Foundries News

• Tower Semiconductor Reports Fourth Quarter and Fiscal Year 2008 Financial Results (Thursday Feb. 19, 2009)
  Record annual revenue of $251.7 million, representing year-over-year growth of 9 percent; EBITDA of $36 million and positive annual cash flow from operations
  
  
• Lime Microsystems selects Jazz Semiconductor's 0.18-micron SiGe process for its Configurable Multi-band, Multi-standard Transceiver Targeting WCDMA, CDMA, LTE and WiMAX Femtocells (Wednesday Feb. 18, 2009)
  Lime Microsystems’ proprietary technology combined with Jazz Semiconductor’s 0.18-micron SiGe BiCMOS process has enabled the development of a single-chip multi-band, multi-standard broadband transceiver IC with outstanding RF performance.
  
  
• Tower Semiconductor and Triune Systems to Collaborate on Power Management Platform (Wednesday Feb. 11, 2009)
  Through this collaboration, the companies will design and develop intellectual property (IP) for Tower’s 0.18-micron Bipolar-CMOS-DMOS (BCD) process to deliver a family of low and high voltage power management products and IP for a variety of applications to enable faster design cycles and lower cost designs.
  
  
• SMIC Reports 2008 Fourth Quarter Results (Friday Feb. 06, 2009)
  Overall revenue decreased to $272.5 million in 4Q08, down 27.5% QoQ from 3Q08 due to a 25.1% decrease in wafer shipments.
  
  
• TSMC Information -- TSMC currently has no plans to conduct a capital reduction (Tuesday Feb. 03, 2009)
  TSMC would like to correct the inaccuracies stated in a report by the Economic Daily News on February 3, 2009 regarding capital reduction.
  
  
• TSMC Reports Fourth Quarter EPS of NT$0.48 (Thursday Jan. 22, 2009)
  Year-over-year, fourth quarter revenue decreased 31.2% while net income and diluted EPS decreased 63.9% and 62.3%, respectively. Compared to third quarter of 2008, fourth quarter results represent a 30.6% decrease in revenue, a decrease of 59.3% in net income, and a decrease of 59% in diluted EPS.
  
  
• SMIC Releases Preliminary Version of Three 65-Nanometer Standard Cell Libraries (Wednesday Jan. 21, 2009)
  SMIC today announced the preliminary release of three in-house 65-nanometer standard cell libraries. The libraries include a high performance Very High Speed (VHS) library, a density and performance optimized High Speed (HS) library, and a power management kit (PMK) for the High Speed (HS) library.
  
  
• TSMC December 2008 Sales Report (Friday Jan. 09, 2009)
  TSMC today announced its net sales for December 2008: on an unconsolidated basis, sales were NT$13,161 million, a decrease of 31.8 percent from November 2008 and a decrease of 54.8 percent from December 2007.
  
  
• UMC Reports Sales for December 2008 (Thursday Jan. 08, 2009)
  UMC today reported unaudited net sales for the month of December 2008
  
  
• Tower Semiconductor Receives $20 Million of Cash Investment from Israel Corp. (Thursday Jan. 08, 2009)
  Tower Semiconductor today announced a $20 million cash investment in the Company by Israel Corp, pursuant to the agreement between the parties announced on September 25, 2008.
  
  
• TSMC November 2008 Sales Report (Wednesday Dec. 10, 2008)
  TSMC today announced its net sales for November 2008: on an unconsolidated basis, sales were NT$19,295 million, a decrease of 32.0 percent from October 2008 and a decrease of 36.0 percent from November 2007.
  
  
• UMC Revised 4Q08 Guidance and Reports Sales for November 2008 (Tuesday Dec. 09, 2008)
  UMC today revised downward its 4Q08 guidance and reported unaudited net sales for the month of November 2008.
  
  
• SMIC Achieves First 45-nanometer Silicon Success (Monday Dec. 08, 2008)
  SMIC today announced its first 45-nanometer yield lot, signifying a working 45nm process. This first silicon success comes less than one year after SMIC signed an agreement with International IBM to license its low-power and high-performance bulk CMOS technologies in December 2007.
  
  
• austriamicrosystems Expands CMOS, High-Voltage, High-Voltage Flash and RF Multi Project Wafer Service for Foundry Customers (Monday Dec. 08, 2008)
  austriamicrosystems’ business unit Full Service Foundry expands its cost-efficient and speedy ASIC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, in 2009 with a more extensive schedule
  
  
• Tower Semiconductor Continues Execution of $60 Million per Year Cost Reduction Plan (Tuesday Dec. 02, 2008)
  Announced Today a Reduction in Force of 280 Jobs, Comprised of 200 in Tower and 80 in Jazz
  
  
• TSMC's Fourth-Quarter Business Guidance Revised (Monday Dec. 01, 2008)
  The company now expects fourth-quarter revenue to be between NT$63 billion and NT$65 billion, lower than the previous expectation of between NT$69 billion and NT$71 billion.
  
