor chip level.
  
  
• Lattice and Rambus to Partner on Next-Generation Security Solutions (Tuesday Apr. 27, 2021)
  Through the partnership, customers will have access to Rambus secure hardware IP on Lattice FPGAs for communications, computing, industrial, automotive, and consumer applications.
  
  
• Anritsu Corporation Selects PLDA's PCIe Solution for its Next Generation of Handheld Spectrum Analyzers (Monday Apr. 26, 2021)
  PLDA, the industry leader in high-speed interconnect, today announced that Anritsu Corporation has selected PLDA’s PCIe Controller IP for its next generation of handheld spectrum analyzers.
  
  
• videantis and Continental sign strategic supplier contract and announce SOPs with videantis-enabled camera system (Monday Apr. 26, 2021)
  Today, the signing of the long-term-strategic partnership agreement between videantis GmbH and Continental was announced. videantis, a leading supplier of deep learning, computer vision, image processing and video coding solutions, has been working with Continental towards developing their next-generation smart rear view cameras.
  
  
• Tenstorrent Selects SiFive Intelligence X280 for Next-Generation AI Processors (Thursday Apr. 22, 2021)
  SiFive today announced that Tenstorrent, an AI semiconductor and software start-up developing next-generation computers, will license the new SiFive Intelligence X280 processor in its AI training and inference processor.