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Deals / Success Stories News

• Arteris IP Ncore Cache Coherent Interconnect Licensed by Bitmain for Sophon TPU Artificial Intelligence (AI) Chips (Tuesday Jul. 09, 2019)
  Arteris IP today announced that Bitmain has licensed Arteris Ncore Cache Coherent Interconnect IP for use in its next-generation Sophon Tensor Processing Unit (TPU) systems-on-chip (SoCs) for the scalable hardware acceleration of artificial intelligence (AI) and machine learning (ML) algorithms.
  
  
• MorningCore Technology License CEVA DSP for High Performance Wireless and Automotive Communication Platforms (Wednesday Jun. 26, 2019)
  CEVA announced today that MorningCore Technology Co., Ltd, a subsidiary of China Information and Communication Technologies Group Corp (CICT), has licensed and deployed the CEVA-XC DSP in its family of software-defined radio (SDR) processors and platforms targeting high performance 4G/5G wireless and cellular vehicle-to-everything (C-V2X) applications.
  
  
• Arteris IP FlexNoC Interconnect Implemented in Uhnder Digital Automotive Radar-on-Chip (Tuesday Jun. 25, 2019)
  Arteris IP today announced that Uhnder’s new automotive radar-on-chip (RoC) uses the Arteris FlexNoC IP as the on-chip interconnect.
  
  
• Vidatronic Licenses Power Management Unit and Analog IP to Leading Semiconductor IP Company, Arm (Thursday Jun. 20, 2019)
  Vidatronic, Inc., a leading provider of analog, power management unit (PMU) and CMOS radio frequency (RF) Intellectual Property (IP) licenses, today announced that they will provide PMU and analog IP cores to multinational semiconductor and software design company, Arm, for use in their solutions.
  
