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400G ultra low latency 56/112G FEC and SERDES IP sub 10ns latency
D&R Industry Expert Blogs
This section features posts from around the Web by authors with passion, integrity, authority, and community support in the IP / SoC industry.
Archives (May 2013)
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Moore's Law good for 14nm, and probably, 10nm: Dr. Wally Rhines
Pradeep's Point! - Pradeep Chakraborty May. 31, 2013 |
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Multicore: Is More Better?
Sonics, The Official Blog - Frank Ferro, Sonics May. 31, 2013 |
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Highly Efficient Video Coding with ARM
arm Blogs - Sukanya Chandramouli, General Manager , Ittiam Systems May. 30, 2013 |
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Where Have All the IP Vendors Gone? Part 3: Market Consolidation
Semico Blog - Rich Wawrzyniak May. 30, 2013 |
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Build or Buy? The Design Rules Remain the Same
Planet Analog - Vincent Biancomano May. 23, 2013 |
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Reuse ROI Proof Point, USB 3.0 SSIC across MIPI M-PHY with a slice of HAM
Breaking the Three Laws - Michael Posner May. 23, 2013 |
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Cortex-M0+ a year after: smaller, thriftier and smarter!
arm Blogs - Thomas Ensergueix, CPU Product Manager, ARM May. 22, 2013 |
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FD-SOI Can Deliver Leading-Edge European IC Process Technology
Mannerisms - David Manners May. 22, 2013 |
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Where Have All the IP Vendors Gone? Part 2: Market Maturation
Semico Blog - Rich Wawrzyniak May. 21, 2013 |
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The Honest Process Guy
Mannerisms - David Manners May. 20, 2013 |
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Enpirion's Value is Not Necessarily in IP
FPGA Gurus - Loring Wirbel May. 20, 2013 |
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Industry's First Demo of USB 3.0 SSIC and MIPI M-PHY Passing USB Compliance Tests
To USB or Not to USB: A USB IP Blog - Eric Huang, Synopsys May. 17, 2013 |
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How much of the chip does IP fill
EETimes Blog - Brian Bailey May. 17, 2013 |
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Where Have All the IP Vendors Gone? Part 1
Semico Blog - Rich Wawrzyniak May. 16, 2013 |
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Tag it! Your customer will love using IP compliant with TSMC9000 IP Tag specification
SemiWiki - Eric Esteve May. 16, 2013 |
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EDA in the Cloud: OneSpin says your design is secure
EETimes Blog - Brian Bailey May. 16, 2013 |
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What to Look for When Selecting Third-Party IP, Part 8
All Programmable Planet - Jacek Hanke, CEO, Digital Core Design May. 16, 2013 |
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Make versus buy: it's about risk management!
arm Blogs - Chin Beckmann, DSP Concepts May. 16, 2013 |
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Qualcomm JEDEC Mobile Keynote: Memory Bandwidth and Thermal Limits
SemiWiki - Paul McLellan May. 15, 2013 |
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Why we need 10G USB (Double-Speed USB 3.0)? - Revisited
To USB or Not to USB: A USB IP Blog - Eric Huang, Synopsys May. 15, 2013 |
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The REAL Cost for a Custom IC
Planet Analog - Scott Elder May. 15, 2013 |
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Intel: A Modest Suggestion
Gary Smith EDA - Gary Smith May. 14, 2013 |
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Design IP round #2: after road-test, time for the race
SemiWiki - Eric Esteve May. 10, 2013 |
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The Morphing of Intel's Monopoly
SemiWiki - Ed McKernan May. 09, 2013 |
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A new kind of IP company
EETimes Blog - Brian Bailey May. 09, 2013 |
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Is TSMC going to smash Packaging Houses?
AnySilicon May. 09, 2013 |
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IP Quality: Foundation of a Successful Ecosystem
SemiWiki - Eric Esteve May. 08, 2013 |
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On-chip networks: Future of SoC design
Pradeep's Point! - Pradeep Chakraborty May. 07, 2013 |
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Where Do FPGAs Come From?
All Programmable Planet - Brian Bailey May. 06, 2013 |
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Using OSVVM for DVB-S2 IP Core Validation
Open Source VHDL Verification Methodology (OS-VVM) Blog - Matthias Alles, Creonic May. 06, 2013 |
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Tabula, Achronix try driving unique design advantages into solidifed FPGA sector
FPGA Gurus - Loring Wirbel May. 03, 2013 |
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Why do we need 450mm wafers?
Pradeep's Point! - Pradeep Chakraborty May. 02, 2013 |
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Sonics and ARM craft agreement
EETimes Blog - Brian Bailey May. 02, 2013 |
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