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IP / SOC Products News

• Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications (Wednesday Apr. 26, 2023)
  Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world’s technology infrastructure, today announced the bring-up of its first connectivity silicon platform on TSMC’s most advanced 3nm process with its ZeusCORE Extra-Long-Reach (XLR) 1-112Gbps NRZ/PAM4 serialiser-deserialiser (“SerDes”) IP.
  
  
• Agile Analog launches innovative digitally wrapped analog IP subsystems (Tuesday Apr. 25, 2023)
  Agile Analog, the customizable analog IP company, has launched its first range of analog subsystems, covering power management, PVT sensing, and sleep management. These innovative, digitally wrapped subsystems significantly reduce the effort required to integrate multiple analog IPs into any ASIC by allowing the IP to be dropped straight into a digital design flow and connected via a standard peripheral bus, such as AMBA APB.
  
  
• Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology (Tuesday Apr. 25, 2023)
  Attopsemi, a provider of cutting-edge One-Time Programmable (OTP) IP solutions, is excited to announce successful silicon proven of I-fuse® to 12nm FinFET processes using metal as fuse material.
  
  
• Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology (Tuesday Apr. 25, 2023)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.
  
  
• Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process (Tuesday Apr. 25, 2023)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today unveiled its 112G Extended Long-Reach (112G-ELR) SerDes IP on TSMC’s N4P process for hyperscale ASICs, artificial intelligence/machine learning (AI/ML) accelerators, switch fabric system-on-chips (SoCs) and 5G wireless infrastructure.
  
  
• Rapid Silicon Launches Vega eFPGA IP for Programmable Solutions (Tuesday Apr. 25, 2023)
  Rapid Silicon, a provider of AI and intelligent edge-focused FPGAs based on open-source technology, today announced the launch of its Vega eFPGA IP.
  
  
• Flex Logix Announces InferX™ High Performance IP for DSP and AI Inference (Monday Apr. 24, 2023)
  InferX joins EFLX® eFPGA as Flex Logix’s second IP offering. It can be used by device manufacturers and systems companies that want the performance of a DSP-FPGA or a AI-GPU in their SoC, but at a fraction of the cost and power
  
  
• Dilithium core complements Xiphera's xQlave® family of post-quantum cryptography (Monday Apr. 24, 2023)
  Xiphera announces an implementation of CRYSTALS-Dilithium, a new product in the xQlave® family of quantum-secure IP cores. CRYSTALS-Dilithium algorithm was selected as the primary digital signature algorithm for Post-Quantum Cryptography (PQC) by the US National Institute of Standards and Technology (NIST).
  
  
• Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY (Thursday Apr. 20, 2023)
  The Rambus GDDR6 PHY delivers a market-leading data rate of up to 24 Gigabits per second (Gb/s), providing 96 Gigabytes per second (GB/s) of bandwidth per GDDR6 memory device. As part of a system-level solution, the Rambus GDDR6 offering enables cost-efficient, high-bandwidth memory performance for AI/ML, graphics and networking applications.
  
  
• eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions (Tuesday Apr. 18, 2023)
  eMemory announced that its security-enhanced version of One-Time Programmable (OTP), NeoFuse, has been qualified on the TSMC N5 process. Another design tape-out for OTP solutions to qualify for the TSMC N5A process will be in the second quarter 2023, focusing on automotive applications.
  
  
• Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps (Tuesday Apr. 18, 2023)
  Cadence Design Systems today announced that it has demonstrated interoperability between the silicon-proven Cadence® LPDDR5X memory interface IP and SK hynix’s LPDDR5T (Turbo) mobile DRAM, operating at speeds in excess of the LPDDR5X standard.
  
  
• Semidynamics launches world's first fully customisable RISC-V IP cores (Monday Apr. 17, 2023)
  Semidynamics, the only provider of fully configurable RISC-V processor IP, has announced the world’s first, fully customisable, 64-bit RISC-V family of cores that are ideal for handling large amounts of data for applications such as AI, Machine Learning (ML) and High-Performance Computing (HPC).
  
  
• DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core (Monday Apr. 17, 2023)
  The DVB-S2X LDPC Decoder is a powerful FEC core decoder for Digital Video Broadcasting via Satellite. It implements extensions to the DVB-S2 design for better performance and efficiency as well as robust service availability.
  
  
• CryptOne IP Core is ready for post-quantum reality (Friday Apr. 14, 2023)
  Polish IP Core & SoC provider will present these solutions on 24th of April during IP SoC Silicon Valley and RSA Conference in San Francisco.
  
  
• VeriSilicon Brings Super Resolution Technology to Smart Display (Thursday Apr. 13, 2023)
  VeriSilicon (688521.SH) today announced the launch of its super resolution IP SR2000. With the ability to increase the resolution and quality of low-resolution video sources, SR2000 enables low-resolution video streams to be displayed at the edge with high resolution and image quality, while lowering network bandwidth.
  
