D&R Headline News | Most Popular | SoC News Alerts | |

Deals / Success Stories News

• eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC (Tuesday Mar. 12, 2019)
  Menta today announced that its eFPGA IP has been selected by Beijing Chongxin Communication Company to enable flexibility in baseband SoCs designed for 5G NR pico cell applications.
  
  
• Arteris IP FlexNoC Interconnect Licensed by Silicon Mobility for OLEA ISO 26262 ASIL-D Automotive FPCU (Tuesday Mar. 12, 2019)
  Arteris IP today announced that Silicon Mobility has licensed Arteris FlexNoC interconnect IP for use in its range of OLEA® FPCU products as part of its SILant® ASIL-D functional safety integrated architecture.
  
  
• CEVA Computer Vision, Deep Learning and Long Range Communication Technologies Power DJI Drones (Tuesday Mar. 12, 2019)
  CEVA today announced that the latest generation of Mavic 2 camera drones from DJI, the world's leader in civilian drones and aerial imaging technology, deploy CEVA DSPs and platforms to enable on-device artificial intelligence, advanced computer vision and long-range communication capabilities.
  
  
• Cobham Gaisler's HiRel GR712RC processor was launched on February 21, 2019 onboard the SpaceIL mission to the Moon (Wednesday Mar. 06, 2019)
  Cobham Gaisler’s HiRel GR712RC processor was launched on February 21, 2019 onboard the SpaceIL mission to the Moon. SpaceIL, an Israeli non-profit organization, assisted by Israel Aerospace Industries (IAI), has constructed the Beresheet lunar lander and launched it atop a SpaceX Falcon 9 rocket from Cape Canaveral Air Force Station on February 21, 2019.
  
  
• Arteris IP FlexNoC Interconnect Licensed by Lynxi Technologies for Artificial Intelligence (AI) Chips (Wednesday Mar. 06, 2019)
  Arteris IP today announced that Lynxi Technologies has licensed Arteris IP FlexNoC Interconnect for use in its high-performance neural network processing chips.
  
  
• Intrinsic ID's Scalable Hardware Root of Trust IP Delivers Device Authentication for IoT Security in NXP LPC Microcontroller Portfolio (Monday Mar. 04, 2019)
  Intrinsic ID, the world’s leading provider of digital authentication technology for Internet of Things security, today announced that NXP® Semiconductors has integrated Intrinsic ID’s IoT security technology in its LPC55Sxx family of secure microcontrollers.
  
  
• Inside Secure Selected by ATsolutions to Provide Market-Leading Code Protection for its Banking and Credit Card Apps (Thursday Feb. 28, 2019)
  Inside Secure today announced that ATsolutions, one of Korea’s largest banking app solution providers, licensed the Inside Secure Code Protection solution to safeguard cryptographic keys and algorithms inside mobile apps used by a number of leading banks and credit card companies in Korea.
  
  
• KEPCO Partners with Inside Secure to Further Bolster Protection for Latest Chips Used in IoT Devices (Thursday Feb. 28, 2019)
  Inside Secure today announced that Korea Electric Power Corporation (KEPCO) recently signed a Memorandum of Understanding (MOU) to partner with Inside Secure to provides unparalleled, yet cost-effective levels of security for some of the company’s latest chipsets specifically designed for the IoT market.
  
  
• Inside Secure Selected by HiSilicon to Protect Device Secrets throughout Manufacturing Process (Thursday Feb. 28, 2019)
  Inside Secure – at the heart of security solutions for mobile and connected devices, today announced that HiSilicon, a leading fabless semiconductor company, selected the Inside Secure Provisioning Platform.
  
  
• Chips&Media announced licensing of Image Signal Processing (ISP) to one of leading SoC developer targeting advanced automotive applications such as ADAS and Autonomous Driving (Wednesday Feb. 27, 2019)
  Chips&Media reported signing a contract to provide CARPO (Image Signal Processing) and KERBEROS (Lens Distortion Correction) to a leading developer for advanced automotive application SoCs, marking important milestone as the inception of Chips&Media's Image Processing IPs for automotive segment.
  
