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Deals / Success Stories News

• Icron Technologies Announces New Maverick Extension Platform Featuring ExtremeUSB 2.0 and 3.0 with intoPIX TICO UHD Video over Single Cable at InfoComm 2016 (Tuesday Jun. 07, 2016)
  Icron Technologies Corporation, a leader in USB and video extension technology and intoPIX, an innovative provider of video compression solutions, announced today Icron is demonstrating its new “Maverick” USB and UHD video extension platform that incorporates intoPIX’s visually lossless TICO video compression technology.
  
  
• CAST Licenses GZIP Core to Tier 1 Wireless Chipset Vendor (Tuesday Jun. 07, 2016)
  CAST today announced a recent sale of a GZIP data decompression IP core to a Tier 1 vendor producing wireless mobile communications chipsets. The new customer is using the ZipAccel-D™ GUNZIP/ZLIB/Inflate Data Decompression Core to process compressed firmware stored in Flash memory on LTE chips primarily targeting the IoT market.
  
  
• Arteris FlexNoC IP and FlexNoC Resilience Package Licensed by Dream Chip Technologies for ADAS SoC (Tuesday May. 31, 2016)
  Arteris today announced that Dream Chip Technologies GmbH has licensed Arteris FlexNoC interconnect IP with the Arteris FlexNoC Resilience Package for use in the European Commission / ENIAC THINGS2DO automotive advanced driver assistance systems (ADAS) reference development platform project.
  
  
• Inuitive Selects CEVA-XM4 Intelligent Vision DSP for Next Generation 3D Computer Vision SoC (Tuesday May. 31, 2016)
  CEVA today announced that Inuitive, a developer of cutting edge depth sensing, computer vision and image processing SoCs, has licensed and deployed the CEVA-XM4 intelligent vision DSP in its next-generation AR/VR and computer vision SoC, the NU4000.
  
  
• Arteris Ncore Cache Coherent Interconnect IP is Implemented by NXP (Tuesday May. 24, 2016)
  Arteris today announced that NXP Semiconductors has licensed Ncore cache coherent interconnect IP for use in its SoCs. The design teams at NXP have been long-time users of Arteris IP, having first licensed Arteris FlexNoC interconnect IP in 2011 and successfully implemented FlexNoC interconnects in its QorIQ network processing platform. The first implementation of Ncore interconnect IP in NXP is in heterogeneous cache coherent SoCs for next generation automotive MCU's and processors.
  
  
• Analogix Licenses USB-C Technology to LG Electronics (Tuesday May. 24, 2016)
  Analogix Semiconductor, Inc. today announced that it has signed a technology licensing agreement with LG Electronics for Analogix’s Intellectual Property (IP) for full function USB-C™ technology.
  
  
• Xentech Solutions Ltd selects Achronix Speedster22i FPGAs for its Axtrinet Ethernet Packet Generators (Tuesday May. 17, 2016)
  Achronix Semiconductor today announced that Xentech Solutions Limited selected Achronix Speedster22i FPGAs for its compact and low-cost Axtrinet™ Ethernet Packet Generators.
  
  
• Autotalks License and Deploy CEVA DSP for Mass-Market V2X Chipset (Wednesday Apr. 27, 2016)
  CEVA, the leading licensor of signal processing IP for smarter, connected devices, and Autotalks Ltd., the world's leading provider of integrated V2X chipsets, today announced that Autotalks has licensed and deployed the CEVA-XC communication DSP in its upcoming second-generation Vehicle-to-Everything (V2X) chipset.
  
  
• GCT Semiconductor Licenses Arteris FlexNoC Interconnect IP for LTE Digital Baseband Systems-on-Chip (SoCs) (Tuesday Apr. 26, 2016)
  Arteris Inc., the inventor and industry leader in commercial network-on-chip (NoC) interconnect IP solutions, today announced that GCT Semiconductor, a leading fabless designer and supplier of advanced 4G LTE semiconductor solutions, has licensed Arteris FlexNoC IP for use in its low power LTE digital baseband chipsets.
  