  
• Tiempo Secure and GreenWaves Technologies demonstrate Secure Element role as Master in an embedded system (Wednesday Apr. 12, 2023)
  GreenWaves Technologies and Tiempo Secure have demonstrated the advantages of giving the role of Master to a Secure Element integrated in a System-on-Chip: this architecture significantly enhances the security of the SoC, while making the implementation more efficient.
  
  
• GUC Taped Out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP using TSMC Advanced Packaging Technology (Thursday Apr. 06, 2023)
  Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking applications.
  
  
• Allegro DVT Announces the Industry's First MPEG-5 LCEVC Decoder Silicon IP (Tuesday Apr. 04, 2023)
  Allegro DVT, a leading provider of silicon video IP solutions announces the availability of its D301, the first MPEG-5 Low Complexity Enhancement Video Coding (LCEVC) decoder IP solution.
  
  
• sureCore pushes the SRAM voltage envelope to below 0.5V for the first time (Tuesday Apr. 04, 2023)
  SureCore has exploited its low power design capability to create a new range of ultra-low voltage SRAM solutions, called PowerMiser™ Plus, that can operate down to 0.45V, enabling customers to create market leading, low power products.
  
  
• ULTRARAM™ universal computer memory to be commercialised (Tuesday Apr. 04, 2023)
  Lancaster University is to create a spinout company to commercialise the universal computer memory technology ULTRARAM™.
  
  
• Mobiveil's PSRAM Controller IP Lets SoC Designers Leverage AP Memory's Xccela x8/x16 250 MHz PSRAM Memory (Tuesday Mar. 28, 2023)
  Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced it is working with AP Memory, a market leader in PSRAM devices, to bring new IP controller targeting modem, connectivity, smart IoT, edgeAI, display and wearables applications.
  
  
• eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification (Tuesday Mar. 28, 2023)
  eMemory and UMC today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, adding to UMC’s comprehensive embedded memory offering for AIoT and mobile applications.
  
  
• OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip (Thursday Mar. 23, 2023)
  OPENEDGES Technology, Inc. (OPENEDGES) today released a detailed update on the successful completion of the first tape out of an advanced 7nm process technology test chip for its HBM3 memory subsystem IP, including the PHY and memory controller.
  
  
• Introducing Signature IP Corporation - Providing a Configurable And Flexible Platform for SoC Development (Wednesday Mar. 15, 2023)
  Signature IP’s initial products are focused on fast and flexible implementation of Networks-on-Chip (NoCs), with future products enabling a platform-based approach to SoC development which is physically-aware and NoC-aware, delivering industry-standard interfaces and interconnect within and between silicon dies.
  
  
• VeriSilicon delivered multi-format hardware video decoder Hantro VC9000D supporting 8K@120FPS VVC/H.266 to customers (Wednesday Mar. 15, 2023)
  VeriSilicon today announced its multi-format hardware video decoder Hantro VC9000D is now available to support the decoding of the latest VVC/H.266 (Versatile Video Coding) video compression standard, providing flexible and configurable advanced video decoding solutions for data centers, HDTVs, high-end smartphones and other devices.
  
  
• Codasip and IAR demonstrate dual-core lockstep for RISC-V (Tuesday Mar. 14, 2023)
  Codasip and IAR deliver new possibilities for low-power embedded automotive applications through the award-winning Codasip L31 core and the safety-certified version of the development toolchain IAR Embedded Workbench for RISC-V.
  
  
• Creonic Today Revealed Its New CCSDS 131.2 Wideband Demodulator IP Core with Immediate Availability (Tuesday Mar. 14, 2023)
  Creonic GmbH, an industry leading IP core provider in the communications market, today revealed its new CCSDS 131.2 Wideband Demodulator.
  
  
• Rambus Expands Industry-Leading Security IP Portfolio with Arm CryptoCell and CryptoIsland IP (Monday Mar. 13, 2023)
  For over three decades, Rambus has been providing industry-leading Secure Silicon IP solutions to protect Data-at-Rest, Data-in-Use, and Data-in-Motion. Today, Rambus is excited to announce it will be offering the Arm® CryptoCell™ and CryptoIsland™ security IP portfolio. Going forward, semiconductor design teams will now be able to license this IP directly from Rambus.
  
  
• Intrinsic ID Launches Software to Protect Billions of Smart, Connected Devices Addressing Worldwide Cybersecurity Challenges (Monday Mar. 13, 2023)
  Intrinsic ID Zign Gives Every Connected Device a Unique Identity and Strong Security Basis to Protect Against Malicious Intrusion, Ensure Trusted Communication and Comply with Latest Legislation
  
  
• ASICFPGA releases new ISP core supporting AXI4-Lite, AXI4-Stream, new AE, and new AWB (Friday Mar. 10, 2023)
  ASICFPGA has announced the release of a new ISP core and demo board that supports AXI4-Lite, AXI4-Stream interface, new AE, and new AWB.