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IP / SOC Products News

• PLDA and Analog Bits Partner to Provide a Silicon-proven PCIe 3.0 Solution for leading 28nm low power process (Monday Mar. 02, 2015)
  PLDA has added Analog Bits, the semiconductor industry’s leading provider of mixed-signal IP, to its ecosystem of PHY partners. Together, the partners have developed a silicon-proven PCIe Gen 3 solution for a leading 28nm low-power process node that offers ASIC engineers great power savings and improved performance.
  
  
• Shikino Launches Still Image Decoder IP Obtaining "World-class speed" 16X faster image processing (Monday Mar. 02, 2015)
  Shikino developed this still image decoder IP which has the world’s first image processing performance, 16X speed (16 data/clock), in the JPEG decompression with high bit depths (8-bit/10-bit/12-bit). The product is most suitable for the mobile/broadcasting/ medical/aerospace fields and so forth.
  
  
• Altera and Escape Communications Announce High-capacity Turn-key Modem Solution for E- and V-band Microwave Radios (Friday Feb. 27, 2015)
  Altera and Escape Communications today announced the availability of a high-performance, cost-effective and scalable microwave modem solution that that enables rapid system development and accelerates production shipments for microwave backhaul and fronthaul applications.
  
  
• Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process (Wednesday Feb. 25, 2015)
  Cadence today announced that its multi-protocol Serializer/Deserializer (SerDes) PHY IP for PCI Express® (PCIe®) 2.0 and PCIe 3.0 technology for TSMC’s 16nm FinFET Plus (16FF+) process have passed PCI-SIG® compliance testing.
  
  
• Blu Wireless to demonstrate HYDRA gigabit modem IP targeted at mmWave communication (Wednesday Feb. 25, 2015)
  Blu Wireless announces the successful validation of the lead implementation in 40nm CMOS of its HYDRA IP. Blu Wireless’s HYDRA gigabit modem is aimed at millimetre wave communication applications including ‘WiGig’ 802.11ad and wireless Back Haul for LTE mobile networks.
  
  
• CEVA Brings Human-Like Intelligent Vision Processing to Low-Power Embedded Systems (Wednesday Feb. 25, 2015)
  CEVA today unveiled the CEVA-XM4, its fourth-generation imaging and vision processor IP. Building on the success of the CEVA-MM3101, the CEVA-XM4 is equipped with specific functionality required to solve the most critical challenges faced when implementing energy-efficient human-like vision and visual perception capabilities in embedded systems.
  
  
• Tronics Expands its Business Model to Mobile and Wearable Applications with the Licensing of its Combo Sensors Based on Disruptive Magelan and M&NEMS Technologies (Wednesday Feb. 25, 2015)
  Tronics has stepped up its strategic deployment by providing the industry with the most advanced solutions for mobile and wearable applications. This key milestone enables the Company to offer state of the art products and technologies to new players in high volume markets.
  
  
• Xilinx and Xylon Announce New Industry Leading Automated Multi-Camera Image Stitching IP for 2D/3D Surround View Systems (Tuesday Feb. 24, 2015)
  Xilinx and Xylon today announced new industry leading automated multi-camera image stitching IP for 2D/3D surround view systems. The Automotive logiADAK 3.0 Advanced Driver Assistance Development Kit with logiOWL IP enables on-target, full vehicle level multi-camera calibration in seconds for Tier One automotive electronics suppliers and OEM automakers.
  
  
• Silicon Vision and Mindtree Enable Next Generation IoT Devices with Bluetooth Smart 4.2 (Tuesday Feb. 24, 2015)
  Silicon Vision Technologies Ltd. a low power wireless intellectual property (IP) company and Mindtree a global technology services company announced the availability of fully integrated Bluetooth Smart 4.2 solution that includes Silicon Vision’s silicon proven, Bluetooth SIG certified Radio Transceiver IP and Mindtree’s qualified Bluetooth Smart v4.2 link layer, protocol stack and profiles.
  
  
• New 80251 Microcontroller IP Core Available from CAST is the World's Fastest 8051-Compatible (Monday Feb. 23, 2015)
  A new 16-bit 80251 microcontroller IP core shipping now from CAST, Inc. runs 69.7 times faster than the original 8051 chip, making it the highest performance MCS®51 instruction set compatible IP core currently available.
  
