D&R Industry Expert Blogs

This section features posts from around the Web by authors with passion, integrity, authority, and community support in the IP / SoC industry.

Archives (April 2023)

	Benchmarking Cadence Tools on Arm-based Servers in the Cloud Cadence Blog - Vinod Khera, Cadence Apr. 27, 2023
	Stormy Last Days At Arm Under Softbank Ownership Mannerisms - David Manners Apr. 27, 2023
	Environmental Noise Cancellation (ENC): Part 2 - Noise types and classic methods for Speech Enhancement Ceva's Experts blog - Tomer Badug, Ceva Apr. 27, 2023
	Cadence Demonstrates 112G-ELR SerDes IP on TSMC's 3nm Process Technology Cadence IP Blog - Vinod Khera, Cadence Apr. 27, 2023
	Automotive Battery Management System Using Bluetooth LE Ceva's Experts blog - Franz Dugand, Ceva Apr. 27, 2023
	Arm's prototype chips: What it means for the IC industry? EDN Blogs - Majeed Ahmad, EDN Apr. 27, 2023
	Synopsys and Powerchip Deliver New Advanced 3DIC Packaging Solution for AI Applications Synopsys Blog - Kenneth Larsen, Director of Product Management, Synopsys, and S.Z. Chang, VP and CTO, Powerchip Semiconductor Manufacturing Corporation Apr. 27, 2023
	Working with the NimbleAI project to push the boundaries of neuromorphic vision Codasip Blog - Tora Fridholm, Codasip Apr. 27, 2023
	Design IP Sales Grew 20.2% in 2022 after 19.4% in 2021 and 16.7% in 2020! SemiWiki - Eric Esteve, IPnest Apr. 24, 2023
	Powering the Next Wave of AI Inference with the Rambus GDDR6 PHY at 24 Gb/s Rambus Blog Apr. 20, 2023
	How Is AI Driving the Next Innovation Wave for Electronic Design? Synopsys Blog - Synopsys Editorial Team Apr. 20, 2023
	UFS 4.0 Explained: How the Latest Flash Storage Standard Propels Our 5G World Synopsys Blog - LJ Chen, Sr. Staff Product Manager, and Dana Neustadter, Senior Product Manager for Security Solutions, Synopsys Solutions Group Apr. 18, 2023
	4nm 112G-ELR SerDes PHY IP Breakfast Bytes - Paul McLellan Apr. 17, 2023
	PCIe 6.0 - All you need to know about PCI Express Gen6 Rambus Blog Apr. 17, 2023
	Protecting die-2-die interfaces... Sofics Blog - Bart Keppens, Sofics Apr. 14, 2023
	SNUG Silicon Valley 2023: Catalyzing the Future for Our Smart Everything World Synopsys Blog - Synopsys Editorial Staff Apr. 14, 2023
	Q&A with Sergio Silva, Synopsys Engineering Manager and MIPI Alliance Lifetime Achievement Award Winner Synopsys Blog - Synopsys Editorial Team Apr. 13, 2023
	The Future of Silicon Innovation in the Chiplet Era Alphawave Semi Blog Apr. 13, 2023
	Meeting Requirements for UCIe-Based Multi-Die Systems Success Synopsys Blog - Manuel Mota, Sr. Product Manager, Synopsys Solutions Group Apr. 12, 2023
	Cortex-M23: Now Enhanced for Safety-critical Automotive Applications arm Blogs - Laura Armitstead, Arm Apr. 11, 2023
	A Recap of MemCon 2023 with Mark Orthodoxou Rambus Blog Apr. 11, 2023
	How the MACsec Protocol Keeps Ethernet Networks Secure Synopsys Blog - Dana Neustadter, Senior Product Manager for Security Solutions, Synopsys Solutions Group Apr. 11, 2023
	Mitigating Side-Channel Attacks In Post Quantum Cryptography (PQC) With Secure-IC Solutions Secure-IC Blog Apr. 06, 2023
	How to Achieve Faster Signoff of Billion-Gate, Low-Power SoCs Synopsys Blog - Avinash Palepu, Sr. Staff Product Manager, Synopsys EDA Group Apr. 06, 2023
	4 Critical Characteristics for Automotive SoCs Synopsys Blog - Alessandra Nardi and Uyen Tran (Synopsys EDA Group) Apr. 05, 2023
	Raising RISC-V processor quality with formal verification Codasip Blog - Laurent Arditi, Codasip Apr. 04, 2023
	Arm looking to charge phone-makers Mannerisms - David Manners Apr. 03, 2023
	An Industry-Wide Look at the Move Toward Multi-Die Systems Synopsys Blog - Synopsys Editorial Staff Apr. 03, 2023
	The Five Must-Have Features of Modern Automotive SoC Architectures Cadence Blog - Ericles Sousa, Cadence Apr. 03, 2023