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Deals / Success Stories News

• NUVIA Selects Avery Design for Next Generation PCIe Verification (Monday Mar. 15, 2021)
  Avery Design Systems today announced NUVIA who is reimagining silicon in a new way, creating compute platforms that redefine performance for the modern data center, has deployed Avery PCIe Verification IP (VIP) for subsystem and SoC verification.
  
  
• Synopsys ARC EV Processor Enables Kyocera Document Solutions to Launch AI-enabled Multifunctional Printer SoC (Tuesday Mar. 09, 2021)
  Synopsys today announced that Kyocera Document Solutions Inc.achieved first-pass silicon success for its new multifunction product (MFP) SoC using Synopsys DesignWare® ARC® EV6x Embedded Vision Processor IP with convolutional neural network (CNN) engine and ARC MetaWare® EV Development Toolkit.
  
  
• Velodyne Lidar Licenses TSN IP Core from CAST (Monday Mar. 01, 2021)
  Velodyne Lidar, Inc., a global leader in lidar solutions for automotive and autonomous applications, selected IP from CAST to add Time-Sensitive Networking (TSN) capabilities to its sensor products.
  
  
• CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS (Wednesday Feb. 24, 2021)
  LG webOS smart TV platform, including CEVA’s intuitive point-and-click cursor control functionality, now available to 3rd party TV brands
  
  
• Tianyihexin Licenses Codasip's L30 for Powering Intelligent Wearable Device Solutions (Wednesday Feb. 24, 2021)
  Codasip announced today that Nanjing Tianyihexin Electronics, an innovative company focused on leading-edge solutions in multi-touch and gesture recognition technologies, has selected Codasip’s L30 (originally Bk3) RISC‑V‑based core for their TWS headset and intelligent wearable devices solutions.
  
  
• Eureka Technology IP Core Supports NASA's MARS 2020 Perseverance Rover Mission (Tuesday Feb. 23, 2021)
  Eureka Technology Inc. congratulates Jet Propulsion Lab (JPL) and NASA for the successful landing of the Perseverance Rover on Mars on Feb 18th 2021.
  
  
• Nations' Latest BLE 5 IC Powered By CEVA Bluetooth Low Energy IP (Tuesday Feb. 23, 2021)
  CEVA today announced that Nations Technologies Inc. ("Nations"), a leader in China's information security IC design industry, has licensed and deployed CEVA's RivieraWaves Bluetooth® low energy IP in its NZ8801 Bluetooth 5 IC designed to provide secure connectivity in a range of power sensitive devices
  
  
• Imagination's GPU selected by StarFive to create high-performance, small and low-cost BeagleV RISC-V AI single board computer (Monday Feb. 22, 2021)
  Imagination Technologies announces that StarFive, an industry-leading provider of RISC-V processors, platforms and solutions, has licensed the IMG B-Series graphics processing unit (GPU) IP to support the development of its latest RISC-V single-board computer (SBC).
  
  
• Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor (Monday Feb. 22, 2021)
  Movellus, Inc. today announced that Syntiant Corp. has adopted Movellus’ Maestro platform for its Syntiant® NDP120™ Neural Decision Processor™ (NDP), the edge AI chip company’s latest generation of special purpose semiconductors for always-on audio and sensor processing in battery-powered devices.
  
  
• Renesas to adopt Crypto Quantique's QuarkLink security platform as part of its microcontroller ecosystem for the IoT (Monday Feb. 08, 2021)
  Crypto Quantique, a specialist in quantum-driven cybersecurity for the internet of things (IoT), is collaborating with Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, to add its universal IoT security platform, QuarkLink, to the Renesas secure microcontroller ecosystem.
  
  
• Arteris IP FlexNoC Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production (Thursday Feb. 04, 2021)
  Arteris IP today announced that Socionext has implemented Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package in multiple automotive chips, including an automotive SoC fabricated using 5nm semiconductor process technology.
  
  
• Synapse Design and Flex Logix Tape Out Mutual Customer ASIC on a New Process in Less Than a Year Using Embedded FPGA (eFPGA) Technology (Monday Feb. 01, 2021)
  Flex Logix Technologies and Synapse Design Automation today announced that they have successfully taped out a new ASIC for a mutual customer using the EFLX eFPGA IP ported to a new process in less than a year.
  
  
• Intrinsic ID's QuiddiKey PUF Selected by Fungible in Drive to Secure Next Gen Data Centers (Thursday Jan. 28, 2021)
  Intrinsic ID, the world’s leading provider of Physical Unclonable Function (PUF) security IP for embedded systems, today announced that California-based data center infrastructure upstart Fungible Inc., has licensed QuiddiKey® for its Fungible DPU™ SoCs.
  
  
• Andes Technology Corp. Announces EdgeQ to Deliver Converged 5G and AI Silicon Platform with AndesCore RISC-V License for the 5G Open Radio Access Network (Wednesday Jan. 27, 2021)
  Andes Technology today announced that EdgeQ, a leading innovator in 5G base station-on-a-chip, will utilize an AndesCore™ RISC-V license to deliver industry’s first fully open and programmable 5G platform with integrated AI
  
  
• KeyASIC Inked Technologies and IP Deal of RM21Mil (Monday Jan. 25, 2021)
  Key ASIC announced today that it has inked a contract valued at RM21,000,000 for first part of the project with Canvas Technology to provide product, technology and design IP development strategy, planning and implementation for a wafer fab.
  
