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IP / SOC Products News

• CEVA Introduces UWB Radar Platform for Automotive Child Presence Detection to Meet Emerging Safety Specifications (Thursday Mar. 09, 2023)
  RivieraWaves™ UWB Radar delivers robust sensing of object movements and breathing micro-movements for a wide suite of applications, including automotive child presence detection and gesture control, cot infant monitoring, and power-saving presence detection in laptops, TVs and smart buildings
  
  
• Blueshift Memory to use Codasip custom compute to develop new memory-efficient processor technology (Thursday Mar. 09, 2023)
  Blueshift Memory, designer of a novel proprietary high-speed memory architecture, has announced that it is using Codasip Studio tools to integrate RISC-V processor IP into an FPGA-based design for memory architecture, modifying the Codasip core to maximize memory bandwidth.
  
  
• CAST Announces Very Versatile I2S-TDM Digital Audio Transceiver IP Core (Wednesday Mar. 08, 2023)
  Extremely configurable transceiver core can provide an efficient serial audio interface for nearly every system and application.
  
  
• Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit (Wednesday Mar. 08, 2023)
  Building upon its longstanding expertise in semiconductor design, Tiempo Secure is proud to announce its TESIC RISC-V Secure Element IP, which brings an unprecedented level of security to embedded systems, it is certification-ready for Common Criteria EAL 5+ level, and makes SoC development easy thanks to its integration with the complete RISC-V ecosystem.
  
  
• Socionext Introduces New 7nm ADC and DAC for 5G Direct RF Transmitters and Receivers (Wednesday Mar. 08, 2023)
  Socionext launches a new high-speed Direct RF data converter PHY solution. The IPs were developed in TSMC 7nm FinFET (N7) process technology to allow straightforward integration for 32TRX and 64TRX single die solutions and lower power consumption compared to discrete solutions currently available in the market.
  
  
• sureCore announces range of off-the-shelf, ultra-low power memory IP to help fast-track power critical designs (Wednesday Mar. 08, 2023)
  In order to speed up design times for customers, sureCore has launched a range of off-the-shelf, ultra-low power memory IP that is available for use at the most popular industry nodes.
  
  
• Orca Launches ORC5000 Platform for Low-Power ASIC Designs (Wednesday Mar. 08, 2023)
  Orca’s new ORC5000 ASIC platform has been applied to develop Orca’s first ASIC product, the ORC5990, designed for use in low-Earth orbit (LEO) IoT satellite payload and terrestrial IoT gateway designs. The company’s custom ASIC design, modem expertise and integration capabilities offer 10x performance enhancements over conventional FPGA-based system design with only a fraction of the power consumption.
  
  
• Weebit Nano ReRAM IP now available in SkyWater Technology's S130 process (Tuesday Mar. 07, 2023)
  Weebit Nano Limited (ASX:WBT), a leading developer of advanced memory technologies for the global semiconductor industry, and SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announce availability of Weebit’s resistive RAM (ReRAM) IP in SkyWater’s 130nm CMOS (S130) process.
  
  
• DVB-T2 Demodulator + Decoder LDPC/ BCH IP Core Available For Immediate Implementation From Global IP Core (Tuesday Mar. 07, 2023)
  Global IP Core Sales - The new DVB-T2 demodulator is designed to be used together with an RF tuner, and an analog to digital converter. The system has an internal state machine to control the operation, and can be externally configured via the SPI interface
  
  
• OPENEDGES Announces LPDDR5X/5/4x/4 PHY Tapeout at 7nm process node (Monday Mar. 06, 2023)
  OPENEDGES today unveiled the tape out of the world’s first 7nm LPDDR PHY IP supporting LPDDR5x/5/4x/4 standards with a maximum data rate of 8533Mbps, providing more detailed information about the tape out.
  
  
• New controller IP core for secure data (Monday Mar. 06, 2023)
  Increasing system attacks and cybercrime make it necessary to secure data in new ways. For this purpose, the Fraunhofer Institute for Photonic Microsystems IPMS developed the MACsec Controller IP-Core, which implements the latest Ethernet security standards. It provides authentication, integrity and encryption of data between different nodes of a Local Area Network (LAN).
  
  
• BrainChip Introduces Second-Generation Akida Platform (Monday Mar. 06, 2023)
  This hyper-efficient yet powerful neural processing system, architected for embedded Edge AI applications, now adds efficient 8-bit processing to go with advanced capabilities such as time domain convolutions and vision transformer acceleration, for an unprecedented level of performance in sub-watt devices, taking them from perception towards cognition.
  
  
• CAST Enhances RISC-V Processor Line for Low-Power and Functional Safety Applications (Friday Mar. 03, 2023)
  Semiconductor intellectual property provider CAST today announced the immediate availability of a new deeply embedded, low-power RISC-V processor IP core and enhancements to its functional safety RISC-V processor IP core.
  
  
• Safety element for automobiles, production or health can be implemented on the own microcontroller chip: RISC-V processor AIRISC-SAFETY from Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Thursday Mar. 02, 2023)
  The Fraunhofer IMS welcomes a new member to its RISC-V processor product family AIRISC - the AIRISC-SAFETY. The AIRISC-SAFETY has been successfully certified as »ASIL-D ready« (automotive safety integrity level) by TÜV SGS according to ISO 26262 and is now ready for the market.
  
  
• Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C (Thursday Mar. 02, 2023)
  Floadia has completed qualification of its eFlash IP, G1, on 130BCD Plus process of TSMC, the world's largest semiconductor foundry. G1 passed the qualification criteria of data retention for 10 years at 125°C after 10,000 program and erase operations.
  