  
• Nurlink Completes First Call on Commercial NB-IoT Network with its CEVA-powered eNB-IoT SoC (Wednesday Jun. 19, 2019)
  Nurlink Completes First Call on Commercial NB-IoT Network with its CEVA-powered eNB-IoT SoC June 19, 2019 Successful over-the-air call completed on China Telecom NB-IoT network with NK6010 Cat-NB2 SoC based on CEVA-Dragonfly NB2 IP MOUNTAIN VIEW, Calif. and SAN DIEGO, June 19, 2019 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, and Nurlink Technology, Inc., a fabless IC design company specializing in cellular IoT wireless communications, today announced the successful completion of the first over-the-air (OTA) call on China Telecom's NB-IoT network using the Nurlink NK6010 NB-IoT System-on-Chip (SoC). The test was carried out in Nanjing, China, with the Nurlink SoC connecting to China Telecom's Cloud IoT Platform over the NB-IoT network. It represents an important milestone towards the mass market production of Nurlink's CEVA-Dragonfly NB2 based SoC. "We are immensely proud to complete our first over-the-air call on one of the world's most-advanced NB-IoT networks in less than 15 months after beginning our SoC design," said Dr. Xiaohua Kong, Nurlink CEO. "The CEVA-Dragonfly NB2 platform, along with CEVA's excellent technical support, provided the solid foundation that enabled us to achieve this milestone so quickly." "CEVA is committed to ensuring that NB-IoT is the long-range connectivity 'standard-of-choice' for IoT devices by offering a comprehensive NB-IoT IP solution that significantly lowers the entry barriers for companies looking to integrate this technology into their SoC designs," said Ange Aznar, Vice President and General Manager of the Wireless IoT Business Unit at CEVA. "Nurlink's latest milestone is highly impressive and represents a strong endorsement of both the excellence of their engineering team and of the capabilities of our CEVA-Dragonfly NB2 IP to rapidly advance NB-IoT SoC design." NK6010 is an ultra-low cost and power-efficient NB-IoT SoC designed specifically for narrowband connectivity in mass market IoT devices such as smart meters, wearables, asset trackers and industrial sensors. Built based on the CEVA-Dragonfly NB2 solution, the SoC incorporates RF front-end, RF transceiver, cellular baseband, power management unit and application processor, to minimize the chip size and cost of the solution. It supports full NB-IoT frequency bands with major global carriers, ensuring smooth and rapid certification of devices on any NB-IoT commercial network around the world. The SoC also includes an extremely low-power multi-GNSS subsystem, which supports GPS/Beidou/Galileo/GLONASS global navigation systems. This subsystem allows fast positioning while also supporting highly-accurate device tracking. NK6010 is currently undergoing testing with operators worldwide and expected to enter mass production later this year. The CEVA-Dragonfly NB2 IP solution is a modular technology, composed of the CEVA-X1 IoT processor, an optimized RF Transceiver, baseband, and a protocol stack to offer a complete Release 14 Cat-NB2 modem IP solution that significantly reduces time-to-market and lowers entry barriers. It is a fully software-configurable solution and can be extended with multi-constellation GNSS and sensor fusion functionality. The IP includes a reference silicon of the complete modem design, including an embedded CMOS RF transceiver and PA, an advanced digital front-end, physical layer firmware, and a protocol stack (MAC, RLC, PDCP, RRC, and NAS). For more information, visit https://www.ceva-dsp.com/product/dragonfly. Join CEVA at #MWC19 Shanghai, June 26-28, and experience the full suite of CEVA connectivity and smart sensing IPs. For more information, visit https://www.ceva-dsp.com/event/mwc-shanghai-2019/. About Nurlink Nurlink Technology, founded in 2017, is a fabless IC design company with subsidiaries and offices in California, Nanjing, Shenzhen, Beijing, and Hong Kong. Leveraging its world-class talents in RF analog, modem, GNSS, and SoC systems and software, Nurlink Technology commits to delivering the best RF/SoC chips for powering the next-generation cellular IoT wireless communications, i.e. mMTC, while enhancing significant cost and performance advantages for customers. The current product portfolio from Nurlink Technology includes NB-IoT and cat-M SoCs, serving numerous markets including smart meter, smart city, wearables, asset tracking, and more. For more information visit http://www.nurlink.com. About CEVA, Inc. CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and cellular IoT (NB-IoT and Cat-M) enabled devices, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi (Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac) and Wi-Fi 6 (802.11ax) up to 4x4). Visit us at www.ceva-dsp.com
  
  
• Astera Labs Verifies Its System-Aware PCI Express 5.0 Smart Retimer Using Avery Design Systems PCIe 5.0 Verification IP (Tuesday Jun. 18, 2019)
  Avery Design Systems, leader in functional verification solutions today announced that Astera Labs successfully utilized Avery's Peripheral Component Interconnect PCI Express® (PCIe®) 5.0 Verification IP and services to verify its breakthrough system-aware PCIe 5.0 Smart Retimer.
  
  
• Achronix Selects Moortec's 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA (Tuesday Jun. 18, 2019)
  Moortec announced today that Achronix Semiconductor Corporation have chosen Moortec’s 7nm Embedded Temperature Sensor IP to optimise performance and increase reliability for the company’s Speedster®7t FPGAs
  
  
• Arteris IP FlexNoC Interconnect Licensed by Achronix for New Speedster7t FPGA family (Tuesday Jun. 18, 2019)
  Arteris IP today announced that Achronix Semiconductor Corporation has licensed Arteris FlexNoC interconnect IP for use in its new Speedster7t FPGA family.
  
  
• Telechips selects PowerVR GPU for Automotive (Tuesday Jun. 18, 2019)
  Imagination Technologies’ PowerVR Series9XTP has been selected by Telechips, a global fabless semiconductor company for connectivity and multimedia in automotive and smart homes, for use in its in-vehicle infotainment (IVI) and vehicle cockpit solutions
  
  
• Toshiba Selects Cadence Tensilica Vision P6 DSP as Image Recognition Processor for its Next-Generation ADAS Chip (Thursday Jun. 13, 2019)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) announced today that Toshiba has implemented the Cadence® Tensilica® Vision P6 DSPs for its next-generation automotive SoC to meet functional safety requirements.
  