  
• Alpha Data has partnered with Chevin Technology to support low latency 10G Ethernet and UDP offload IP on the ADM-PCIE-KU3 Accelerator board with Xilinx Kintex Ultrascale FPGA (Thursday Apr. 21, 2016)
  Alpha Data and ecosystem partner, Chevin Technology, have created verified demos of low latency 10G Ethernet IP. These demos are available free of charge to users of the ADM-PCIE-KU3 board to test the Ethernet front IO and evaluate Chevin Technology’s low latency IP cores: XGPCS, XGMAC and XGUDP.
  
  
• Istuary Innovation Group Selects Arteris FlexNoC Interconnect IP For Development of Proprietary Enterprise Storage Controllers (Tuesday Apr. 19, 2016)
  Arteris Inc., the inventor and industry leader in commercial network-on-chip (NoC) interconnect IP solutions, today announced that Istuary Innovation Group has licensed its Arteris® FlexNoC interconnect IP.
  
  
• Blackmagic Design selects the TICO lightweight compression to move to Live video production over IP. (Tuesday Apr. 19, 2016)
  intoPIX, an innovative technology provider of video compression solutions, welcomes Blackmagic Design, one of the world's leading manufacturers of broadcast video equipment, amongst the adopters of TICO.
  
  
• UMC Standardizes on Industry-Leading ARM Artisan Platform for Physical IP (Friday Apr. 15, 2016)
  ARM and UMC, a leading global semiconductor foundry, today announced a new strategic partnership to develop multiple physical IP platforms, enabling UMC customers to easily implement ARM® Artisan® physical IP into SoC designs and reduce time-to-market.
  
  
• Kandou Licenses Glasswing SerDes Technology to Marvell (Wednesday Mar. 30, 2016)
  Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by Marvell Technology Group for use in a variety of future multi-chip products. Based on Kandou’s CNRZ-5 Chord™ signaling architecture, Glasswing delivers high bandwidth signaling at very low power and is ideally suited for short links inside and outside a package.
  
  
• Arteris FlexNoC Interconnect IP is Licensed by Movidius for Ultra- Low Power Machine Learning and Vision Processing (Tuesday Mar. 29, 2016)
  Arteris today announced that Movidius has licensed Arteris® FlexNoC IP for use in its machine learning vision processing units (VPU).
  
  
• GL Communications Inc. selects Achronix Speedster22i FPGAs for 10/40/100G PacketExpert (Tuesday Mar. 22, 2016)
  Achronix Semiconductor Corporation today announced that GL Communications Inc. selected the Achronix Speedster22i HD1000 FPGA for its 10/40/100G PacketExpert™ Ethernet tester, a hardware-based test instrument suited for the installation, troubleshooting and comprehensive testing of Ethernet/IP networks.
  
  
• Acorn Technologies Licenses hellaPHY to Sequans Communications (Thursday Mar. 17, 2016)
  Acorn Technologies today announced that Sequans Communications, a 4G chipmaker and leading provider of single-mode LTE chipset solutions to wireless device manufacturers worldwide, has licensed the company’s hellaPHY for LTE. Sequans Communications is considering hellaPHY for use in future products.
  
  
• Rambus Cryptography Research Division Licenses Advanced Security Technologies to Altis Semiconductor (Thursday Mar. 17, 2016)
  Rambus today announced that its Cryptography Research division has signed a license agreement with Altis Semiconductor for the use of advanced security technologies. These technologies, developed by Cryptography Research, include differential power analysis (DPA) countermeasure techniques and are designed to protect against DPA and other side-channel attacks.
  
  
• THine Electronics Licenses SILICONGATE's Power Management IP Solutions for its Next Generation of Serial Interfaces (Thursday Mar. 10, 2016)
  SILICONGATE today announced that THine Electronics, the world’s leader in high-speed serial interface and provider of mixed-signal LSI, has selected SiliconGate high performance Power Management IP’s for its next generation of high-speed serial interfaces.
  