  
• Flex Logix Technologies Introduces EFLX: an FPGA Core for Upgrading Silicon (Monday Feb. 23, 2015)
  Flex Logix Technologies today introduced EFLX, an innovative FPGA (field programmable gate array) core that allows chip makers and equipment manufacturers to update normally fixed functions in silicon at will. The company’s technology platform enables significant new customer benefits by dramatically reducing design and manufacturing risks, accelerating technology roadmaps and bringing greater flexibility to hardware.
  
  
• Smart Power Metering: Dolphin Integration first Silicon IP provider to announce range 1/5,000 with 0.05 % accuracy for a complete solution (Monday Feb. 23, 2015)
  Dolphin Integration announces silicon-proven Virtual Component of IP targeting the growing market of Smart meters, such as Utility billing meters or Smart plugs. The state-of-the-art Metro-PM-Jade-mono.05, featuring a complete measurement subsystem for single-phase power metering ICs, is available for Fabless and SoC integrators in technological processes at 180 nm and 130 nm.
  
  
• Videantis and gestigon bring gesture recognition and skeleton tracking to the automotive market (Monday Feb. 23, 2015)
  Videantis and gestigon today announced a partnership that teams videantis’s low-power vision processing IP platform with gestigon’s unique skeleton tracking and gesture recognition algorithms.
  
  
• Silicon Storage Technology and UMC Announce Availability of Qualified 55 nm Embedded SuperFlash Memory Platform and 40 nm License (Monday Feb. 23, 2015)
  
  
  
• Sunrise Micro Devices' Radio Technology Enables Internet Capable Bluetooth Smart IoT Devices (Tuesday Feb. 17, 2015)
  Sunrise Micro Devices announces Bluetooth Smart radio cores that will have higher speed, improved privacy and bring much needed internet connectivity to Bluetooth Smart IoT devices. This will be the second release of its CORDIO BT4 radio product and compliant with the 4.2 version of the Bluetooth Core Specification.
  
  
• LoPan, the complete platter at 55 nm uLP beyond sponsored libraries from Dolphin Integration (Monday Feb. 16, 2015)
  With the growth of ultra-low power applications for the Internet of Things, users at TSMC 55 nm uLP could count on Dolphin Integration to bring a complete offering. The foundry sponsored panoply at TSMC 55 nm uLP includes: single port RAM, one port register file, two port register file, dual port RAM, ROM, 6-track and 9-track standard cell libraries with Island Construction Kit (ICK).
  
  
• Arasan Chip Systems Announces New MIPI CSI-2 Total IP Solutions (Thursday Feb. 12, 2015)
  Arasan Chip Systems, Inc. the leader in MIPI Camera and Imaging IP announces support for the latest version of CSI-2 v.1.3 and the first combination C-PHY + D-PHY supporting up to 17Gbps bandwidth.
  
  
• OmniPhy Announces Silicon-Proven Extreme-Ethernet IP (Thursday Feb. 12, 2015)
  OmniPhy today announced the release of fast (10/100 BaseT) and gigabit (1000 BaseT) Ethernet IP targeted for extreme temperatures, deterministic clocking, and harsh operating environments.
  
  
• Mobiveil Teams With Semtech to Provide SoC Designers a Verified PCI Express(R) 3.0 Controller and PCI Express 3.0 PHY IP Solution (Wednesday Feb. 11, 2015)
  Mobiveil and Semtech Collaboration Reduces Time to Market by Providing a Complete Solution for PCI Express 3.0 With SR-IOV and ARI Support
  
  
• Rambus Develops R+ DDR4/3 PHY on Samsung 28nm LPP Process (Wednesday Feb. 11, 2015)
  Rambus today announced it has developed an R+™ DDR4/3 PHY on the Samsung 28nm LPP process. Through the collaboration with Samsung, Rambus has achieved a robust, production-ready R+ DDR4/3 PHY on the power-performance optimized 28nm Low Power Plus (LPP) process.
  
