Fabless / IDM News
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TowerJazz Announces Availability of Wireless Antenna Switch SOI Process Technology (Tuesday May. 31, 2011)
TowerJazz today announced availability of its wireless antenna switch SOI process technology applicable to multiple wireless standards. SOI based solutions cost substantially less than legacy solutions based on GaAs pHEMPT or silicon-on-sapphire (SOS) technologies.
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Silicon Image Unveils Third-Generation WirelessHD 60GHz Chipsets (Tuesday May. 31, 2011)
Silicon Image today announced its upcoming third-generation WirelessHD® 60GHz chipsets, the SiI6300 family consisting of the SiI6320 HRTX Network Processor, SiI6321 HRRX Network Processor and SiI6310 HRTR RF Transceiver.
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DSP Group Releases Groundbreaking XpandR III Wireless Multimedia Chip (Tuesday May. 31, 2011)
DSP Group announced today the release and availability of XpandR™ III, the next generation in the company’s XpandR family of multimedia chipset solutions.
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Open-Silicon Introduces "On Time, or On Us" Program (Friday May. 27, 2011)
Open-Silicon today introduced the semiconductor industry’s first money-backed design engineering schedules. Open-Silicon will meet the schedule, delivering a prototype on time, or the company will refund the cost of the design engineering, up to $500K.
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eASIC Announces easicopy ASIC (Wednesday May. 25, 2011)
eASIC today announced the immediate availability of “easicopy”, an ASIC migration product that provides custom chip designers with a simple, low-risk migration path from eASIC Nextreme and Nextreme-2 NEW ASICs to cell-based ASIC devices.
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Silicon Image Introduces 300MHz Port Processors and Transmitter Supporting HDMI 1.4a (Wednesday May. 25, 2011)
Silicon Image today announced two port processors, the SiI9587-3 and SiI9589-3, and the SiI9136-3 HDMI transmitter—all supporting HDMI® 1.4a with 300MHz speeds.
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Realtek Introduces a Quad GbE PHY for Customers Designing with BroadLight’s Third Generation Processors (Monday May. 23, 2011)
Realtek Semiconductor announced today the introduction of the RTL8214B, a true quad-port Gigabit Ethernet PHY transceiver solution for customers designing with BroadLight’s 3rd Gen Processors.
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Fujitsu Expands FM3 Family of 32-bit MCUs with ARM Cortex-M3 Core (Wednesday May. 11, 2011)
Fujitsu Semiconductor Europe has extended its comprehensive portfolio of general-purpose, 32-bit microcontrollers (MCUs), introducing 52 new products designed for home appliances, factory & office automation, medical devices and digital consumer products.
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Tabula, MorethanIP and NetLogic Microsystems Collaborate to Develop a Complete Sub-$500 Programmable 100Gb Ethernet Solution (Monday May. 09, 2011)
Tabula, MorethanIP and NetLogic announce the industry’s first complete programmable 100Gb Ethernet solution that can be deployed cost effectively in production with price points below $500. The complete, ready-to-use solution from Tabula consists of Tabula’s I-100 100Gb Ethernet-to-Interlaken bridging device embedding MorethanIP’s silicon-proven Interlaken and 100G Ethernet MAC and PCS IP cores, and NetLogic Microsystems’ NLP15142-T 100GE PHY devices.
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Elpida Develops Industry's First 25nm Process DRAM (Monday May. 02, 2011)
Elpida Memory today announced it had developed a 2-gigabit DDR3 SDRAM using an industry-leading 25nm process for memory manufacturing. Using the most advanced process technology available Elpida has achieved the industry's smallest chip size for a 2-gigabit SDRAM.
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Cypress and Redpine Signals Collaborate to Provide Low-Power 802.11n Wi-Fi® I/O Connectivity for PSoC® 3 and PSoC 5 Platforms (Monday May. 02, 2011)
Designers building revolutionary products with Cypress’s PSoC platforms can easily implement wireless connectivity with Redpine’s Connect-io-n™ series of Wi-Fi modules
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Accent Introduces Industry First Advanced Transceiver Supporting Future Smart Utility Network Standard (Tuesday Apr. 26, 2011)
Accent announced today the immediate availability of its Sub-GHz RF transceiver supporting the advanced performance needs defined by the standardization efforts of the IEEE 802.15 TG4g task group.
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Toshiba launches 19nm process NAND flash memory (Friday Apr. 22, 2011)
Toshiba today announced that it has fabricated NAND flash memories with 19nm process technology, the finest level yet achieved. This latest technology advance has already been applied to 2-bit-per-cell 64-gigabit (Gb) chips that are the world's smallest and offer the highest density on a single chip (8 gigabytes (GB)).
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K-micro announces availability of burst-mode CDR for XGPON1 OLT applications (Tuesday Apr. 19, 2011)
K-micro announced a new burst-mode CDR SerDes PHY for XGPON1 OLT applications. Available now in 65nm and 40nm process technologies for ASIC integration, this chip can lock to upstream data burst at 2.488 Gb/s in less than 16 bits. The new SerDes is also available as a standalone chip for supporting reference designs.
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Intel, Micron Extend NAND Flash Technology Leadership, Introduce Industry's Smallest, Most Advanced 20-Nanometer Process (Tuesday Apr. 19, 2011)
Intel Corporation and Micron Technology Inc. today introduced a new, finer 20-nanometer (nm) process technology for manufacturing NAND flash memory. The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on smartphones, tablets and computing solutions such as solid-state drives (SSDs).
