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IP / SOC Products News

• AImotive's aiWare3 Hardware IP Helps Drive Autonomous Vehicles To Production (Wednesday Oct. 31, 2018)
  AImotive™, the global provider of full stack, vision-first self-driving technology, today announced the release of aiWare3™, the company's 3rd generation, scalable, low-power, hardware Neural Network (NN) acceleration core.
  
  
• Arteris IP Announces New FlexNoC 4 Interconnect IP with Artificial Intelligence (AI) Package (Wednesday Oct. 31, 2018)
  Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced the new Arteris IP FlexNoC version 4 interconnect IP and the companion AI Package.
  
  
• Synopsys Enhances DesignWare Memory Test and Repair Solution for Embedded MRAM (Tuesday Oct. 30, 2018)
  Synopsys, Inc. (Nasdaq: SNPS) today announced that the DesignWare® STAR Memory System™ solution offers new memory built-in self-test (BIST), repair, and diagnostic capabilities for embedded MRAM (eMRAM)-based designs, with initial support for GLOBALFOUNDRIES (GF) eMRAM on the 22FDX® process.
  
  
• PLDA and MegaChips announce a cooperation to design PCIe controllers and PCIe PHY IP on TSMC's 16nm Process Technology (Monday Oct. 29, 2018)
  PLDA, the industry leader in PCI Express® IP solutions and MegaChips, a global semiconductor company specializing in ASIC Solution Services, today announced their collaboration to design a combined PCIe Controller IP and PHY IP solution.
  
  
• Silex Insight releases IPsec as a hardware block to accelerate IoT, cloud, or edge servers (Friday Oct. 26, 2018)
  Silex Insight, leading provider of IP cores for secure computing, is excited to announce that is has released the BA454, an extremely scalable and flexible hardware accelerator implementing the IPsec security protocol. BA454 has been conceived to provide security to high-throughput, time-critical applications, for example in data centers or servers at the heart of IoT, cloud, or edge networks.
  
  
• DVB-RCS2 Satellite Modulator IP Core from Creonic Now Available (Thursday Oct. 25, 2018)
  Creonic GmbH, the market leader in Satellite Communications IP cores, announced today, the general availability of its latest IP core. The DVB-RCS2 modulator allows to implement a return channel over satellite and provides the capability to operate in MF-TDMA systems.
  
  
• eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing (Thursday Oct. 25, 2018)
  eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today that its 7nm 56G long-reach SerDes is now available for licensing. eSilicon will demonstrate the SerDes during SuperCompute 2018 in Dallas, Texas on November 12-15.
  
  
• Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families (Thursday Oct. 25, 2018)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of its third-generation 32-bit RX CPU core, the RXv3. The RXv3 CPU core will be employed in Renesas’ new RX microcontroller (MCU) families that begin rolling out at the end of 2018.
  
  
• Synopsys Announces Fastest, Most Power Efficient DDR5 and LPDDR5 IP Solutions (Wednesday Oct. 24, 2018)
  Synopsys today announced new DesignWare® Memory Interface IP solutions supporting the next-generation DDR5 and LPDDR5 SDRAMs. The DDR5 and LPDDR5 IP significantly increase memory interface bandwidth compared to DDR4 and LPDDR4 SDRAM interfaces, while reducing area and improving power efficiency.
  
  
• Cadence Accelerates Next-Generation Cloud Datacenter Infrastructure with Industry's First Silicon-Proven, Long-Reach 7nm 112G SerDes IP (Monday Oct. 22, 2018)
  Cadence today unveiled the industry’s first silicon-proven, long-reach 112G SerDes IP in 7nm. The Cadence® 7nm 112G PAM-4 SerDes IP delivers industry-leading power, performance and area (PPA) efficiency required to build high-port density networking products for next-generation cloud-scale and telco datacenters.
  
