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IP / SOC Products News

• Blueshift Memory and Crypta Labs to develop quantum-resilient cybersecurity memory module (Monday Jun. 19, 2023)
  Blueshift Memory, designer of a novel proprietary high-speed memory architecture, has announced that it has signed an agreement with Crypta Labs, developer of a quantum random number generator (QRNG) for resilient encryption, to create a cybersecurity memory solution that will be capable of countering threats from quantum computing.
  
  
• Creonic Releases Ultrafast BCH Decoder IP Core, Processing One Codeword per Clock Cycle (Friday Jun. 16, 2023)
  Creonic GmbH, a leading IP core provider in the field of communications, today announced immediate availability of its Ultrafast BCH Decoder. Its unique pipeline architecture allows it to decode one BCH codeword per clock cycle, achieving tremendous data rates.
  
  
• DFSPI IP Core from DCD supports all serial memories available on the market. (Friday Jun. 16, 2023)
  Digital Core Design, the leading IP Core provider and System-on-Chip design house, presents its latest DFSPI IP Core for access to NOR and NAND Flash Devices.
  
  
• M31 Has Expanded MIPI IP Portfolio, Successfully Validated 7nm MIPI C/D PHY Combo IP (Friday Jun. 16, 2023)
  M31 Technonolgy Corporation (M31), a global professional silicon intellectual property (IP) provider, announced that the MIPI C/D-PHY Combo IP has completed 7nm silicon validation and also has been taped out on 5nm process.
  
  
• proteanTecs Achieves ASIL-B Automotive Functional Safety Certification (Wednesday Jun. 14, 2023)
  proteanTecs announced today that the company’s IP for system-on-chip (SoC) health and performance monitoring and die-to-die interconnect monitoring has received Automotive Safety Integrity Level B (ASIL-B) certification.
  
  
• Alphawave Semi Expands Collaboration with Samsung, Adds 3nm Connectivity IP to Meet Accelerated AI and Data Center Demand (Wednesday Jun. 14, 2023)
  3nm Connectivity IP Unleashes Unprecedented Performance in Chiplet-Enabled Silicon Platforms to power next generation AI and data centers
  
  
• Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes (Wednesday Jun. 14, 2023)
  Synopsys Interface & Foundation IP for Samsung 8LPU, SF5(A), SF4(A) and SF3 Processes Accelerate Path to Silicon Success for Advanced SoC Designs
  
  
• Movellus Announces Industry-First Integrated Droop Response System for SoCs (Tuesday Jun. 13, 2023)
  Movellus, today announced an industry-first integrated droop response system. This innovative solution is designed to simultaneously address the challenges of voltage droop and enable fine-grained DVFS capability, which in combination can significantly reduce the power consumption of complex integrated circuits while increasing operational reliability.
  
  
• Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs (Tuesday Jun. 13, 2023)
  Achronix Semiconductor Corporation, a global leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, is thrilled to announce that the Achronix Network Infrastructure Code (ANIC) includes 400 Gigabit Ethernet (GbE) connectivity.
  
  
• Arasan announces the Industry's First CAN FD Light Bus Controller IP (Thursday Jun. 08, 2023)
  Arasan, a leading provider of semiconductor IP for all things mobile, including automobiles announces the Industry's First CAN FD Light IP Compliant to the CiA 604-1 CAN FD Light specification
  
  
• VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution (Tuesday Jun. 06, 2023)
  VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) solution has passed the Bluetooth 5.3 certification issued by Bluetooth SIG. This complete BLE solution integrates VeriSilicon’s self-developed radio frequency (RF) IP, baseband IP, and software protocol stack, offering a one-stop solution compliant with the Bluetooth Core Specification Version 5.3.
  
  
• Agile Analog launches first complete RISC-V analog IP subsystem at RISC-V Summit Europe (Monday Jun. 05, 2023)
  The initial subsystem includes all the analog IP required for a typical battery powered IoT system, including a power management unit (PMU), a sleep management unit (SMU), and data converters. This unique, process agnostic, customizable and digitally wrapped analog IP subsystem will help solve many of the issues that System on Chip (SoC) designers currently encounter, as it pairs with a RISC-V core to form a complete solution.
  
  
• Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling (Thursday Jun. 01, 2023)
  Semidynamics has announced its new, entirely customisable Vector Unit to go with its innovative range of fully customisable 64-bit RISC-V cores. The Vector Unit is totally compliant with the RISC-V Vector Specification 1.0 with many, additional, customisable features to provide enhanced data handling capabilities.
  
  
• Xiphera extends its Transport Layer Security product family (Thursday Jun. 01, 2023)
  Xiphera extends its Transport Layer Security (TLS) product family with new client and server IP cores for FPGA and ASIC circuits, introducing TLS 1.3 server side functionalities and wider feature coverage of TLS 1.3.
  