  
• iCatch Technology Selects CEVA Imaging and Vision DSP for Digital Video and Image Product Line (Tuesday Mar. 01, 2016)
  CEVA today announced that iCatch Technology, Inc., a leading system solution provider for digital video and image SoCs in Taiwan, has licensed the CEVA imaging and vision DSP for its next-generation SoCs targeting the automotive, drone, surveillance camera markets.
  
  
• eASIC Enables Improved Real-Time Hardware Acceleration Performance for ASOCS' Fully Virtualized RAN (vRAN) Solution (Wednesday Feb. 24, 2016)
  eASIC® Corporation, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and ASOCS Ltd., a solution provider of virtual Base Stations (vBS) today announced that the eASIC Nextreme-3 platform was used by ASOCS to deliver significantly higher performance in its third generation modem processing unit (MPU) Hardware Acceleration (HWA).
  
  
• Realtek Licenses Cadence Tensilica Fusion DSP to Support Ultra-Low-Power Always-On Functions in the RTS3110/RTS3111 Context Hub Chip (Tuesday Feb. 23, 2016)
  Cadence and Realtek Semiconductor Corp., today announced that Realtek has licensed the Cadence® Tensilica® Fusion digital signal processor (DSP) to support ultra-low-power functionalities in its Context Hub chip.
  
  
• MegaChips Selects S3 Group Data Converter IP (Tuesday Feb. 23, 2016)
  S3 Group today announced that MegaChips Corporation has selected Data Converter IP from its Magellan family of high-speed Digital to Analogue Converters (DAC), to enable its customers to develop optimized next generation connected consumer Systems on Chip (SoCs).
  
  
• CEVA and Spreadtrum Expand Long-Term Partnership for LTE SoCs Targeting Mid and High End Smartphones (Tuesday Feb. 23, 2016)
  CEVA and Spreadtrum Communications, a leading fabless semiconductor company in China with advanced technology in 2G, 3G, and 4G wireless communication standards, today announced the expansion of their long-term strategic partnership around Spreadtrum’s advanced LTE SoC smartphone platforms.
  
  
• Spreadtrum Licenses Tensilica HiFi Audio/Voice DSP (Monday Feb. 22, 2016)
  Cadence today announced that Spreadtrum licensed the Cadence® Tensilica® HiFi Audio/Voice digital signal processor (DSP).
  
  
• Truechip announces first customer shipment of PCIe Gen4 Comprehensive Verification IP (CVIP) (Friday Feb. 19, 2016)
  Truechip Solutions, the verification IP specialist, announced today that it has shipped early adopter versions of its PCIe Gen4 Comprehensive Verification IP (CVIP) to its partners in the early adoption program.
  
  
• ITRI Selects CEVA-XC DSP for 4G Small Cell Base Stations (Thursday Feb. 18, 2016)
  CEVA announced today that ITRI, the award-winning Taiwanese research and development organization, has selected the CEVA-XC DSP for the development of its new 4G small cell base station platform.
  
  
• LG Electronics Selects CEVA Imaging and Vision DSP for Mobile Devices (Tuesday Feb. 16, 2016)
  CEVA today announced that LG Electronics has licensed the CEVA imaging and vision DSP for its mobile device product lines.
  
  
• Trustonic Licenses whiteCryption's Advanced IoT and Mobile App Security Solutions (Thursday Feb. 11, 2016)
  whiteCryption, an Intertrust company that provides advanced application security solutions, and Trustonic, a provider of Trusted Execution Environments (TEE) for mobile and IoT devices, today announced that Trustonic has licensed whiteCryption’s Code Protection and Secure Key Box software solutions.
  
  
• HCE Service Licenses INSIDE Secure's Award-Winning MatrixHCE and MatrixSSE Mobile Security Software (Tuesday Feb. 09, 2016)
  INSIDE Secure today announced that HCE Service Ltd, UK and HCE Secure IT Services (Pvt) Ltd, India will leverage INSIDE Secure’s technology in conjunction with their SWIM (Software Wireless Identity Module), a Wireless Public Key Infrastructure (WPKI) based secure mobile payments platform offering a new product for banks seeking solutions to offer HCE cloud-based payments for leading payment schemes.