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Deals / Success Stories News

• Andes Technology Corp. Announces EdgeQ to Deliver Converged 5G and AI Silicon Platform with AndesCore RISC-V License for the 5G Open Radio Access Network (Wednesday Jan. 27, 2021)
  Andes Technology today announced that EdgeQ, a leading innovator in 5G base station-on-a-chip, will utilize an AndesCore™ RISC-V license to deliver industry’s first fully open and programmable 5G platform with integrated AI
  
  
• KeyASIC Inked Technologies and IP Deal of RM21Mil (Monday Jan. 25, 2021)
  Key ASIC announced today that it has inked a contract valued at RM21,000,000 for first part of the project with Canvas Technology to provide product, technology and design IP development strategy, planning and implementation for a wafer fab.
  
  
• Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC (Tuesday Jan. 19, 2021)
  T2MIP, the global independent semiconductor IP technology & SW provider, is pleased to announce the licensing of its’ partners Bluetooth Dual Mode v5.2 Software Link Layer, Protocol Stack software, Profiles and LC3 codec in combination with 22nm RF IP Core to a leading Hearables semiconductor company.
  
  
• Netflix Now Streaming xHE-AAC Audio on Android Mobile (Wednesday Jan. 13, 2021)
  Fraunhofer IIS, primary developer of the xHE-AAC audio codec, today announced that Netflix is now using the xHE-AAC audio codec. Netflix has licensed Fraunhofer’s high-quality xHE-AAC software and is using it to encode its entire catalog of TV series, documentaries and feature films across a variety of genres and languages.
  
  
• Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100 (Wednesday Jan. 13, 2021)
  The new SoC adopts the powerful Arm Cortex-X1 CPU in a tri-cluster octa-core configuration alongside the Arm Cortex-A78 CPU, as well as the Arm Mali-G78 GPU, and optimized for 5nm to support faster, better, and longer mobile experiences.
  
  
• Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs (Tuesday Jan. 12, 2021)
  Synopsys, Inc. (Nasdaq: SNPS) and Socionext, Inc. today announced their collaboration to expand Socionext's use of Synopsys' broad DesignWare® IP to include Synopsys' HBM2E IP for maximum memory throughput in AI and high-performance computing (HPC) applications.
  
  
• Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip (Tuesday Jan. 12, 2021)
  Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Hailo has licensed FlexNoC Interconnect IP and the accompanying Resilience Package for use in Hailo’s AI processor targeting automotive, smart cities, smart retail, Industry 4.0 and other markets.
  
  
• Andes Technology Provides RISC-V CPU Core to SK Telecom (Thursday Jan. 07, 2021)
  Andes Technology Corp. today announced that its 64-bit AndesCore™ AX25 RISC-V processor has been adopted by SK Telecom (hereinafter referred to as “SKT”), Korea’s leading ICT company, for the development of artificial intelligence products.
  
  
• IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors (Thursday Jan. 07, 2021)
  IQ-Analog Corporation today announced that its Full-Spectrum Conversion® wideband transceiver F1000 Antenna Processor Unit (APU) has been successfully integrated into Lockheed Martin Corporation's next generation digital prototype active electronically scanned phased array (AESA) sensor.
  
  
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip (Tuesday Jan. 05, 2021)
  Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that MegaChips has licensed Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package for use as the on-chip communications backbone for an automotive Ethernet TSN switch chip.
  
  
• Xenergic's SRAM For Next Generation Of Ultra-Low Power Products (Monday Dec. 14, 2020)
  Xenergic was selected by Bosch Sensortec to provide ultra-low power SRAM for their sensing solutions based on microelectromechanical systems (MEMS).
  
  
• Telechips selects the latest Arm IP for its next-generation automotive SoC (Monday Dec. 14, 2020)
  Arm today announced that Telechips, a leading global fabless semiconductor company specializing in automotive applications, has selected a leading-edge suite of Arm® IP for its next-generation automotive system-on-chip (SoC), the Dolphin5, which is designed for applications such as Advanced Driver-assistance Systems (ADAS) and Digital Cockpit including IVI Systems.
  
  
• CAST JPEG IP Cores Deliver Outstanding Results in the New High Resolution LXT Cameras by Baumer (Friday Dec. 11, 2020)
  CAST, Inc. has received accolades by Baumer, Ltd., one of the worldwide leading manufacturers of components for automated image processing, for its JPEG image compression IP cores that have been integrated in their new LXT camera series.
  
  
• Daiteq Selected as the First ESA NOEL-V User (Friday Dec. 11, 2020)
  Cobham Advanced Electronic Solutions (CAES), a leading provider of mission critical electronic solutions, proudly announced from the RISC-V Summit that its new NOEL-V processor model developed out of its design center, Cobham Gaisler, is in use by daiteq’s European Space Agency (ESA) research activity, “Evaluation and Instruction Set Extension of a RISC-V Soft Core for Space.”
  