  
• New Arm Total Compute Solutions enable a mobile future built on Arm (Monday May. 29, 2023)
  Today we are announcing Arm Total Compute Solutions 2023 (TCS23), which will be the platform for mobile computing, offering our best ever premium solution for smartphones. TCS23 delivers a complete package of the latest IP designed and optimized for specific workloads to work seamlessly together as a complete system.
  
  
• Nanusens announces that it can now create ASICs with embedded sensors (Thursday May. 25, 2023)
  Now both sensor and its control circuit can be shrunk simultaneously as IP blocks to required CMOS process node to create ASICs with integrated sensors
  
  
• Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets (Wednesday May. 24, 2023)
  Blue Cheetah Analog Design, the leader in rapidly customized die-to-die (D2D) interconnect IP solutions for chiplets, announced its latest successful silicon bring-up of its advanced 2-16 Gbps BlueLynx D2D interconnect IP in a 12nm test chip.
  
  
• Imagination launches IMG CXM, the smallest GPU to bring effortless user interfaces into homes (Tuesday May. 23, 2023)
  Imagination Technologies is bringing seamless visual experiences to cost-sensitive consumer devices with the new IMG CXM GPU range which includes the smallest GPU to support HDR user interfaces natively.
  
  
• K-Best MIMO Decoder IP Core Available For Immediate Integration From Global IP Core (Friday May. 19, 2023)
  The MIMO Decoder accepts two independent input streams, and the channel estimation matrix. The inputs to the MIMO Decoder are the estimated channel matrix and the received vector of symbols.
  
  
• SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging (Thursday May. 18, 2023)
  A long time of waiting ended this week for Siliconally. We got our test chip, called GigaPHY, back from fabrication and packaging.
  
  
• proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment (Thursday May. 18, 2023)
  proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that the company’s die-to-die interconnect monitoring agents passed the pre-silicon IP assessment stage in the TSMC9000 quality program.
  
  
• Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP (Thursday May. 18, 2023)
  Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its SUREBOOT™ Total xSPI IP Solution which now includes the xSPI PHY IP.
  
  
• Arasan announces the immediate availability of its 2nd Generation MIPI D-PHY for GlobalFoundries 22nm SoC Designs (Wednesday May. 17, 2023)
  Arasan Chip Systems announces the immediate availability of its 2nd generation MIPI D-PHY IP products supporting MIPI D-PHY v1.1 at upto 1.5gbps and MIPI D-PHY v1.2 supporting speeds of upto 2.5gbps for GlobalFoundries 22nm SoC designs redesigned for ultra low power consumption and area.
  
  
• Andes Technology Announces The New Product Line, AndesAIRE™, Ultimately Efficient AI/ML Solutions For Edge And End-Point Inference (Monday May. 15, 2023)
  Andes Technology today announced the launch of new product line, AndesAIRE™ or Andes AI Runs Everywhere, ultimately efficient solutions designed for edge and end-point inference, including the first generation of AI/ML hardware accelerator intellectual property (IP), the AndesAIRE™ AnDLA™ I350 (Andes Deep Learning Accelerator), and the neural network software tools and runtimes, the AndesAIRE™ NN SDK.
  
  
• Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard (Wednesday May. 10, 2023)
  Creonic GmbH, a leading IP core provider in the field of satellite communications, today introduced its latest LDPC forward error correction solution for passive optical networks (PON).
  
  
• NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry (Thursday May. 04, 2023)
  NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced the launch of its ground-breaking technology, 3D X-DRAM™.
  
  
• M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies (Thursday Apr. 27, 2023)
  M31 Technology Corporation (M31), a global professional silicon intellectual property (IP) provider, announced that USB3.2 PHY IP has passed silicon validation on TSMC's 7nm process. In addition, M31's MIPI C/D-PHY Combo IP was already taped out on TSMC's 5nm process.
  
  
• Xiphera adds lightweight cryptography to its stream cipher portfolio (Thursday Apr. 27, 2023)
  Xiphera releases XIP2201B, an IP core which supports the Ascon lightweight cryptographic suite. This IP core is especially useful for small devices used in Industrial IoT.
  
  
• Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies (Thursday Apr. 27, 2023)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC).
  
  
• Creonic Introduces FEC IP Core Solution for SDA Free-Space Optical OCT V3.0 Standard (Thursday Apr. 27, 2023)
  Creonic today revealed its latest solution for free-space optical (FSO) communications with immediate availability. The Space Development Agency (SDA) introduced the Optical Communications Terminal (OCT) Standard V3.0 with the intention to enable interoperability between optical communication terminals where at least one endpoint is space-based.