Foundries News

• Rockchip and SMIC in Commercial Production of 65-nm Multimedia Chips (Monday Nov. 29, 2010)
  Rockchip today announced that its design of a high-end digital-analog mixed SOC chip has successfully entered into commercial production at Semiconductor Manufacturing International Corporation using SMIC's 65-nm Low-Power process.
  
  
• TSMC Obtains Termination of ITC Investigation into 37nm and Smaller Products (Wednesday Nov. 17, 2010)
  TSMC announced today that it was able to secure a favorable resolution to an International Trade Commission investigation for alleged patent infringement by its 28 nm process technology.
  
  
• SMIC and Brite Semiconductor Collaborate to Provide Integrated IC Design and Manufacturing Services (Monday Nov. 15, 2010)
  SMIC today announced an agreement to invest in Brite Semiconductor, a Shanghai-based IC design and turnkey service company. The agreement allows Brite to provide customers with complete semiconductor design and manufacturing solutions based upon SMIC’s leading foundry and IP technology.
  
  
• TSMC October 2010 Sales Report (Thursday Nov. 11, 2010)
  TSMC today announced its net sales for October 2010: On an unconsolidated basis, net sales were approximately NT$37.37 billion, an increase of 2 percent over September 2010 and an increase of 28.1 percent over October 2009.
  
  
• Shortlink and LFoundry in RF and Mixed-Signal IP Partnership (Wednesday Nov. 10, 2010)
  Shortlink AB and Landshut Silicon Foundry GmbH today announced a partnership agreement to provide Shortlink low power RF and mixed-signal custom IP in LFoundry’s industry leading LF150 modular 150nm CMOS process technology. The Shortlink IP offering will include SRD transceivers, RF receivers and transmitters, PLL, VCO, ADC, DAC and amplifiers.
  
  
• SMIC Reports Third Quarter 2010 Results (Thursday Nov. 04, 2010)
  SMIC today announced its consolidated results of operations for the three months ended September 30, 2010. Revenue up by 7.6% to $410.1 million in 3Q10 from $381.1 million in 2Q10 and up by 26.8% compared to 3Q09.
  
  
• TowerJazz Raises $100 Million in Debentures Offering (Thursday Nov. 04, 2010)
  TowerJazz today announced the completion of its previously announced fundraising in Israel, following a public tender executed today resulting in excess demand of 150%.
  
  
• TSMC Reports Third Quarter EPS of NT$1.81 (Thursday Oct. 28, 2010)
  TSMC today announced consolidated revenue of NT$112.25 billion, net income of NT$46.94 billion, and diluted earnings per share of NT$1.81 (US$0.28 per ADR unit) for the third quarter ended September 30, 2010.
  
  
• Dongbu HiTek Accelerates Drive into Automotive Electronics ICs Winning AEC-Q100 Certifications for Process Technologies and IP (Wednesday Oct. 27, 2010)
  Dongbu HiTek today confirmed that it has fully qualified its advanced 180nm Mixed-Signal (MS180) Process and EEPROM Intellectual Property (IP) to meet the rigorous quality/reliability criteria set forth in the automotive AEC-Q100 'Grade 0' standard.
  
  
• GLOBALFOUNDRIES Expands Design Services Ecosystem with Three New Partners (Wednesday Oct. 13, 2010)
  GLOBALFOUNDRIES today introduced three newly certified design services companies as part of its GLOBALSOLUTIONS partner ecosystem. Infotech Enterprises Limited, Verisilicon, and Wipro Limited have joined GLOBALSOLUTIONS.
  
  
• TowerJazz and Crocus Complete First Stage Integration of TAS MRAM into 130nm CMOS Platform (Monday Oct. 11, 2010)
  TowerJazz and Crocus Technology today announced the successful completion of the first stage of integration of Crocus' Thermally Assisted Switching (TAS)-based MRAM technology into TowerJazz's 0.13-micron CMOS process.
  
  
• TSMC September 2010 Sales Report (Friday Oct. 08, 2010)
  TSMC today announced its net sales for September 2010: On an unconsolidated basis, net sales were approximately NT$36.65 billion, an increase of 0.4 percent over August 2010 and an increase of 30.8 percent over September 2009.
  
  
• Ensphere Leverages TowerJazz's 0.18-micron SiGe BiCMOS Process to Achieve Fully Integrated One Chip Optical Transceiver IC (Thursday Oct. 07, 2010)
  TowerJazz today announced that Ensphere Solutions has chosen the foundry’s 0.18-micron SiGe BiCMOS process (SBC18) for its fully integrated one chip optical transceiver IC (ESI-1002) targeting 10G data communication and storage area network applications.
  
  
• TSMC Expands IP Alliance to Include Soft IP (Tuesday Oct. 05, 2010)
  TSMC today expanded its IP Alliance to incorporate a soft IP program that will improve soft IP readiness for advanced technology nodes and drive earlier time-to-market.
  
  
• CEA-Leti Makes a R&D 20nm Fully Depleted SOI Process available through CMP (Friday Oct. 01, 2010)
  CEA-Leti and CMP (Circuits Multi Projets ®) announced the launch of an Exploratory MPW (Multi Project Wafers) initiative based on FDSOI (Fully Depleted SOI) 20nm process, opening the access of its 300mm infrastructure to the design community.
  