  
• Graphcore Selected 16nm FinFet ESD Solutions from Sofics for its Transformative Artificial Intelligence Processor (Tuesday Feb. 26, 2019)
  Graphcore, the technology company that has developed a completely new type of processor, the Intelligence Processing Unit (IPU), which lets artificial intelligence (AI) innovators create next generation AI applications, selected TakeCharge® technology from Sofics bvba of Belgium to protect its Colossus GC2 IPU from electrostatic discharge (ESD). Sofics is a leading semiconductor integrated circuit IP provider.
  
  
• DinoplusAI Partners with SiFive to Develop Mission-Critical AI Processor Platform for High Performance Processing with Ultra-Low Latency (Tuesday Feb. 26, 2019)
  SiFive today announced that it was selected by DinoplusAI, an innovator in artificial intelligence (AI) processors and software for high performance mission-critical applications, to develop its mission-critical AI processor platform, which is optimized for ultra-low latency applications, such as data centers, 5G/edge cloud and autonomous vehicles.
  
  
• Nurlink Launches NB-IoT and GNSS SoC Powered by CEVA-Dragonfly NB2 IP (Wednesday Feb. 20, 2019)
  NK6010 Rel.14 Cat-NB2 all-in-one SoC integrates baseband, RF FE, RF TxRx, PMU, GNSS and application processor, delivering ultra-low power, low cost cellular IoT solution compatible with all NB-IoT frequency bands and major global carriers
  
  
• Autotalks and CEVA Collaborate on World's First Global V2X Solution (Tuesday Feb. 19, 2019)
  In advance of MWC19™, CEVA and Autotalks announced today that the companies collaborated to add C-V2X Rel. 14/15 support to the CEVA-XC DSP based Autotalks chipset, making it the world's first and only available solution capable of supporting both DSRC and C-V2X direct communications.
  
  
• Andes Technology Records 1 Billion SoC Shipments in 2018 Based on Its CPU IP and 3.5 Billion Since Inception (Thursday Feb. 14, 2019)
  As the first public listed CPU IP company in Asia, specializing in low-power, high-performance 32/64-bit processor IP cores and SoC platform, Andes Technology Corporation (TWSE:6533) announced an extraordinary record of 1 billion annual SoC shipments containing its CPU IP in 2018.
  
  
• Silicon Creations' PLL Technology Contributes to the First 7nm Mass Production Mining Chip (Wednesday Feb. 13, 2019)
  Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced that its phase-locked loop (PLL) technology has been deployed in Canaan Creative’s 7nm mining chip.
  
  
• TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs (Monday Feb. 11, 2019)
  TDK-Micronas, a TDK group company and the most preferred partner for sensing and control, has renewed its trust in Dolphin Integration’s low power and dense RAM and ROM for its 3D Hall magnetic sensor products.
  
  
• New intoPIX FlinQ Image Technology Empowers Next Generation DM NVX Network AV (Thursday Feb. 07, 2019)
  intoPIX, the leading provider of innovative image processing and video compression technologies developed a new codec called FlinQ in partnership with Crestron, the global leader of workplace and advanced smart homes technology.
  
  
• Audinate adds intoPIX best-in-class JPEG2000 Technology to new Dante AV Product Design Suite (Wednesday Feb. 06, 2019)
  intoPIX, leading provider of innovative image processing technologies for professional media applications, announced today that Audinate, leading provider of professional digital audio networking technologies, will use intoPIX’s ProAV optimized ultra-low-latency JPEG 2000 technology within their new Dante AV Design Suite™ for use with the newly announced Dante AV Module™.
  
  
• MuxLab Leverages intoPIX's Ultra Low Latency JPEG 2000 to Manage 4K60 on 1GbE Networks (Tuesday Feb. 05, 2019)
  intoPIX announced today that MuxLab, a forerunner and manufacturer of AV over IP connectivity and distribution solutions, is adopting their JPEG 2000 Ultra Low Latency technology for future AV over IP products.
  