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NetLogic Microsystems Announces the Industry's Widest Bandwidth Digital Front End Processors for 3G and 4G/LTE Base Stations (Monday Apr. 18, 2011)
NetLogic Microsystems' OP6100 family of Digital Front End (DFE) processors delivers 65MHz of occupied bandwidth, 145MHz of total bandwidth and 325MHz of pre-distortion bandwidth
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Gennum and NuMedia Drive Next-Generation Industrial Connectivity with New Aviia HD Visually Lossless CODEC and Reference Design (Wednesday Apr. 13, 2011)
Gennum and NuMedia today announced the availability of a new Aviia™ HD Visually Lossless CODEC (HD-VLC™) and reference design, which provides a turnkey solution for the transmission of high definition (HD) video over long runs of coaxial cable greater than 300 meters.
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Fresco Logic Announces USB-IF Certification for its 2nd Generation SuperSpeed USB Host Controller FL1009 (Tuesday Apr. 12, 2011)
Fresco Logic is demonstrating its SuperSpeed USB 1080p camera controller prototype for broad range consumer applications in the SuperSpeed USB community and Intel’s Advanced Technology Zone at the Intel Developer Forum (IDF) Beijing
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NXP Extends Fully Scalable USB Portfolio With LPC11U00 Cortex-M0 Series (Monday Apr. 11, 2011)
NXP Semiconductors today announced its LPC11U00 series – a low-cost ARM ® Cortex™-M0 based microcontroller featuring a new, highly flexible USB architecture, as well as a smart card interface.
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Cypress Introduces EZ-USB FX3 Controller, The Industry's Only Flexible SuperSpeed USB 3.0 Solution (Monday Apr. 11, 2011)
Cypress today introduced its first USB 3.0 controller, the EZ-USB® FX3. The new EZ-USB FX3 device is a flexible peripheral controller with a General Programmable Interface (GPIF II) that delivers a 5-Gbps USB 3.0 data pipeline, a fully configurable ARM9™ processor core and backwards compatibility with USB 2.0.
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Toshiba Debuts SmartNAND, Latest Addition to NAND Flash Portfolio (Wednesday Apr. 06, 2011)
Toshiba America Electronic Components, Inc. (TAEC) today announced that it has enhanced its NAND flash portfolio with the introduction of SmartNAND™, its next-generation 24-nanometer (nm) NAND flash product family.
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UK startup unveils LTE transceiver IC (Monday Apr. 04, 2011)
Genasic Design Systems Ltd., a privately-held fabless RF design company formed in 2009, has announced the availability of its first chip, a 65-nm CMOS transceiver IC for HSPA and LTE applications.
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Freescale and Cactus Collaborate to Bring Technology Solutions to the Medical Market (Monday Apr. 04, 2011)
Freescale Semiconductor and Cactus Semiconductor, a medical application-specific integrated circuit (ASIC) company, have agreed to collaborate to provide customized analog mixed-signal and system-on-chip (SOC) solutions to the medical market.
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Ambarella A7 IP Camera SoC Brings 1080p60 Performance into the Video Surveillance Mainstream (Thursday Mar. 31, 2011)
Ambarella today announced the A7 IP Camera SoC, bringing high-quality 1080p60 H.264 performance to the video surveillance market. The A7 integrates a high performance image sensor pipeline with up to 500 MHz pixel capture rate with a multi-streaming 1080p60 H.264 encoder and power consumption below 1.5 Watts.
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Sequans Announces New WiMAX Chip for Handsets and Tablets (Wednesday Mar. 23, 2011)
4G chipmaker Sequans introduced its newest Mobile WiMAX chip, the SQN1310, today at CTIA’s Wireless 2011 annual trade show.
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NXP Expands ARM Cortex-M0 Microcontroller Portfolio With LPC1200 Industrial Control Series (Tuesday Feb. 22, 2011)
NXP Semiconductors N.V. (NASDAQ:NXPI - News) today announced its LPC1200 Industrial Control Series featuring the ARM® Cortex™-M0 processor. The LPC1200 extends NXP's 32-bit ARM microcontroller continuum and targets a wide range of industrial applications in the areas of factory and home automation, such as white goods, motor control, power conversion and power supplies.
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MIT, TI tip 28-nm processor (Monday Feb. 21, 2011)
At the 2011 International Solid-State Circuits Conference (ISSCC) here, Texas Instruments Inc. and the Massachusetts Institute of Technology (MIT) will outline what could be a major breakthrough in the gap between performance demands and battery capacity in the mobile space.
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Renesas Electronics Introduces R-Car M1 Series of Integrated SoCs Developed for Mid-Range Automotive Infotainment Systems (Wednesday Feb. 16, 2011)
Renesas Electronics Corporation and its subsidiary, Renesas Mobile Corporation, today announced the first release of the R-Car series of systems-on-chip (SoCs), the R-Car M1 series, offering low power consumption for next-generation dashboard-mounted car navigation systems and supporting advanced human machine interfaces (HMI).
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Picochip delivers next generation femtocell SoC (Thursday Feb. 03, 2011)
Picochip today announced the first in its next generation of picoXcell™ femtocell chips, the PC3008. The new device is optimized for high-volume cost-sensitive consumer applications and maintains Picochip’s leadership in this market as carrier deployments are accelerating.
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Avago Technologies Debuts 28-nm ASIC Embedded SerDes with Industry-Leading 30-Gbps Performance (Tuesday Feb. 01, 2011)