  
• Dolphin Integration unveils a new RAM dedicated to IoT and Low Power MCU applications in 55 nm, GLOBALFOUNDRIES LPx process (Monday Oct. 22, 2018)
  The race toward the lowest power consumption and the longest battery life is faster than ever with regards to IoT devices, and particularly for Bluetooth Low Energy and Low Power MCU.
  
  
• eMemory's OTP IP Qualified on 22nm FD-SOI process (Wednesday Oct. 17, 2018)
  eMemory today announced that its one-time programmable non-volatile memory (OTP) IP, NeoFuse, has been qualified for 22nm Fully-Depleted Silicon On-Insulator (FD-SOI), also known as 22FDX, process technology.
  
  
• Arm Neoverse: The modern cloud to edge infrastructure foundation for a world of a trillion intelligent devices (Tuesday Oct. 16, 2018)
  Today at Arm TechCon, Arm disclosed details on a dedicated roadmap and new brand of infrastructure-class IP for 5G networks and next-generation cloud to edge infrastructure.
  
  
• OPENEDGES unveils world-first Memory Subsystem IP solution coupling Network-on-Chip (NoC) interconnect with DDR memory controller (Tuesday Oct. 16, 2018)
  OPENEDGES, the leading IP provider in smart computing, announced its release of cutting-edge ORBITTM Memory Subsystem IP solution combining Network-on-Chip (NoC) interconnect and DDR memory controller.
  
  
• QuickLogic Announces Silicon-Proven ArcticPro eFPGA on GLOBALFOUNDRIES 22FDX Process (Tuesday Oct. 09, 2018)
  QuickLogic today announced the availability of silicon-proven and ready-to-use ultra-low power ArcticPro™ eFPGA technology on GLOBALFOUNDRIES 22FDX® (FD-SOI) process technology.
  
  
• Andes Announces over 1.2 GHz RISC-V Cores Series at 28nm: A25/AX25 and N25F/NX25F (Monday Oct. 08, 2018)
  Andes Technology, a founding member of the RISC-V Foundation and the leading Taiwan-based supplier of 32/64-bit embedded CPU cores with solutions serving in excess of 2.5-Billion SoCs covering a wide range of applications, today announced the availability of the latest four members of the AndeStar™ V5 high efficiency processor series.
  
  
• Northwest Logic and Mixel Delivering C-PHY/D-PHY Combo MIPI IP Solution (Thursday Oct. 04, 2018)
  Northwest Logic and Mixel® announced today that their MIPI® CSI-2SM and DSI-2SM solutions which utilize MIPI C-PHY SM / D-PHY SM have been deployed and silicon proven in 28nm, 40nm, 55nm and 65nm process nodes. These high performance, low power, cost effective solutions contain controllers from Northwest Logic and PHYs from Mixel.
  
  
• Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC N7+ FinFET Process (Thursday Oct. 04, 2018)
  Synopsys, Inc. (Nasdaq: SNPS) today announced a collaboration with TSMC to develop a broad portfolio of DesignWare® Interface IP, Logic Libraries and Embedded Memories for the TSMC N7+ FinFET process.
  
  
• Omnitek Demonstrates Highest Performance Convolutional Neural Network on an FPGA (Thursday Oct. 04, 2018)
  Omnitek today announced immediate availability of the highest performance CNN on an FPGA, achieving over 50% higher performance than any competing CNNs and out-performing GPUs for a given power or cost budget.
  
  
• Silicon Creations Highlights PLL Developments in 22nm, 12nm, 7nm, and 5nm at TSMC OIP Ecosystem Forum (Tuesday Oct. 02, 2018)
  Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a wide variety of IP offerings in TSMC’s 5FF, 7FF, 7FF+, 12FFC, and 22ULP/ULL process nodes, designed to support customer’s SoC timing demands.
  
  
• M31 Technology's Diversified TSMC 28HPC+ ULL Memory Compilers Empower More Flexible SoC Design Architecture (Tuesday Oct. 02, 2018)
  M31 Technology Corporation (Taiwan stock code: 6643), a global Silicon Intellectual Property (IP) boutique, today announced that it has developed a diversified TSMC 28HPC + Ultra-Low Power (ULL) Memory Compiler IP portfolio that provides customers with more flexibility in their SoC design.
  