  
• Arteris IP FlexNoC Interconnect Used by NationalChip for Set Top Box (STB) Chips (Tuesday Feb. 05, 2019)
  Arteris IP today announced that NationalChip has successfully produced satellite and terrestrial digital TV set top box (STB) systems-on-chip (SoC) using Arteris FlexNoC interconnect IP as the on-chip communication backbone.
  
  
• FABU Technology Selects Synopsys' DesignWare IP Portfolio to Deliver Intelligence in ADAS and Autonomous Driving SoCs (Monday Feb. 04, 2019)
  Synopsys and FABU Technology Co., Ltd. today announced that FABU has selected a portfolio of silicon-proven Synopsys DesignWare® Interface, Security, ARC® EM Safety Island Processor, and Embedded Memory Test and Repair IP to deliver high-performance artificial intelligence (AI) system-on-chips (SoCs) for advanced automotive applications.
  
  
• Sital's Enhanced Reliability FPGA IP powers NASA's GEDI on board communications (Thursday Jan. 31, 2019)
  100% of GEDI internal and external MIL-STD-1553B links are implemented with the Sital BRM1553ERL FPGA IP Core. The Sital BRM1553ERL is a space grade FPGA IP core qualified by NASA and has specialized built in mechanism to handle harsh radiation environments with direct impact on electronics and memory behavior.
  
  
• GOWIN Semiconductor Licenses Intrinsic ID's BroadKey to Deliver Hardware Root of Trust for IoT Security (Thursday Jan. 24, 2019)
  GOWIN Semiconductor and Intrinsic ID today announced GOWIN has licensed Intrinsic ID’s BroadKey, an SRAM PUF-based key management system with integrated crypto libraries.
  
  
• Inomize is selected to develop and supply HP Indigo next generation ASIC for Digital Press (Wednesday Jan. 23, 2019)
  Inomize, a world leader of ASIC design services was selected by HP Indigo to develop an ASIC solution for their next generation of high-resolution industrial presses.
  
  
• Arteris IP FlexNoC Interconnect Licensed by NETINT Technologies for PCIe 4.0 Enterprise SSD Controllers (Tuesday Jan. 22, 2019)
  Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that NETINT Technologies has licensed Arteris IP FlexNoC Interconnect for use in its enterprise SSD storage system controllers with on-chip video processors.
  
  
• MorningCore Technology Licenses Flex Logix's Embedded Field-Programmable Gate Array on TSMC's 12FFC Process (Monday Jan. 21, 2019)
  Flex Logix Technologies, Inc., announced today that MorningCore Technology, a subsidiary of China telecommunications giant Datang, is licensing EFLX4K eFPGA for TSMC’s 12nm FinFET Compact technology (12FFC) process and the EFLX Compiler for programming the eFPGA.
  
  
• Arteris IP FlexNoC Interconnect Licensed by Baidu for Kunlun AI Cloud Chips for Data Center (Tuesday Jan. 15, 2019)
  Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Baidu has licensed Arteris IP FlexNoC Interconnect for use in its high-performance Kunlun AI cloud chip for data center.
  
  
• Habana Labs Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using DesignWare IP (Monday Jan. 14, 2019)
  Synopsys, Inc. (Nasdaq: SNPS) today announced that Habana Labs, Ltd. has achieved first-pass silicon success for its Goya™ inference processor system-on-chip (SoC) using DesignWare® Controller and PHY IP Solutions for PCI Express® 4.0.
  
  
• IDT Licenses Intrinsic ID's QuiddiKey Hardware Root of Trust for IoT Security (Monday Jan. 14, 2019)
  Intrinsic ID, the world’s leading provider of digital authentication technology for Internet of Things security, today announced Integrated Device Technology, Inc. (IDT), has licensed QuiddiKey, based on SRAM PUF technology, for security in its wireless charging products.