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Fabless / IDM News

• Lantiq Announces World's First GPON SoC Family with Integrated Optical Control Circuitry featuring breakthrough level of Integration for Next Generation Networks (Monday Oct. 18, 2010)
  Lantiq today introduced the world's first GPON (Gigabit Passive Optical Network) System-on-Chip (SoC) with integrated optical control circuitry for Optical Network Termination (ONT) applications.
  
  
• NXP Introduces New Energy Metering Chip (Monday Oct. 11, 2010)
  NXP Semiconductorstoday announced the EM773 energy metering IC – the world‘s first 32-bit ARM™-based solution designed specifically for non-billing electricity metering applications.
  
  
• LSI Accelerates Innovation with 28nm Custom Silicon Platform (Wednesday Oct. 06, 2010)
  LSI today announced the availability of its 28nm custom silicon platform that includes a broad portfolio of intellectual property (IP) blocks and an advanced design methodology for custom systems-on-a-chip (SoC).
  
  
• eASIC Enables Early Rollout of On-Ramp Wireless' eNODE Solutions (Wednesday Oct. 06, 2010)
  
  
  
• LSI Introduces Its First Standard Product System-on-a-Chip for Hard Disk Drive Manufacturers (Tuesday Oct. 05, 2010)
  LSI today announced the TrueStore® SC9500, a 40-nanometer application specific standard product (ASSP) system-on-a-chip (SoC) for the notebook and desktop hard disk drive (HDD) market segments. Now sampling to HDD manufacturers, the SC9500 is the first LSI™ standard product SoC including integrated LSI hard disk controller, low-density parity check (LDPC) read channel and serial PHY integrated circuits.
  
  
• Silicon Image Unveils First MHL Products (Monday Oct. 04, 2010)
  Silicon Image today announced the availability of its first products that include support for the new MHL™ (Mobile High-Definition Link) standard – an MHL transmitter, an MHL-to-HDMI (High-Definition Multimedia Interface) bridge and an MHL-enabled HDTV port processor.
  
  
• Movidius brings HD 3D to mobile devices (Thursday Sep. 30, 2010)
  Movidius today launched Myriad 3D, its landmark mobile 3D imaging and video platform. Myriad 3D is the first platform in the world to be optimized out-of-the-box to enable a 3D experience in high definition (HD) on mobile devices, allowing handset designers for example to easily produce a whole new generation of 3D-enabled smartphones.
  
  
• Fujitsu 2nd Generation 8-bit MCU with Embedded FRAM Delivers Key Features (Thursday Sep. 23, 2010)
  Fujitsu Semiconductor Europe today introduced the 2nd generation single-chip 8-bit MCU featuring embedded FRAM (Ferroelectric Random Access Memory). The single-chip MB95R203A protects high-speed write operations against power supply interruption; eliminates chip-to-chip interconnect and maximises transaction speed and efficiencies.
  
  
• KaiSemi offers FPGA-to-ASIC replacement with a *Zero NRE* model (Thursday Sep. 16, 2010)
  Using what they describe as "a breakthrough in automated FPGA-to-ASIC conversion," fabless semiconductor company KaiSemi say that they can provide customers with a seamless, full turnkey FPGA-to-ASIC solution and sell fully compatible replacement chips at a fraction of the price.
  
  
• GigOptix to Launch 40G and 100G Bundled Solutions (Wednesday Sep. 15, 2010)
  GigOptix today announced that it will showcase its 40G and 100G Bundled Solutions. The Bundled Solutions represent what GigOptix believes is an industry first for a company providing a complete solution set comprised of a Transimpendance Amplifier (TIA), Thin Film Polymer on Silicon (TFPS(TM)) Mach-Zehnder Modulator (MZM) with a matched driver for an optical application.
  
  
• Fujitsu Launches Second Generation Ultra-fast 65GSa/s 8-Bit ADC Technology for 100G Optical Transport (Monday Sep. 13, 2010)
  Fujitsu Semiconductor Europe announces its second generation 8-bit CHArge-mode Interleaved Sampler (CHAIS) ADC for optical transport designs based on coherent detection. The new generation supports data rates from 55 to 65GSa/s and is based on the same ground-breaking ADC architecture as Fujitsu’s 56GSa/s CHAIS ADC in 65nm.
  