  
• Arm expands design possibilities with free Cortex-M processors for Xilinx FPGAs (Monday Oct. 01, 2018)
  Today at the Xilinx Developer Forum in San Jose, Arm has announced it is collaborating with Xilinx, the market leader in FPGAs, to bring the benefits of Arm Cortex-M processors to FPGA through the Arm DesignStart program, providing scalability and a standardized processor architecture across the Xilinx portfolio.
  
  
• Synopsys Delivers Automotive-Grade IP in TSMC 7-nm Process for ADAS Designs (Monday Oct. 01, 2018)
  Synopsys today announced delivery of automotive-grade DesignWare® Controller and PHY IP for TSMC's 7-nanometer (nm) FinFET process. The DesignWare LPDDR4x, MIPI CSI-2 and D-PHY, PCI Express® 4.0, and security IP implement advanced automotive design rules for TSMC 7-nm process to meet the stringent reliability and operation requirements of ADAS and autonomous driving system-on-chips (SoCs).
  
  
• Dolphin Integration accelerates the development of energy-efficient SoCs for Arm-based secure IoT devices (Monday Oct. 01, 2018)
  Dolphin Integration today announced it is collaborating with Arm to make embedded and Internet of Things (IoT) devices more efficient. By combining a set of low-power and high-efficiency voltage regulators with a range of Arm-based IoT System-on-Chip (SoC) solutions, Dolphin aims to accelerate the cost-effective design of secure, smart and energy-efficient SoCs.
  
  
• T2M announces its first Image Signal Processing (ISP) Technology for advanced mobile camera applications (Friday Sep. 28, 2018)
  T2M, the world’s largest independent global semiconductor IP provider, announced the launch of its first low-power digital image processor IP designed to perform advanced image correction and enhancement, resulting in superior image quality in today’s multi-megapixel cameras.
  
  
• M31 MIPI M-PHY is certified with ASIL-B safety level of ISO 26262 to provide safe and reliable automotive SoC design (Thursday Sep. 27, 2018)
  M31 Technology announced today that its MIPI M-PHY Gear3 IP has been certified with the ASIL B safety level of ISO 26262 and will be used by international first-class automotive electronics manufacturers to provide safe and reliable automotive SoC design.
  
  
• Arm announces new flagship IP and safety program for automotive (Wednesday Sep. 26, 2018)
  The Cortex-A76AE is a game-changing new CPU uniquely designed for automotive and optimized for 7nm process nodes. AE stands for “Automotive Enhanced” and any Arm IP with the AE designator will include specific features addressing the requirements of in-vehicle processing.
  
  
• Spectral introduces NeuralRAM, memory architectures in 14nm FinFET tech node targeted for a wide range of AI algorithms (Wednesday Sep. 26, 2018)
  Spectral Design & Test Inc. (SDT) today announced rolling out a family of Memory IP on the GlobalFoundries 14nm FinFET process that addresses the needs of the new Artificial Intelligence (AI), Machine Learning and Deep Learning SoC applications.
  
  
• Imagination and GLOBALFOUNDRIES Collaborate to Deliver Ultra-Low-Power Connectivity Solutions for IoT Applications (Tuesday Sep. 25, 2018)
  Imagination Technologies and GLOBALFOUNDRIES (GF) announced today a joint collaboration to provide ultra-low-power baseband and radio frequency (RF) solutions for Bluetooth Low Energy® (BLE) and IEEE 802.15.4 technology, using Imagination’s Ensigma connectivity IP on GF’s 22nm FD-SOI (22FDX®) platform.
  
  
• Renesas Expands Access to Robust Portfolio of IP Licenses (Thursday Sep. 20, 2018)
  Renesas Electronics Corporation today announced it is expanding access to its extensive portfolio of intellectual property (IP) licenses that allow designers to meet a broad range of customized customer requirements in a rapidly changing industry.