  
• Apple HomeKit acceleration now supported by Barco Silex Crypto Public Key (Tuesday Feb. 10, 2015)
  Barco Silex, a leading provider of cryptography IP cores, today announced that it has added support for Apple HomeKit, including Curve25519 and EdDSA in its Public Key IP core. Barco Silex is the first IP provider offering hardware acceleration for these algorithms that are especially suited to secure IoT applications.
  
  
• INSIDE Secure Shortens Time to Certification with World's First FIPS 140-2-Certified IP Component (Tuesday Feb. 10, 2015)
  INSIDE Secure’s VaultIP delivers best in class security at the heart of smartphone and IoT devices to help silicon platform providers comply with stringent US government security standards while avoiding high costs and go-to-market delays of certification
  
  
• GUC Unveils Industry's Most Complete Data Converter IP Product Line (Tuesday Feb. 10, 2015)
  Global Unichip Corp. (GUC), the Flexible ASIC Leader™, today unveiled a new Flash ADC IP and a current steering DAC IP. Both provide a 3.6GHz sampling rate and SNDR > 35db that can be used as an I/Q channel receiver or transmitter in a WiGig system.
  
  
• Dolphin Integration unveils the new generation of PWM audio DAC for Set-Top-Boxes at 28 nm and 40 nm (Monday Feb. 09, 2015)
  Dolphin Integration announces the rollout the third generation of audio converters with the sDACa-MT1.03, an ultra dense DAC with Pulse Width Modulation (PWM) for audio applications. This new product is delivered as a Virtual Component of Silicon IP with a set of application schematics enabling the user to select a solution optimized for the targeted performances while guaranteeing the lowest cost of Bill-of-Material.
  
  
• Northwest Logic Offers MRAM Controller IP compatible with Everspin's ST-MRAM (Monday Feb. 09, 2015)
  Northwest Logic and Everspin Technologies announces the full interoperability between Northwest Logic’s MRAM Controller Core and Everspin Technologies’ ST-MRAM devices. This interoperability is hardware proven on a Xilinx Virtex-7 FPGA platform and is now available for designs needing low-latency, high memory throughput using MRAM technology.
  
  
• ARM Sets New Standard for the Premium Mobile Experience (Wednesday Feb. 04, 2015)
  ARM today announced a suite of IP that will enable a new standard for premium experiences on 2016 mobile devices. At the heart of this suite is the ARM Cortex-A72 processor, which is the highest performing CPU technology available for developing mobile SoCs today.
  
  
• ARM and Cadence Provide Energy-Efficient, Comprehensive Media Components for Mobile Market (Tuesday Feb. 03, 2015)
  Cadence and ARM today announced that under a new agreement, Cadence has licensed the ARM Frame Buffer Compression (AFBC) protocol to enhance the Cadence® Tensilica® Image Video Processing (IVP) digital signal processor (DSP) for use with the ARM® Mali™ media IP suite.
  
  
• Arasan Announces Industry's First Total eMMC 5.1 IP Solution (Monday Feb. 02, 2015)
  Arasan announces a complete single vendor eMMC 5.1 IP solution consisting of the eMMC Host controller IP with a matching eMMC HS400 PHY IP, the eMMC Device Controller IP with matching eMMC I/O Pads for dual voltage designs at 28nm and below and a comprehensive OVM based Verification IP for the controllers and PHY
  
  
• Complete USB Human Interface Design Platform (Monday Feb. 02, 2015)
  Digital Core Design, an IP Core provider and a System-on-Chip design house from Poland, introduced the USB HID Design Platform. It is complete and integrated solution which targets almost all aspects of USB based Human Interface Devices. Apart from that, DCD’s solution enhances Internet of Things (IoT) projects thanks to its software stack optimized with ultra-low power DP8051 8.bit CPU.
  
  
• Mobiveil Teams With Semtech to Provide SoC Designers a Verified PCI Express(R) 3.0 Controller and PCI Express 3.0 PHY IP Solution (Wednesday Feb. 11, 1998)
  Mobiveil and Semtech Collaboration Reduces Time to Market by Providing a Complete Solution for PCI Express 3.0 With SR-IOV and ARI Support