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Fabless / IDM News

• MediaTek Announces MT6595, World’s First 4G LTE Octa-Core Smartphone SOC with ARM Cortex-A17 and Ultra HD H.265 Codec Support (Tuesday Feb. 11, 2014)
  MediaTek today announces the MT6595, a premium mobile solution with the world’s first 4G LTE octa-core smartphone SOC powered by the latest Cortex-A17™ CPUs from ARM®. The MT6595 employs ARM’s big.LITTLE™ architecture with MediaTek’s CorePilot™ technology to deliver a Heterogeneous Multi-Processing (HMP) platform that unlocks the full power of all eight cores.
  
  
• PLX Achieves Industry-First Compliance of PCI Express 3.0 Switches on Exclusive PCI-SIG Integrators List (Thursday Feb. 06, 2014)
  PLX Technology today announced three PLX® ExpressLane™ PCIe Gen3 switches have passed the rigorous testing procedures of the PCI-SIG® Compliance Workshop and are now listed on the group’s highly respected PCIe 3.0 Integrators List.
  
  
• MoSys Announces New Bandwidth Engine Architecture with over 1.5 Tbps Internal Bandwidth (Wednesday Feb. 05, 2014)
  MoSys today announced the architecture for its third generation Bandwidth Engine® family, featuring the industry's highest serial throughput and memory access rate, optimized efficiency and scheduling for multi-core processing, and expanded multi-cycle embedded macro functions.
  
  
• GigOptix Offers Its Custom Structured ASIC Solutions for Rapid Productization of Cryptocurrency Bit Mining Chip and Application with Partners (Monday Feb. 03, 2014)
  GigOptix today announced that its Custom Structured ASIC applications are establishing GigOptix as one the foremost providers of ASICs for the fast growing cryptocurrency bit mining market.
  
  
• CoinTerra begins shipment of the TerraMiner IV - the world's fastest Bitcoin miner (Friday Jan. 31, 2014)
  CoinTerra™, the high performance and value leader in ASIC Bitcoin mining hardware announced today that they have started delivering their eagerly-anticipated TerraMiner™ IV professional Bitcoin miner – the first to market which breaks the one terahash barrier.
  
  
• ASMedia Technologies Demonstrates Industry's First SuperSpeed USB 10 Gbps (USB 3.1) PHY at USB-IF Annual Members Meeting (Friday Jan. 24, 2014)
  ASMedia Technologies, a fabless semiconductor company that develops and markets high-speed IO solutions, demonstrated SuperSpeed USB 10 Gbps (USB 3.1) data transfer on its hardware development platform at the USB Implementers Forum (USB-IF) annual members meeting in Honolulu.
  
  
• eASIC and EnSilica Announce 16-bit and 32-bit Soft Processors for eASIC Nextreme Devices (Tuesday Jan. 14, 2014)
  eASIC® and EnSilica today announced the immediate availability of 16-bit (eSi-1600) and 32-bit (eSi-3200) soft processor cores. The eSi-1600 and the eSi-3200 are based on an EnSilica’s eSi-RISC highly versatile microprocessor architecture that can be optimized by application through extensive configuration options and custom instructions.
  
  
• Silicon Image First to Introduce 4K Ultra HD 60GHz Wireless Adapter Solution (Wednesday Jan. 08, 2014)
  Silicon Image today announced a wireless video connectivity solution capable of supporting 4K Ultra HD resolution. Based on Silicon Image's 60GHz WirelessHD® technology, this reference design includes both transmitter and receiver devices capable of sending full, bit accurate video at data rates up to 8Gbps.
  
  
• Atmel Introduces New SAM G Family of ARM Cortex-M4-based Ultra-low Power MCUs In Small Form Factors for Smart, Connected Devices (Wednesday Jan. 08, 2014)
  Atmel today announced the Atmel SAM G family of ARM® Cortex-M4-based MCUs that integrate high performance and ultra-low power in a small form factor. The complete solution is ideal for sensor hub and battery-operated consumer applications including sensor hubs for smartphones, tablets and Ultrabooks as well as wearables, healthcare, gateways, bridges and audio devices.
  
