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Fabless / IDM News

• Nordic Semiconductor launches its first μBlue chip - the industry's lowest power complete Bluetooth low energy solution (Monday Jan. 24, 2011)
  Available today, the μBlue™ nRF8001 expands Nordic's line-up of ultra low power wireless solutions and by delivering sub 12.5mA peak currents and connected mode average currents as low as sub 12μA it represents the lowest power Bluetooth® low energy solution now available. As such, the nRF8001 truly delivers on the promise of Bluetooth low energy to provide an interoperable wireless connectivity solution that can offer years of battery life from a coin cell battery source
  
  
• Ensphere Solutions Announced the Availability of a New 10G Transceiver and Low Power Laser Diode Shunt Driver ICs Targeting 10G Optical Modules (Monday Jan. 24, 2011)
  Ensphere Solutions today announced the availability of a new 10G transceiver IC (ESI-1002) as well as matching laser diode shunt driver IC (ESI-1010).
  
  
• Renesas Electronics Introduces New SoC that Enables Industry-Leading 16-Megapixel Still Image and High-Speed Continuous Shooting for Mobile Phones (Thursday Jan. 13, 2011)
  Renesas Electronics today announced the availability of a new system-on-chip (SoC), the CE150, for smartphones and high-end mobile phones that delivers industry-leading resolution of 16 megapixels and the ability to capture full-HD video (1920 × 1080 pixels).
  
  
• MoSys Announces First Shipment and Sample Availability of its Bandwidth Engine IC (Tuesday Jan. 11, 2011)
  MoSys today announced sample availability and the shipment of its first Bandwidth Engine® integrated circuit (IC) devices in December 2010.
  
  
• Broadcom Delivers Nine New 40nm Set-Top Box Solutions for the Full Resolution 3DTV Internet Connected Home (Tuesday Jan. 04, 2011)
  Broadcom today announced nine new cable, satellite and IP set-top box (STB) system-on-a-chip (SoC) solutions. Designed in 40 nm CMOS process, all nine of Broadcom's new STB SoC solutions feature high integration, high performance and lower overall system cost.
  
  
• WiSpry Announces Support for MIPI Alliance Newly Released RFFE 1.0 Standard for Front-End Control (Tuesday Jan. 04, 2011)
  WiSpry today announced it will make all of its standard products compatible with the MIPI RFFE 1.0 standard. First products with the new serial interface are scheduled to reach key mobile phone OEMs for in-phone evaluation by Q2 2011.
  
  
• Sigma Designs Launches First Studio-Grade Set Top Box SoC (Monday Jan. 03, 2011)
  Sigma Designs today set a new bar for advanced connected media players, Blu-ray players and IPTV set-top box (STB) SoCs with the introduction of its SMP8910 media processor.
  
  
• Genesys Logic's GL3310 Receives the First USB-IF SuperSpeed USB Bus-Power Certificate (Tuesday Dec. 14, 2010)
  Genesys Logic announced that its USB 3.0 to SATA 3Gb/s bridge controller, GL3310, has been certified by USB-IF (USB-Implementers Forum) for SuperSpeed USB bus-powered products and has been adopted by Kingston Technology for their new USB 3.0 products.
  
  
• Silicon Image Introduces New MHL/HDMI-to-HDMI Bridge for High Definition Displays (Tuesday Dec. 14, 2010)
  Silicon Image today introduced the Sil1292 MHL™/HDMI®-to-HDMI bridge, which enables an existing HDMI input to add MHL support, facilitating video and audio connectivity between MHL-enabled mobile devices and HDTVs, PC monitors, multi-function monitors or HD projectors.
  
  
• Silicon Image Expands DTV Port Processor Portfolio With MHL Technology (Monday Dec. 13, 2010)
  Silicon Image today announced the expansion of its growing MHL™ (Mobile High-Definition Link) product portfolio with the addition of the SiI9387A MHL-enabled HDTV port processor.
  
  
• Samsung and Ambarella Announces ASIC Partnership on 45nm High-Performance, Low-Power HD Hybrid Camera SOCs (Wednesday Dec. 08, 2010)
  Samsung Electronics and Ambarella today announced the availability of Ambarella's new A7 hybrid camera system-on-chip (SoC) product utilizing Samsung's latest 45-nanometer (nm) low power (LP) process technology.
  
  
• eASIC Introduces 45nm ASIC Value Shuttle Program (Tuesday Dec. 07, 2010)
  eASIC today introduced a Value Shuttle™ program that lowers the entry cost for 45nm ASIC designs. The 45nm Value Shuttle™ enables designers to receive forty-five (45) eASIC Nextreme-2 NEW ASIC prototypes for only forty-five thousand dollars ($45K), a small fraction of the cost of competing ASIC solutions.
  
  
• SiTune facilitates multi standard system integration for Set Top Box and TV application (Tuesday Dec. 07, 2010)
  SiTune today announced its latest generation of the state of the art Universal CMOS TV tuners based upon its P2TUNE architecture.STN-50T4000 is a highly integrated Zero-IF Tuner that supports both Cable standards including ANSI-SCTE 4.0, ITU-T J.83 Annexes A(DVB-C), B, C and Digital Terrestrial standards including DVB-T/T2, DTMB and ISDB-T with the lowest power consumption and minimum BOM cost.
  
  
• Renesas Electronics Introduces EMMA Mobile EV0-D SoCs for Portable Audio-Visual Devices with One-third Reduced Package (Friday Dec. 03, 2010)
  Renesas Electronics today announced the availability of new system-on-chips (SoCs) that achieve playback of audio and video data in a single chip for portable audio-visual (AV) devices, including portable multimedia players, electronic book readers and network TVs.
  