  
• Symwave and Fresco Logic Achieve Unsurpassed Levels for Real-Life USB 3.0 Performance (Monday Sep. 13, 2010)
  Symwave and Fresco Logic today announced their successful demonstration of the world’s highest performance USB 3.0 system achieving over 370MB/s. In this real-world demonstration using a commercially available PC, the Fresco FL1009 Host controller is connected to a USB 3.0 external storage device controlled by Symwave’s SW6318 USB 3.0 SuperSpeed RAID Storage controller, and a pair of solid state drives (SSDs).
  
  
• Trident and ARM Join Forces to Deliver a Web-Enabled Set-top Box Platform for Next Generation Internet TV Services (Friday Sep. 10, 2010)
  Trident Microsystems and ARM announced today that they have brought together all the key Web 2.0 and broadcast elements on a powerful set-top box (STB) platform that can enable consumers to seamlessly view TV programming, run rich internet applications, browse websites and share content anytime and anywhere in the home.
  
  
• Samsung Introduces High Performance, Low Power Dual CORTEX-A9 Application Processor for Mobile Devices (Tuesday Sep. 07, 2010)
  Samsung Electronics today introduced its new 1GHz ARM® CORTEX A9-based dual-core application processor, codenamed Orion, for advanced mobile applications.
  
  
• SMSC Samples Industry's First USB 3.0 Graphics Technology (Tuesday Sep. 07, 2010)
  SMSC today announced its ViewSpan USB 3.0 remote graphics technology for multiple displays. By utilizing ubiquitous USB connectivity as a display interface, ViewSpan brings versatility, expandability, and plug-and-play simplicity to the way consumers interact with their personal computers.
  
  
• Toshiba launches 24nm process NAND flash memory (Wednesday Sep. 01, 2010)
  Toshiba has announced that it today started mass production of NAND flash memories fabricated with 24nm process technology. This latest technology advance has already been applied to 2bit-per-cell 64-gigabit (Gb) chips that are the world's smallest and offer the highest density on a single chip (8 gigabytes (GB)) , and which are available from today.
  
  
• Aptina Unveils 8MP Complete Camera Solution (Tuesday Aug. 31, 2010)
  Aptina today announced the availability of its new feature-rich 8MP CCS8140 imaging solution. The CCS8140 solution combines a high-quality MT9E013 8MP CMOS image sensor with an Aptina™ MT9E311 imaging co-processor while maintaining speeds similar to a standalone image processor.
  
  
• Mindspeed to Present Next Generation of 4G Base Station Technology (Tuesday Aug. 24, 2010)
  The Transcede family of SoCs integrates an unprecedented 26 programmable processors into a single device, including two ARM(R) Cortex A9(R) multi-core symmetric multiprocessing (SMP) reduced instruction set computer (RISC) processors, ten CEVA (R) digital signal processors (DSPs) and ten DSP accelerators that support the complete wideband code-division multiple access (W-CDMA), LTE or WiMAX (Layers 1, 2 and above) processing needs of single- and multi-sector base stations.
  
  
• Advantech and NetLogic Microsystems Announce 40Gbps AdvancedTCA Platform (Monday Aug. 23, 2010)
  Advantech and NetLogic Microsystems today announced their collaboration to deliver the industry’s most advanced 40-Gbps AdvancedTCA (ATCA) platform using NetLogic Microsystems’ XLP™ multi-core, multi-threaded processors with 64 NXCPUs™, knowledge-based processors, and 10GE PHY solutions.
  
  
• Lantiq's New Wireless LAN Chips Set Benchmarks for Reach and Robustness (Monday Aug. 23, 2010)
  Lantiq today introduced its latest 802.11n WLAN solutions -- the XWAY™ WAVE300 family. Featuring advanced beam-forming technology and an integrated "Thick MAC" processor, WAVE300 has been demonstrated to deliver up to 300 percent increased reach and radio coverage compared to existing solutions, while maintaining links with a minimum or even zero-packet-error rate requirement.
  