  
• Entropic Completes Integration of Cryptography Research CryptoFirewall Security Cores (Wednesday Jan. 08, 2014)
  Entropic and Cryptography Research today announced Entropic has completed the integration of the Cryptography Research CryptoFirewall™ security core technology into its advanced line of multimedia set-top box (STB) system-on-a-chip (SoC) products.
  
  
• GEO Expands Product Line with Compact Geometric Image Processing Solutions for Automotive Ultra-Wide Angle Camera and Head-Up Display Applications (Tuesday Jan. 07, 2014)
  GEO Semiconductor announced today the introduction of the GW3100, GW3200 and the GW3210 programmable geometric image processors designed for automotive camera and head-up display applications.
  
  
• Groundbreaking Architecture from STMicroelectronics Leads Industry Transition to 64-bit Computing for the Digital Home (Tuesday Jan. 07, 2014)
  STMicroelectronics has released details of its innovative STi8K™ architecture addressing future Systems-on-Chips (SoCs) for the Digital Home.
  
  
• NVIDIA Unveils Tegra K1, a 192-Core Super Chip That Brings DNA of World's Fastest GPU to Mobile (Monday Jan. 06, 2014)
  NVIDIA today unveiled the revolutionary Tegra® K1 mobile processor, a 192-core super chip featuring the same NVIDIA® Kepler™ architecture that powers the fastest GPU on the planet, the NVIDIA GeForce® GTX™ 780 Ti. For the first time, next-generation PC gaming will now be available on mobile platforms.
  
  
• Quantenna Powers World's Fastest 802.11ac Dual-Band Wave 2 ASUS RT-AC87U Router (Monday Jan. 06, 2014)
  Quantenna and ASUS today at CES announced that Quantenna’s award-winning QSR1000 4x4 Multi-User Multiple Input Multiple Output (MU-MIMO) chipset will power the ASUS RT-AC87U, the world’s fastest 802.11ac home router.
  
  
• GEO Introduces Single Chip Solution for Ultra-Wide Angle Cameras (Friday Jan. 03, 2014)
  The GC6500 integrates GEO’s patented eWARP™ core, MIPI D-PHY Input, Audiophile quality stereo recording path, low latency highly flexible H.264 Codec, Tensilica XTENSA HIFI CPU and USB2.0 interfaces. Integrated DCDC converters and LDOs provide all system voltages for unprecedented integration.
  
  
• Fortemedia Launches Highly Integrated Voice Processor For Automotive Applications (Thursday Dec. 19, 2013)
  Today Fortemedia Inc. announced the availability of the industry’s most advanced and highly integrated voice processor, the FM1388, supporting advanced voice processing for automotive applications while supporting ease of system design
  
  
• New digital radio chip targets smart devices and global markets (Tuesday Dec. 17, 2013)
  Frontier Silicon announces details of Chorus 4, its next generation digital radio chip. Chorus 4 is a single-chip solution, which integrates four previously separate chips to deliver significant cost and energy consumption savings.
  
  
• Fujitsu Semiconductor Successfully Embeds Flash Memory onto DDC Technology (Monday Dec. 16, 2013)
  Fujitsu Semiconductor announced that it has developed the world's first technology to produce chips with embedded flash memory on logic circuits fabricated using deeply depleted channel (DDCTM) technology, with the 55nm process at the company's Mie Plant.
  
  
• Silicon Image Introduces Industry's First MHL 3.0 4K Ultra HD Solution for Mobile Devices (Monday Dec. 16, 2013)
  Silicon Image today announced the industry's first 4K Ultra HD MHL® 3.0 solution comprising mobile transmitter, bridge, and multimedia switch integrated circuits (ICs). MHL is the leading HD and 4K Ultra HD connectivity standard for connecting a mobile device to large screen displays, while simultaneously charging the device.
  