  
• Agile Analog announces first customisable, process agnostic, 12-bit ADC IP (Tuesday Feb. 28, 2023)
  Agile Analog, the analog IP innovators, has extended its range of data conversion IP with the introduction of the first customisable, process agnostic, 12-bit Analog to Digital Converter (ADC).
  
  
• Secure-IC & Trasna are introducing a revolutionary PUF solution that eliminates the need of enrollment phase (Thursday Feb. 23, 2023)
  Secure-IC, the rising leader and unique global provider of end-to-end cybersecurity solutions for embedded systems and connected objects, and Trasna, an IoT secure hardware and software specialist, announce today they have succeeded to offer a groundbreaking Physically Unclonable Function (PUF) solution.
  
  
• CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond (Thursday Feb. 23, 2023)
  Extending the company’s leadership in DSPs, the new CEVA-XC20 is based on a groundbreaking vector multi-threaded massive compute technology that is designed to address next-generation 5G-Advanced workloads across a broad spectrum of use cases.
  
  
• Arteris Unveils Next-Generation FlexNoC 5 Physically Aware Network-on-Chip IP (Wednesday Feb. 22, 2023)
  Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced the launch of Arteris FlexNoC 5 physically aware network-on-chip (NoC) interconnect IP.
  
  
• Accurate Positioning Systems and Proximity Solutions with CoreHW Bluetooth® AoA and AoD Antenna Modules (Friday Feb. 17, 2023)
  The Bluetooth-based indoor positioning solutions are becoming more popular technology due to their cost efficiency, low positioning errors, few necessary equipment, and a broad range of applications. In the following, we will introduce CoreHW’s Bluetooth® antenna modules, which are the main components of Bluetooth® direction finding and indoor positioning technology.
  
  
• The Six Semiconductor of OPENEDGES Technology Collaborates with imec.IC-link US to Tape-out Two 7nm Testchip (Thursday Feb. 16, 2023)
  The Six Semiconductor, Inc. (TSS), a subsidiary of OPENEDGES Technology, Inc and a leading supplier of cutting-edge high-speed memory PHYs in multiple standards, technologies, and foundries, announced today that it has successfully taped out two memory sub-system validation testchips at the same time in a 7nm process.
  
  
• DVB-RCS2 Turbo Decoder and Encoder IP Core Available For Integration From Global IP Core (Monday Feb. 06, 2023)
  Global IP Core Sales - The new DVB-RCS2 Turbo Encoder and Decoder IP Core is on the transmitter side, the turbo-phi encoder architecture is based on a parallel concatenation of two double-binary Recursive Systematic Convolutional (RSC) encoders, fed by blocks of K bits (N=K/2).
  
  
• BrainChip Tapes Out AKD1500 Chip in GlobalFoundries 22nm FD SOI Process (Monday Jan. 30, 2023)
  BrainChip, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, today announced that it has achieved tape out of its AKD1500 reference design on GlobalFoundries’ 22nm fully depleted silicon-on-insulator (FD-SOI) technology.
  
  
• Xiphera announces the first IP core for the quantum-secure xQlave™ product family (Monday Jan. 23, 2023)
  Xiphera introduces XIP6110B, the first member of the xQlave™ product family of quantum-secure cryptographic IP cores. XIP6110B implements CRYSTALS-Kyber Key Encapsulation Mechanism (KEM) that was recently selected as one of the four PQC algorithms to be standardised by the American NIST (National Institute of Standards and Technology).
  
  
• Certus Semiconductor releases ESD library in GlobalFoundries 12nm Finfet process (Friday Jan. 13, 2023)
  Certus is pleased to announce the release of our ESD library in GlobalFoundries 12nm Finfet process. It offers a wide range of generic voltage solutions: 0.8V, 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V for power domains and I/Os.
  
  
• Creonic DVB-GSE Encapsulator and Decapsulator IP Cores Are Now Available with Data Rates of up to 4Gbit/s (Thursday Jan. 12, 2023)
  Creonic GmbH today announced the performance optimization of its field-proven DVB-GSE Encapsulator and Decapsulator IP Cores. They close the gap between network protocols like Ethernet and the physical layer of DVB-Standards.
  
  
• Imagination's IMG DXT GPU unlocks scalable, premium ray tracing for all mobile gamers (Wednesday Jan. 11, 2023)
  Imagination Technologies launches IMG DXT, a groundbreaking ray tracing GPU that scales to unlock cutting-edge graphics for all mobile device users.
  
  
• Digital Blocks AMBA Peripherals I3C, I2C, eSPI, xSPI Controller IP Core Families Extend Leadership with enhancements containing feature-rich, system-level integration features. (Monday Jan. 09, 2023)
  Digital Blocks, a leading developer of silicon-proven semiconductor Intellectually Property (IP) soft cores for system-on-chip (SoC) ASIC, ASSP, & FPGA developers, announces updates to I3C, I2C, eSPI, xSPI Controller Verilog IP Core family offerings.
  
  
• CCSDS AR4JA LDPC Encoder and Decoder FEC IP Core Available For Licensing and Implementation from Global IP Core (Monday Jan. 09, 2023)
  The new CCSDS AR4JA LDPC Encoder and Decoder FEC IP Core is a configurable design that allows runtime configuration for decoding different code rates (i.e., 1/2, 2/3 and 3/4). To obtain high throughput, two different levels of parallelism are carried out; 128 check nodes and 6 variable nodes which are processed at the same time.
  
  
• Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars (Friday Jan. 06, 2023)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Cadence® Tensilica® HiFi DSP IP now supports Dolby Atmos® for cars, making it the first DSP IP with this capability. Cadence has optimized Dolby car experience technology to run on the Tensilica HiFi DSP for audio playback of Dolby Atmos for cars.