  
• Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC (Tuesday Jan. 19, 2021)
  T2MIP, the global independent semiconductor IP technology & SW provider, is pleased to announce the licensing of its’ partners Bluetooth Dual Mode v5.2 Software Link Layer, Protocol Stack software, Profiles and LC3 codec in combination with 22nm RF IP Core to a leading Hearables semiconductor company.
  
  
• Netflix Now Streaming xHE-AAC Audio on Android Mobile (Wednesday Jan. 13, 2021)
  Fraunhofer IIS, primary developer of the xHE-AAC audio codec, today announced that Netflix is now using the xHE-AAC audio codec. Netflix has licensed Fraunhofer’s high-quality xHE-AAC software and is using it to encode its entire catalog of TV series, documentaries and feature films across a variety of genres and languages.
  
  
• Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100 (Wednesday Jan. 13, 2021)
  The new SoC adopts the powerful Arm Cortex-X1 CPU in a tri-cluster octa-core configuration alongside the Arm Cortex-A78 CPU, as well as the Arm Mali-G78 GPU, and optimized for 5nm to support faster, better, and longer mobile experiences.
  
  
• Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs (Tuesday Jan. 12, 2021)
  Synopsys, Inc. (Nasdaq: SNPS) and Socionext, Inc. today announced their collaboration to expand Socionext's use of Synopsys' broad DesignWare® IP to include Synopsys' HBM2E IP for maximum memory throughput in AI and high-performance computing (HPC) applications.
  
  
• Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip (Tuesday Jan. 12, 2021)
  Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Hailo has licensed FlexNoC Interconnect IP and the accompanying Resilience Package for use in Hailo’s AI processor targeting automotive, smart cities, smart retail, Industry 4.0 and other markets.
  
  
• Andes Technology Provides RISC-V CPU Core to SK Telecom (Thursday Jan. 07, 2021)
  Andes Technology Corp. today announced that its 64-bit AndesCore™ AX25 RISC-V processor has been adopted by SK Telecom (hereinafter referred to as “SKT”), Korea’s leading ICT company, for the development of artificial intelligence products.
  
  
• IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors (Thursday Jan. 07, 2021)
  IQ-Analog Corporation today announced that its Full-Spectrum Conversion® wideband transceiver F1000 Antenna Processor Unit (APU) has been successfully integrated into Lockheed Martin Corporation's next generation digital prototype active electronically scanned phased array (AESA) sensor.
  
  
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip (Tuesday Jan. 05, 2021)
  Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that MegaChips has licensed Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package for use as the on-chip communications backbone for an automotive Ethernet TSN switch chip.
  
  
• Xenergic's SRAM For Next Generation Of Ultra-Low Power Products (Monday Dec. 14, 2020)
  Xenergic was selected by Bosch Sensortec to provide ultra-low power SRAM for their sensing solutions based on microelectromechanical systems (MEMS).
  
  
• Telechips selects the latest Arm IP for its next-generation automotive SoC (Monday Dec. 14, 2020)
  Arm today announced that Telechips, a leading global fabless semiconductor company specializing in automotive applications, has selected a leading-edge suite of Arm® IP for its next-generation automotive system-on-chip (SoC), the Dolphin5, which is designed for applications such as Advanced Driver-assistance Systems (ADAS) and Digital Cockpit including IVI Systems.
  
  
• CAST JPEG IP Cores Deliver Outstanding Results in the New High Resolution LXT Cameras by Baumer (Friday Dec. 11, 2020)
  CAST, Inc. has received accolades by Baumer, Ltd., one of the worldwide leading manufacturers of components for automated image processing, for its JPEG image compression IP cores that have been integrated in their new LXT camera series.
  
  
• Daiteq Selected as the First ESA NOEL-V User (Friday Dec. 11, 2020)
  Cobham Advanced Electronic Solutions (CAES), a leading provider of mission critical electronic solutions, proudly announced from the RISC-V Summit that its new NOEL-V processor model developed out of its design center, Cobham Gaisler, is in use by daiteq’s European Space Agency (ESA) research activity, “Evaluation and Instruction Set Extension of a RISC-V Soft Core for Space.”
  
  
• C-DAC Selects Valtrix STING For Design Verification Of RISC-V Based Microprocessors (Tuesday Dec. 08, 2020)
  Valtrix Systems announced today that Centre for Development of Advanced Computing (C-DAC), a premier R&D organization of Government of India, has licensed STING for the verification of RISC-V based designs being developed for use in a number of strategic sectors.
  
  
• OpenFive Licenses Flex Logix's eFPGA to Develop a Low Power Communications SoC Requiring a Large eFPGA (Monday Dec. 07, 2020)
  Flex Logix® Technologies, Inc., supplier of the fastest and most-efficient AI edge inference accelerator and the leading supplier of eFPGA IP, announced today that OpenFive, a leading provider of domain-specific custom silicon solutions with differentiated IP, has licensed the EFLXÒ eFPGA for use in a low power communications SoC, powerful and flexible enough to be used in data center and edge applications, for a mutual customer of OpenFive and Flex Logix.
  
  
• Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC (Thursday Nov. 26, 2020)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its memory compilers based on UMC’s 28nm embedded High Voltage (eHV) process technology have been subsequently used by major mobile OLED driver IC customers in multiple project tapeouts.