  
• TSMC gets nod for 130-nm production in China (Friday Oct. 01, 2010)
  The Taiwan government has approved Taiwan Semiconductor Manufacturing Co. Ltd.'s application to upgrade its 200-mm fab in Shanghai, China to 0.13-micron technology, according to a report from Reuters.
  
  
• IBM 'fab club' denies problems with high-k (Tuesday Sep. 28, 2010)
  Members of IBM Corp.'s technology alliance, namely GlobalFoundries Inc. and Samsung Electronics Co. Ltd., dismissed a report that the group is struggling with its high-k/metal-gate technology.
  
  
• First IBM Technology for Power-Management Chips Holds Promise for Breakthroughs in Alternative Energy (Monday Sep. 20, 2010)
  IBM today announced innovative new chip-making technology for power-management semiconductors – the company’s first foray into a segment seen as critical to the development of alternative energy sources, smart buildings and new consumer devices.
  
  
• TSMC August 2010 Sales Report (Friday Sep. 10, 2010)
  TSMC today announced its net sales for August 2010: on an unconsolidated basis, net sales were approximately NT$36.5 billion, an increase of 0.9 percent over July 2010 and an increase of 26.3 percent over August 2009.
  
  
• Toppan Completes 22nm and 20nm Production Photomask Process through Toppan-IBM Joint Development (Thursday Sep. 09, 2010)
  Toppan Printing Co., Ltd. today announced that it has developed a photomask manufacturing process at its facility in Asaka, Japan, to support 22nm and 20nm semiconductor device production. This process was developed through Toppan’s ongoing joint development project with IBM. Toppan is ready to support 22nm and 20nm photomask prototyping as well as production for leading-edge semiconductor manufacturing customers.
  
  
• UMC: 2010 August Monthly Sales Revenue (Tuesday Sep. 07, 2010)
  UMC: 2010 August Monthly Sales Revenue
  
  
• Report: Micron to take over SMIC fab (Monday Sep. 06, 2010)
  Micron Technology Inc. is in talks to take over the operations of Semiconductor Manufacturing International Corp.'s 300-mm fab in Wuhan, China, according to a report from the Commericial Times.
  
  
• GLOBALFOUNDRIES Lays Out Path for Sustained Technology Leadership at 28nm and Beyond (Thursday Sep. 02, 2010)
  At today’s inaugural Global Technology Conference, GLOBALFOUNDRIES revealed the latest details of its progress in technology development for the 28nm technology generation and beyond. The company announced the addition of a new technology offering based on its 28nm High-K Metal Gate (HKMG) technology and revealed for the first time its manufacturing timeline for the 22/20nm node.
  
  
• GLOBALFOUNDRIES and Freescale Partner to Develop 90nm Flash Memory Technology (Thursday Sep. 02, 2010)
  GLOBALFOUNDRIES and Freescale Semiconductor announced plans to bring a new class of thin film storage (TFS) flash memory products to market on 90nm technology. The advanced technology is expected to be deployed in Freescale microcontrollers (MCUs) targeted for applications ranging from consumer electronics and household appliances to medical devices and smart metering systems.
  
  
• TowerJazz Announces Closing of a Definitive Agreement with its Lender Banks to Refinance and Reduce Its Debt to Improve Its Balance Sheet and Cash Flows (Tuesday Aug. 17, 2010)
  TowerJazz today announced that it has signed and closed a definitive agreement with its lender banks. According to the agreement, approximately $160 million of principal amount were extended and scheduled to be paid in 10 quarterly installments commencing the third quarter of 2013 and ending in the fourth quarter of 2015.
  
  
• TSMC July 2010 Sales Report (Tuesday Aug. 10, 2010)
  TSMC today announced its net sales for July 2010: on an unconsolidated basis, net sales were approximately NT$36.16 billion, an increase of 3.0 percent over June 2010 and an increase of 19.4 percent over July 2009.
  
  
• SMIC Reports Results for the Three Months Ended June 30, 2010 (Tuesday Aug. 10, 2010)
  SMIC today announced its consolidated results of operations for the three months ended June 30, 2010. Revenue up by 8.4% to $381.1 million in 2Q10 from $351.7 million in 1Q10 and up by 42.5% compared to 2Q09.
  
  
• SMIC 65-nm Technology Successfully Moves to Volume Production (Wednesday Aug. 04, 2010)
  SMIC announced today that its Low Leakage 65-nanometer (nm) technology, implemented at SMIC's 300mm facility in Beijing, has successfully moved to Volume Production Stage. The 65-nm accumulative wafer shipment has achieved over 10,000 pieces since its mass production began in Q3 2009.
  
  
• TSMC Reports Second Quarter EPS of NT$1.55 (Thursday Jul. 29, 2010)
  TSMC today announced consolidated revenue of NT$104.96 billion, net income of NT$40.28 billion, and diluted earnings per share of NT$1.55 (US$0.24 per ADS unit) for the second quarter ended June 30, 2010.
  
  
• TSMC Begins Construction on Gigafab In Central Taiwan (Friday Jul. 16, 2010)
  TSMC today held a groundbreaking ceremony in Taichung’s Central Taiwan Science Park for Fab 15, TSMC’s third 12-inch (300mm) Gigafab and an important milestone in the company’s pledge to expand investment in Taiwan.