  
• Lantiq Announces Family of Gigabit Speed Gateway Processors with Industry Leading Performance, Flexibility to Support New Digital Home Services (Monday Aug. 23, 2010)
  Lantiq today announced the addition of three single-chip Gigabit Ethernet gateway solutions to its XWAY™ xRX family. The new GRX series meets the Gigabit processing requirements of DOCSIS3.0, VDSL2 and xPON access technologies and provides best-in-class performance for wireless connectivity, such as concurrent operation of 802.11n WLAN at 2.4 and 5 GHz with aggregate throughput up to 270 Mbps (Megabits per second).
  
  
• Intel, Micron First to Sample 3-Bit-Per-Cell NAND Flash Memory on Industry-Leading 25-Nanometer Silicon Process Technology (Wednesday Aug. 18, 2010)
  Intel and Micron Technology today announced the delivery of 3-bit-per-cell (3bpc) NAND flash memory on 25-nanometer (nm) process technology, producing the industry's highest capacity, smallest NAND device.
  
  
• MIT Spin-Out Lyric Semiconductor Launches a New Kind of Computing With Probability Processing Circuits (Tuesday Aug. 17, 2010)
  Lyric Semiconductor, Inc. a DARPA- and venture-funded MIT spin-out, today emerged from stealth mode to launch a new technology called probability processing, which is poised to deliver a fundamental change in processing performance and power consumption.
  
  
• TI announced as the first licensee of the next generation ARM Cortex-A series processor core (Monday Aug. 09, 2010)
  Texas Instruments Incorporated (TI) today confirmed that it was the first company to partner with ARM in the conception and definition of the next generation ARM® Cortex™-A series processor core (also known as "Eagle") to be announced later this year. TI intends to use the new processor to further strengthen and extend its future OMAP™ platform offerings.
  
  
• STMicroelectronics Advances Set-Top Box Chip Features for Emerging Markets (Wednesday Aug. 04, 2010)
  STMicroelectronics has announced its latest decoder chip for low-cost, standard-definition equipment targeting fast-growing markets such as China and Eastern Europe, as well as India, where In-Stat expects pay-TV subscriber numbers to reach 90 million by 2012.
  
  
• BroadLight Announces the Launch of our 3rd Generation 40nm GPON Fiber Access Processor Family (Monday Aug. 02, 2010)
  BroadLight announced today the release of its 3rd Generation GPON Processor family. The BL23500 3rd Generation GPON Processor family is the first 40nm set of devices designed for the fiber access mass market, and feature the most cost effective implementation, lowest power consumption and the lowest cost of manufacturing of any chip in its class.
  
  
• New-Generation Microprocessor from STMicroelectronics Targets High-Performance Connectivity and Embedded Applications (Thursday Jul. 29, 2010)
  STMicroelectronics today introduced the industry's first embedded microprocessor that couples two ARM Cortex-A9 cores with a DDR3 memory interface. Manufactured in ST's low-power 55nm HCMOS (high-speed CMOS) process technology, the SPEAr1310 delivers high computing power and customizability for multiple embedded applications together with the high level of cost competitiveness offered by system-on-chip devices.
  
  
• NetLogic Microsystems Announces Breakthrough Multi-Core Processor Solution which Integrates 128 NXCPUs (Monday Jul. 26, 2010)
  NetLogic today announced the innovative XLP8128S multi-core communications processor solution that integrates 128 NXCPUs™ and over 160 programmable processing engines to deliver an unprecedented 160Gbps throughput and 240 million packets-per-second (Mpps) of intelligent application performance for next-generation 3G/4G mobile wireless infrastructure,
  
  
• Samsung First to Begin Mass Producing 2-Gigabit Green DDR3 Using 30nm Class Technology (Wednesday Jul. 21, 2010)
  Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first two-gigabit (Gb) Green DDR3 using 30 nanometer (nm) class* process technology.
  
  
• Renesas Electronics Introduces New USB 3.0 Host Controller with 85 Percent Reduced Power Consumption (Thursday Jul. 15, 2010)
  Renesas Electronics today announced the availability of its new SuperSpeed Universal Serial Bus (USB 3.0) host controller, featuring 85 percent reduced power consumption compared to the company's existing host controller when peripheral devices, such as mice, are not connected to the ports.