  
• C-DAC Selects Valtrix STING For Design Verification Of RISC-V Based Microprocessors (Tuesday Dec. 08, 2020)
  Valtrix Systems announced today that Centre for Development of Advanced Computing (C-DAC), a premier R&D organization of Government of India, has licensed STING for the verification of RISC-V based designs being developed for use in a number of strategic sectors.
  
  
• OpenFive Licenses Flex Logix's eFPGA to Develop a Low Power Communications SoC Requiring a Large eFPGA (Monday Dec. 07, 2020)
  Flex Logix® Technologies, Inc., supplier of the fastest and most-efficient AI edge inference accelerator and the leading supplier of eFPGA IP, announced today that OpenFive, a leading provider of domain-specific custom silicon solutions with differentiated IP, has licensed the EFLXÒ eFPGA for use in a low power communications SoC, powerful and flexible enough to be used in data center and edge applications, for a mutual customer of OpenFive and Flex Logix.
  
  
• Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC (Thursday Nov. 26, 2020)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its memory compilers based on UMC’s 28nm embedded High Voltage (eHV) process technology have been subsequently used by major mobile OLED driver IC customers in multiple project tapeouts.
  
  
• SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge (Thursday Nov. 19, 2020)
  SiMa.ai™, the machine learning company enabling high performance compute at the lowest power, today announced the adoption of low-power Arm® compute technology to build its purpose-built Machine Learning SoC (MLSoC™) platform.
  
  
• Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products (Wednesday Nov. 18, 2020)
  SiFive and Bouffalo Lab today announced the adoption of SiFive E2-Series Core IP based on RISC-V as part of Bouffalo’s new IoT Bluetooth, Zigbee, Thread and WiFi products, the BL70x and BL602.
  
  
• Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications (Tuesday Nov. 17, 2020)
  T2M-IP, the global independent semiconductor IP Cores & Technology provider, is pleased to announce the licensing of its Ultra-low power Multi-Constellation GNSS Digital IP for integration into a NB-IOT SoC for lOT logistical and wearable applications.
  
  
• CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC (Wednesday Nov. 11, 2020)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).
  
  
• Imagination's new BXS GPU enables automotive graphics in Texas Instruments processor family (Wednesday Nov. 04, 2020)
  Imagination Technologies announces that its BXS-4-64 GPU will be included in Texas Instruments (TI) Jacinto™ processor families for automotive applications. BXS offers up to 60% higher performance for automotive graphics applications, like surround view technology, thanks to its bespoke design for the automotive market needs.
  
  
• Arteris IP FlexNoC Interconnect Products Licensed by Bosch for Multiple Automotive Chips (Tuesday Nov. 03, 2020)
  Arteris IP today announced that Bosch has licensed Arteris FlexNoC Interconnect IP and the accompanying Resilience Package for use in multiple ISO 26262-compliant automotive projects.
  
  
• NeuLinker Licenses Codasip Bk5 and Studio for Powering Innovative AI and Blockchain Solutions (Tuesday Nov. 03, 2020)
  Codasip GmbH, the leading supplier of customizable RISC-V® embedded processor IP, announced today that NeuLinker, a high-profile Beijing-based company focused on cutting-edge custom computing technologies, has selected Codasip’s Bk5 RISC-V-based core and the Codasip Studio customization toolset for their AI and security-powering solutions.
  
  
• Telink and Andes Announce the TLSR9 SoC with RISC-V Processor (Monday Nov. 02, 2020)
  Telink Semiconductor and Andes Technology are proud to introduce the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series.
  
  
• Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Processor (Thursday Oct. 29, 2020)
  Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, in collaboration with design services provider, VeriSilicon, has successfully supported the on-time market launch of AI Edge computing startup Blaize’s hardware platform, despite the COVID-19 pandemic.
  
  
• Realtek Semiconductor Selects Allegro DVT's H.266/VVC Compliance Streams (Thursday Oct. 29, 2020)
  Allegro DVT today announced that Realtek Semiconductor, one of the world’s largest and most successful fabless semiconductor companies, has selected Allegro DVT’s VVC test streams and will be used to ensure compliance of Realtek’s products with the new emerging VVC video compression standard.
  
  
• Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor (Tuesday Oct. 27, 2020)
  Mixel®, a leading provider of mixed-signal intellectual property (IP), and Hercules Microelectronics (HME), a China-based developer of programmable FPGA cores, announced today that Mixel’s MIPI® IP solution has been successfully integrated into HME-H1D03 FPGA and is in mass production.
  
  
• Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade (Thursday Oct. 22, 2020)
  Collaboration with IBM Research's AI Hardware Center Addresses the Challenges of Developing New AI Chip Architectures with Innovative Design Methodologies
  
  
• Storage system based on WD 100Gb NVMe-oF Bridge ASIC with ePHY IP (Wednesday Jan. 29, 2020)