  
• UMC Advances its High-k/Metal-Gate Process Solution (Tuesday Nov. 25, 2008)
  This achievement is a first key-step in demonstrating technology performance and process reliability for HK/MG technology, which will be used for UMC's next generation 32/28nm process.
  
  
• TSMC Ramps 40nm Volume Production to Promote Innovation as Foundries Assume a Larger Role for $300 Billion Industry (Monday Nov. 17, 2008)
  TSMC today announced volume production of the first semiconductor foundry 40nm logic manufacturing process with the successful ramp of its 40 nanometer (nm) General Purpose (G) and Low Power (LP) versions.
  
  
• Tower Semiconductor Reports Third Quarter 2008 Financial Results (Thursday Nov. 13, 2008)
  Achieved Revenue of $58.5 Million, Second Highest Quarterly Revenue in Company’s History
  
  
• Jazz Licenses Its RF Design Enablement Technology to Fujitsu Microelectronics, Providing Time-to-Market Advantage for 90nm and 65nm RF CMOS Customers (Thursday Nov. 13, 2008)
  The alliance between Fujitsu and Jazz enables both companies to deliver high-performance Customer Owned Tooling (COT) foundry services to SoC customers for products developed using the Fujitsu low-leakage, leading-edge LSI manufacturing process at the company's 300mm Mie fab in Japan.
  
  
• TSMC October 2008 Sales Report (Monday Nov. 10, 2008)
  TSMC today announced its net sales for October 2008: on an unconsolidated basis, sales were NT$28,371 million, an increase of 0.4 percent over September 2008 and a decrease of 10.6 percent from October 2007.
  
  
• Datang Holdings to Invest US$172 Million in SMIC (Monday Nov. 10, 2008)
  SMIC and Datang Holdings Pursue a Strategic Alliance Which Enhances Their International Competitiveness by Leveraging Both Companies’ Resources and the Rapid Development of TD-SCDMA 3G Business in China
  
  
• TSMC Adds New High Voltage Features to Advanced 0.13-micron Processes Aimed at High Resolution Display Drivers (Wednesday Nov. 05, 2008)
  The high-yield process features an Aluminum Copper (AlCu) backend metal scheme and is designed to meet energy reduction targets, while responding to the market’s demand for smaller line width options, reducing die size in next-generation high-resolution display driver ICs.
  
  
• UMC Announces Foundry Industry's First 28nm SRAMs (Monday Oct. 27, 2008)
  UMC utilized advanced double-patterning immersion lithography and strained silicon technology to produce the chips, which feature very small six-transistor SRAM cell sizes of approximately 0.122 um2.
  
  
• SMIC Received U.S. Export Licenses for 32nm Technologies (Monday Oct. 27, 2008)
  SMIC today announced that SMIC would officially enter the 32nm technology era in January 2009.
  
  
• SMIC Successfully Developed 0.11 Micron CIS Process Technology (Thursday Oct. 23, 2008)
  SMIC today announced that it has successfully developed a 0.11 micron CMOS image sensor (CIS) process technology.
  
  
• UBIDYNE Selects JAZZ Semiconductor's 0.18-micron SiGe BICMOS process to develop world's first pure digital radio system (Wednesday Oct. 15, 2008)
  Ubidyne’s Micro-Radio Enables Mobile Infrastructure Equipment Vendors Worldwide to Significantly Improve Performance, Flexibility and Coverage
  
  
• HDIC Cooperates with SMIC for Successful Debut of High Definition TV Transmission Chips during Beijing Olympic Games (Tuesday Oct. 14, 2008)
  SMIC and HDIC recently cooperated on SMIC's 0.13um process to manufacture demodulator chips based on China's terrestrial digital TV standard.
  
  
• MAPPER and TSMC Take Next Step in Exploring Multiple E-beam Lithography for IC Manufacturing at 22 nanometer node and Beyond (Monday Oct. 13, 2008)
  MAPPER Lithography and TSMC signed an agreement, according to which MAPPER will ship its first 300 mm multiple-electron-beam maskless lithography platform for process development and device prototyping to TSMC
  
  
• Fujitsu Microelectronics, e-Shuttle and D2S to Develop Maskless ICs (Thursday Oct. 09, 2008)
  Fujitsu, e-Shuttle and D2S, today announced an agreement under which FML and e-Shuttle will adopt D2S' advanced design for e-beam (DFEB) technology-starting with a 65-nm Low Power (LP) library-to result in the creation of test silicon to refine and validate DFEB technology for the 65-nm, 40-nm and below nodes.