This section features posts from around the Web by authors with passion,
integrity, authority, and community support in the IP / SoC industry.
|
Huawei's 5G Phone
Mannerisms
-
David Manners
Aug. 31, 2023
|
|
|
|
A Step Closer to Post-Quantum Cryptography Standards
Rambus Blog
Aug. 31, 2023
|
|
|
|
How the SYCLOPS project democratizes AI acceleration
Codasip Blog
-
Tora Fridholm, Codasip
Aug. 31, 2023
|
|
|
|
Smart Manufacturing Makes Semiconductor Fabrication and Advanced Electronics Possible
Synopsys Blog
-
Vivek Jain, Synopsys
Aug. 31, 2023
|
|
|
|
Synopsys Acquires PikeTec Software Engineering, Enhancing Electronics Digital Twins Platform
Synopsys Blog
-
Synopsys Editorial Team
Aug. 29, 2023
|
|
|
|
FPGA Chiplets Get a Power and Cost Makeover Thanks to New Partnership
QuickLogic Blog
Aug. 28, 2023
|
|
|
|
NIST Published the Drafts of the Forthcoming PQC Standards
Xiphera Blog
-
Kimmo Jarvinen, Xiphera
Aug. 28, 2023
|
|
|
|
How Qualcomm Accelerated Coverage Closure with AI-Driven Verification
Synopsys Blog
-
Malay Ganai , Will Chen (Synopsys)
Aug. 25, 2023
|
|
|
|
Transformer Networks Optimized for ChatGPT Mobile
Ceva's Experts blog
-
Roni Sadeh, Ceva
Aug. 24, 2023
|
|
|
|
How Low Can You Go? An Inside Look at Weebit ReRAM Power Consumption
Weebit Nano Blog
-
Ilan Sever, Weebitnano
Aug. 24, 2023
|
|
|
|
What Are Digital Twins? A Primer on Virtual Models
Synopsys Blog
-
Ian Land , Jason Niatas , Marc Serughetti (Synopsys)
Aug. 24, 2023
|
|
|
|
How Google and Arm Collaborate on the Next Wave of Cloud Infrastructure
arm Blogs
-
Yan Fisher, Arm
Aug. 23, 2023
|
|
|
|
Arm China Remains A Wild Card
Mannerisms
-
David Manners
Aug. 23, 2023
|
|
|
|
Addressing Multi-Physics Effects for High-Performing Multi-Die Systems with Integrated Die/Package Co-Design Platform
Synopsys Blog
-
By Kenneth Larsen , Shekhar Kapoor (Synopsys)
Aug. 23, 2023
|
|
|
|
RISC-V customization gets a standing ovation - no fragmentation drama!
Codasip Blog
-
Mike Eftimakis, Codasip
Aug. 23, 2023
|
|
|
|
Arm's Cloud EDA Success: Two Paths to Greater Value
Cadence Blog
-
Vinod Khera, Cadence
Aug. 22, 2023
|
|
|
|
The Vitality of Change: Congratulations to Sassine Ghazi!
Synopsys Blog
-
Aart de Geus, Synopsys
Aug. 17, 2023
|
|
|
|
How to Augment SoC Development to Conquer Your Design Hurdles
Synopsys Blog
-
Praveen Durga , Rita Horner (Synopsys)
Aug. 17, 2023
|
|
|
|
Accelerating MIPI CSI-2 Adoption in Automotive
Rambus Blog
-
Joe Rodriguez, Rambus
Aug. 16, 2023
|
|
|
|
What are AI Chips? A Comprehensive Guide to AI Chip Design
Synopsys Blog
-
Rob van Blommestein, Synopsys
Aug. 11, 2023
|
|
|
|
SemiconIndia 2023: Alphawave Semi's Up-Close Glimpse of a Dazzling Event
Alphawave Semi Blog
Aug. 10, 2023
|
|
|
|
One Year Later, CHIPS Act Opportunity Is Exponential
Synopsys Blog
-
Deirdre Hanford, Synopsys
Aug. 10, 2023
|
|
|
|
AI will be increasingly important in EDA, reducing design costs and supporting engineers
Thalia Blog
-
Sowmyan Rajagopalan, Thalia
Aug. 09, 2023
|
|
|
|
Keeping Up with UCIe 1.1 Verification Using Synopsys VIP for UCIe
VIP Experts Blog
-
Synopsys
Aug. 09, 2023
|
|
|
|
Renesas RZ/G2M Awarded Arm SystemReady IR 1.1 Certification
Renesas Blog
-
Alan McLoughlin, Renesas
Aug. 07, 2023
|
|
|
|
Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications
Synopsys Blog
-
Ian Land , Jigesh Patel , Kenneth Larsen (Synopsys)
Aug. 07, 2023
|
|
|
|
Cadence and Arm Are Building the Future of Infrastructure
Cadence Blog
-
Tanushri Shah, Cadence
Aug. 03, 2023
|
|
|
|
Key Considerations for Addressing Multi-Die System Verification Challenges
Synopsys Blog
-
Arturo Salz , Dr. Johannes Stahl (Synopsys)
Aug. 02, 2023
|
|
|
|
What you should ask for instead of just PPA
Codasip Blog
-
Mike Eftimakis, Codasip
Aug. 01, 2023
|
|
|