  
• Silicon-Proven Arteris IP Ncore Cache Coherent Interconnect Implemented in Toshiba ISO 26262-Compliant ADAS Chip (Tuesday Jun. 11, 2019)
  Arteris IP today announced that Toshiba has taped out its next generation automotive advanced driver assistance system (ADAS) chip using the Arteris IP Ncore Cache Coherent and FlexNoC®non-coherent interconnect with the associated Resilience Package.
  
  
• Marvell Extends Strategic Partnership with Arm (Tuesday Jun. 11, 2019)
  Marvell today announced it has entered a broader strategic partnership with Arm, a subsidiary of SoftBank Group, to accelerate the design and development of next-generation Marvell® ThunderX® server processor technology. This new agreement includes dedicated Arm support for Marvell’s R&D in the server processor technology area for at least three more years.
  
  
• SiFive Celebrates Historic 100 Design Win Milestone (Friday Jun. 07, 2019)
  SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, announced today that it has secured its 101st design win.
  
  
• SolidRun and Gyrfalcon Team Up to Accelerate On-Device AI Performance with Powerful New i.MX 8M Mini SOM (Wednesday Jun. 05, 2019)
  SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, today introduces its i.MX 8M Mini System on Module (SOM) with robust processing power and Gyrfalcon’s artificial intelligence acceleration technology.
  
  
• Achronix Chooses Rambus GDDR6 PHY IP for Next-Generation FPGA (Tuesday Jun. 04, 2019)
  Rambus Inc. (NASDAQ: RMBS) today announced that Achronix, a leader in FPGA-based hardware data acceleration devices and high-performance eFGPA IP, has selected the Rambus GDDR6 PHY for its next-generation Speedster7t FPGA family.
  
  
• ASPEED Technology adopts M31 Technology MIPI D-PHY IP to provide global 360-degree imaging SoC solution (Tuesday Jun. 04, 2019)
  M31 Technology (Taiwan stock code: 6643), a global silicon Intellectual Property (IP) boutique, and ASPEED Technology Inc., world-leader in BMC (Baseboard Management Controller) System-on-Chips (Taiwan stock code: 5274) announced today that the two sides will establish a long-term partnership.
  
  
• UltraSoC embedded analytics selected to support Wave Computing's TritonAI 64 IP platform (Monday Jun. 03, 2019)
  UltraSoC today announced that Wave Computing has chosen the company’s embedded analytics and heterogeneous debug technology to test its new TritonAI 64 scalable IP platform for intelligent SoCs (systems on chip).
  
  
• Synopsys Design and Verification Solutions Enable Astera Labs to Develop Industry's First PCIe 5.0 Retimer SoC (Thursday May. 30, 2019)
  Synopsys today announced that Astera Labs successfully utilized Synopsys' Fusion Design Platform™, Verification Continuum™ Platform, and Design Services to develop its breakthrough connectivity technology for next-generation servers, all running on Amazon Web Services (AWS).
  
  
• Pixilica Licenses SiFive's RISC-V Embedded Processor IP (Thursday May. 30, 2019)
  SiFive, the leading provider of commercial RISC-V processor IP, today announced that Pixilica has licensed SiFive's Series 2 RISC-V embedded processors for use in Pixilica's embedded systems designs.
  
  
• Efinix and M31 Technology Corporation Partner to Address Demand for Emerging AI Edge Computing Requirements (Thursday May. 30, 2019)
  Efinix®, an innovator in programmable product platforms and technologies, and M31 Technology Corporation (Taiwan stock code: 6643), a global silicon Intellectual Property (IP) boutique, today announced a technology partnership to address demand for emerging AI edge computing requirements.
  