  
• Broadcom reveals CPU development (Thursday Nov. 25, 2010)
  In an exclusive article in Microprocessor Report this week, Broadcom revealed that it has developed a new MIPS-compatible CPU, the BRCM 5000, for its broadband SoCs. This CPU, also known by its code-name Zephyr, is the latest in a series that the company has developed over the past decade under an architecture license from MIPS.
  
  
• Analogix announces availability of DisplayPort to LVDS converter IC (Monday Nov. 22, 2010)
  Analogix today announced the availability of a DisplayPort to LVDS converter IC. The ANX1120 is designed to allow OEMs to offer the advantages of the latest DisplayPort enabled source devices to consumers while still using existing LVDS enabled displays.
  
  
• Qualcomm rolls 28-nm Snapdragon (Thursday Nov. 18, 2010)
  At its analyst meeting in New York on Wednesday (Nov. 17), Qualcomm Inc. has rolled out a new version of its Snapdragon chipset, based on a 28-nm process.
  
  
• PLX Technology Announces Sampling of Industry's First PCI Express 3.0 Switches (Monday Nov. 15, 2010)
  PLX Technology today announced it is now sampling the industry’s first PCI Express® 3.0 (PCIe® Gen 3) switches.
  
  
• Amlogic Unveils Integrated ARM Cortex-A9 Chip For Next Generation of HD Multimedia and 3D Experience (Friday Nov. 12, 2010)
  Amlogic today announced the availability of Amlogic's newest high-performance HD computing platform, the AML8726-M system on chip (SoC). This new SoC is powered by Amlogic's proprietary HD video decoding engine, an ARM® Cortex™-A9 processor and an ARM Mali™-400 GPU and produces world-class performance for full 3D gaming.
  
  
• eASIC and Radiocomp Deliver Low Power 6G CPRI v4.1 REC Solution (Tuesday Nov. 09, 2010)
  eASIC and Radiocomp today announced the immediate availability of a low power CPRI v4.1 solution for Radio Equipment Controller (REC) equipment. Using the low power transceivers on eASIC Nextreme-2T NEW ASICs, and the industry proven CPRI v4.1 REC IP core from Radiocomp, the solution consumes only 190 mW per channel at 6.144 Gbps.
  
  
• Microsemi Unveils 65-nm Embedded Flash Platform (Monday Nov. 08, 2010)
  Microsemi announced that its SOC Products Division, formerly known as Actel Corporation, today unveiled its new 65nm embedded flash platform, on which the company's next generation flash-based customizable SOCs (system-on-chips) will be built.
  
  
• Freescale announces its most powerful and versatile 32-bit microcontrollers for automotive applications (Monday Nov. 08, 2010)
  Freescale Semiconductor today announced its next-generation 32-bit MCUs designed specifically for automotive applications. The new Qorivva microcontroller (MCU) families, based on Power Architecture® technology, are built using a unique 55 nanometer (nm) non-volatile memory (NVM) process for improved power efficiency and cost effectiveness.
  
  
• Avago Technologies First to 28-Gbps Performance with 40-nm SerDes (Thursday Nov. 04, 2010)
  Avago Technologies today announced that it has demonstrated 28-Gbps Serializer/Deserializer (SerDes) performance in 40-nm CMOS process technology.
  
  
• Gennum Advances 10G EPON Technology for FTTx Deployments (Tuesday Oct. 26, 2010)
  Gennum has extended its portfolio of 10G EPON (Ethernet Passive Optical Network) offerings aimed at equipment serving FTTx installations.
  
  
• Gennum Delivers World's Fastest Crosspoint Switch (Tuesday Oct. 26, 2010)
  Gennum today introduced the industry’s first 2x2 crosspoint switch capable of supporting data rates in excess of 14 gigabits per second (Gbps) per port.
  
  
• K-micro initiates development of IEEE 1901 compliant PLC LSI (Tuesday Oct. 26, 2010)
  K-micro announced that it is developing a PLC (power line communication) LSI that is compliant with the recently approved IEEE1901 standard.
  
  
• Rochester Electronics Provides Industry's Only Established Semiconductor Replication Process (Wednesday Oct. 20, 2010)
  As the world’s largest authorized manufacturer of discontinued semiconductors, Rochester Electronics has established a process that provides customers with a replica device that matches the original semiconductor’s physical features, layer–by-layer and pin-for-pin, and is guaranteed to perform exactly as the original.
  
  
• NXP LPC1100L and LPC1300L MCUs Based on ARM Cortex-M Series Achieve Industry's Lowest 32-Bit Operating Power (Tuesday Oct. 19, 2010)
  NXP today unveiled its LPC1100L and LPC1300L microcontrollers, which have set new benchmarks in 32-bit active power consumption. The LPC1100L and LPC1300L series introduce a new low-power platform which combines ultra-low leakage design techniques with NXP’s optimized power-efficient libraries.
  
  
• Mindspeed Collaborates with ArrayComm and Continuous Computing on Scalable, Single-Chip 4G Basestation Solutions (Monday Oct. 18, 2010)
  Mindspeed today announced that it is collaborating with ArrayComm LLC and Continuous Computing Corporation on a complete commercial eNodeB solution for LTE-frequency division duplex (LTE-FDD) and LTE-Time Division Duplex (LTE-TDD) mobile networks.
  
  
• Sequans Announces New WiMAX System-in-Package (Monday Oct. 18, 2010)
  Sequans unveiled its latest Mobile WiMAX solution, the SQN1280, an all-in-one WiMAX system-in-package (SIP) for makers of handsets, tablets, USB sticks, portable hotspots, M2M modules, and a variety of consumer electronics devices