  
• Qualcomm Technologies Introduces Snapdragon 410 Chipset with Integrated 4G LTE World Mode for High-Volume Smartphones (Tuesday Dec. 10, 2013)
  Qualcomm today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., has introduced the Qualcomm® Snapdragon™ 410 chipset with integrated 4G LTE World Mode.
  
  
• Broadcom Announces Bluetooth Smart SoC with Wireless Charging Support for Growing Wearable Market (Thursday Dec. 05, 2013)
  Broadcom today introduced a new Bluetooth® Smart system-on-a-chip (SoC) into its Wireless Internet Connectivity for Embedded Devices (WICED) family to address the rapidly growing opportunities in different market segments for wearables and the Internet of Things.
  
  
• Bluetooth Smart radio with record battery lifetime (Wednesday Dec. 04, 2013)
  With a power consumption up to five times lower than state-of-the-art radios and an extremely small memory footprint, this radio solution, integrating imec and Holst Centre’s 2.4GHz ultra-low power radio and Wicentric’s exactLE product line of Bluetooth® Smart software, leads the way to new Internet of Things applications such as personal health monitoring systems and smart home applications.
  
  
• MoSys Announces Tabula Support of GigaChip Interface (Thursday Nov. 21, 2013)
  MoSys today announced that Tabula, Inc., advancing high-performance programmable logic solutions for network infrastructure systems, supports the GigaChip™ Interface.
  
  
• MediaTek Launches MT6592 True Octa-Core Mobile Platform (Wednesday Nov. 20, 2013)
  MediaTek today unveiled the MT6592, the world’s first true octa-core mobile platform. The MediaTek MT6592 System on a Chip (SOC) combines an advanced eight-core application processor with industry-leading multimedia capabilities and mobile connectivity for a perfect balance of performance and power consumption.
  
  
• Faraday Announces the Availability of Dual-core Cortex A9-based SoC Platform (Tuesday Nov. 19, 2013)
  Faraday Technology today announced the availability of its ARM-based SoCreative! IV™ evaluation platform with A380 SoC chip in 40nm LP (Low power) process. This latest extendable SoC platform integrates powerful processors and high-performance interfaces to address the fast growing demand of cloud infrastructure market, targeting the networking, computing, and storage applications.
  
  
• KALRAY today announces world’s first hyper-scalable 1000+ cores MIMD processor architecture for next generation exaflop supercomputers. (Tuesday Nov. 19, 2013)
  KALRAY today announces world’s first hyper-scalable 1000+ cores MIMD processor architecture (about 1 TeraFlops at less than 30 Watts, and up to0.5 TeraBytes of DDR) for Next Generation ExaFLOP Ssercomputers.
  
  
• INSIDE Secure Extends Leadership in Protecting Connected Devices with New Generation of Authentication Chips (Thursday Nov. 14, 2013)
  INSIDE Secure today announced the next generation of its innovative dual-interface VaultIC 150/150D security modules. The new VaultIC products have been redesigned to provide enhanced functionality, including a new privacy mode, in a more cost-effective solution that will have broad appeal in new, higher-volume markets.
  
  
• DecaWave Launches Industry's Most Precise Indoor Location and Communication CMOS Chip (Monday Nov. 11, 2013)
  Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before. This is the first Integrated Circuit on the market to electronically identify the specific distance to any object, person or thing with +/-10cm precision.
  
  
• Tabula and Titan IC Systems Partner to Offer High-Speed Content Analysis Products (Tuesday Nov. 05, 2013)
  Tabula announced today a partnership with Titan IC Systems to offer high-speed content analysis products. This solution features the seamless integration of Titan IC's Regular Expression Processor (RxP) soft IP powered by Tabula's ABAX2P1 3PLD.
  
  
• Aquantia Solidifies Market Leadership With World's First 28nm 10GBASE-T PHY (Tuesday Nov. 05, 2013)
  The new device, which is the fourth generation of 10GBASE-T ICs from Aquantia, reduces the power consumption of its data center products to 1.5W per port while also integrating such features as Energy Efficient Ethernet (EEE), 1588 and MACsec.