  
• Mixel MIPI D-PHY IP Integrated into Teledyne e2v Snappy CMOS Image Sensors (Wednesday May. 29, 2019)
  Mixel® Inc., a leader in mixed-signal intellectual property (IP), and Teledyne Imaging, a leader in sensor, signal generation, and image processing, today announced that Mixel MIPI® IP has been successfully integrated into Teledyne e2v Snappy 2-Megapixel and 5-Megapixel CMOS Image Sensor IC products.
  
  
• MVSILICON License and Deploy CEVA Bluetooth IP in its latest Wireless Audio Platform (Wednesday May. 22, 2019)
  CEVA today announced that Shanghai Mountain View Silicon Co., Ltd. (MVSILICON), a fabless semiconductor company serving audio processing, wireless and IoT applications, has licensed and deployed CEVA’s RivieraWaves Bluetooth Dual Mode IP in its latest BP1048 audio processor SOC targeting wireless audio applications including home audio, automotive and smart speakers.
  
  
• Fraunhofer IIS Licenses MPEG-H Audio Patents to LG Electronics (Wednesday May. 22, 2019)
  Fraunhofer IIS is pleased to announce the licensing of its MPEG-H Audio patents to LG Electronics Inc., allowing LG to produce products which feature MPEG-H Audio
  
  
• Faraday Geared Up for Data Communication Applications in ASIC Development (Tuesday May. 21, 2019)
  Faraday Technology today announced its achievement in delivering more than 10 successful projects in the Data Communication market. These projects, implemented primarily on UMC 28nm HPC and 40nm LP, cover applications such as access, aggregation switches, server adaptors, and home gateways.
  
  
• INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash (Monday May. 20, 2019)
  Dolphin Integration, a leading provider of semiconductor IP, announced today that INGChips, a fabless semiconductor company that focuses on ultra low power IoT wireless SoC, has selected Dolphin Integration’s comprehensive set of Power Management IPs for INGChips’ Bluetooth Low-Energy (BLE) SoC in 40 nm with embedded Flash memory.
  
  
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS (Tuesday May. 14, 2019)
  Arteris IP today announced that Black Sesame Technologies has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its next-generation automotive advanced driver assistance systems (ADAS) that utilize advanced artificial intelligence (AI) algorithms for autonomous driving capabilities.
  
  
• Moortec Support Canaan Creatives Mass Production ASIC on TSMC 7nm Process (Monday May. 13, 2019)
  Moortec are proud to have helped Canaan Creative achieve mass production on TSMC’s 7nm process of their ASIC by utilising Moortec’s complete In-Chip Monitoring Subsystem IP for Process, Voltage and Temperature Sensing in the design.
  
  
• Fudan Microelectronics Group Selects Synopsys' DesignWare Bluetooth IP for Smart IoT System-on-Chips (Tuesday May. 07, 2019)
  Synopsys, Inc. (Nasdaq: SNPS) today announced that Fudan Microelectronics Group has selected Synopsys' silicon-proven DesignWare® Bluetooth 5.0 Controller and PHY for its ultra-low-power general-purpose microcontrollers (MCUs) for IoT applications.
  
  
• Arteris IP FlexNoC & Resilience Package Licensed by Semidrive for ISO 26262-Compliant Autonomous Driving Chips (Tuesday May. 07, 2019)
  Arteris IP today announced that Semidrive has licensed the Arteris IP FlexNoC Interconnect and the accompanying FlexNoC Resilience Package for use in chips that are the brains in automotive autonomous driving and advanced driver assistance systems (ADAS).
  
  
• OPENEDGES NoC (Network on Chip) Interconnect IP & DDR Controller licensed by ASICLAND (Monday May. 06, 2019)
  OPENEDGES Technology, Inc., the world’s leading supplier of Memory Subsystem IP including Network On-Chip (NoC) and DDR Controller today announced that ASICLAND has licensed OICTM NoC Interconnect IP and OMCTM DDR Controller IP for artificial intelligence, data center, automotive & other applications.