D&R Industry Articles | Most Popular | SoC News Alerts |

IP / SOC Products Articles

• High Speed, Low Power and Flexibility Drive DisplayPort's Increasing Popularity (Oct. 01, 2023)
  In this article we provide an introduction to DP, talk about the various factors that IC designers will want to consider when integrating the DP functionality into their SOC, and present at a high-level the solutions Silicon Creations provides in this area.
  
  
• I2C Interface Timing Specifications and Constraints (Sep. 11, 2023)
  This paper covers the timing specification of I2C (Inter-Integrated Circuit) bus protocol. We have described all the timing specifications and how they are achieved by constraining our design. This paper focuses on the timing constraints for fast mode plus (The data transfer rate is 1 Mbit/s).
  
  
• Handling the Challenges of Building HPC Systems We Need (Sep. 07, 2023)
  What is the secret of humanity’s success? What has given us the ability to build wonders, such as Stonehenge in England, the Pyramids of Egypt and the Great Wall of China? Humans are small, weak and slow compared with many other animals.
  
  
• Deploying Chiplets into Mass Markets (Sep. 04, 2023)
  Chiplets are being universally used in highest performance SOC, ASICs and ASSP devices by large integrated Semiconductor companies to reduce costs and increase yields. However, we have not seen the expected rapid deployment of standardized Chiplet building blocks that designers can simply buy and deploy cost effectively, much faster than developing a traditional SOC.In this paper we review key roadblocks to rapid adoption and provide five detailed suggestions to overcome barriers.
  
  
• Optimize SoC Design with a Network-on-Chip Strategy (Aug. 28, 2023)
  Utilizing physically aware interconnect IP from trusted third-party vendors can reduce design time and increase productivity.
  
  
• The Role of Interconnection in the Evolution of Advanced Packaging Technology (Aug. 21, 2023)
  Although advanced packaging is highly complex and involves a wide mixture of technologies, interconnection technology remains at its core. This article will cover how packaging technology has evolved and SK hynix’s recent efforts and accomplishments in helping to advance the field.
  
  
• Analog IP to protect SoC from side-channel attacks (Aug. 17, 2023)
  Across the globe, there are growing concerns about SCAs. Which type of applications are susceptible to SCAs? How can SCAs be spotted? This article focuses on voltage-centric side-channel attacks and outlines key functions of an analog IP for a voltage glitch detection solution.
  
  
• Neural Networks Can Help Keep Connected Vehicles Secure (Aug. 17, 2023)
  Connected vehicles are, according to the World Economic Forum, forecast to double by 2030, accounting for 96% of all shipped vehicles. With everything being connected and software-driven, vehicle tampering will become a real problem.
  
  
• Network-on-chip (NoC) interconnect topologies explained (Jul. 26, 2023)
  Today’s complex system-on-chip (SoC) designs can contain between tens to hundreds of IP blocks. Each IP block may have its own data width and clock frequency and employ one of the standard SoC interface protocols: OCP, APB, AHB, AXI, STBus, and DTL. Connecting all these IPs is a significant challenge.
  
  
• RISC-V Fast-Forwards, Breaks Ground for Auto Innovations (Jul. 18, 2023)
  The SiFive RISC-V Automotive CPU IP continues to advance to address and enable automotive applications like infotainment, connectivity and advanced driver-assistance systems. Yet without the right tools, embedded software developers at OEMS and suppliers cannot make full use of the energy efficiency, simplicity, security and flexibility that RISC-V offers.
  
  
• Evolution of VLSI Technology and its Applications (Jul. 11, 2023)
  Several factors have influenced the evolution of VLSI technology, including advances in semiconductor materials and manufacturing processes, the development of computer-aided design (CAD) tools, and the growing demand for high-performance electronic systems which includes VLSI design and verification processes. In this article, we will explore the evolution of VLSI technology and its application in the modern world.
  
  
• Push-Button NoCs for SoCs (Jul. 06, 2023)
  Today’s system-on-chip (SoC) devices may be composed of hundreds of functional blocks known as intellectual property (IP) blocks. Each of these IPs can contain hundreds of millions of transistors. Standard IPs like processors, memory, codecs and communication functions are usually acquired from third-party vendors.
  
  
• Unleashing EEPROM Potential by Going Embedded: Introducing eMemory's NeoEE (Jun. 19, 2023)
  EEPROM memory, which recently celebrated its 50th birthday, continues to defy obsolescence. Despite its age, EEPROM remains a mature, reliable, and affordable technology for many electronic systems. As IC designers embed EEPROM onto chips, it has become an integral part of chip design, offering essential benefits to applications such as MCU, PMIC, sensors, and RFID tags.
  
  
• Leveraging IBIS-AMI Models to Optimize PCIe 6.0 Designs (Jun. 15, 2023)
  This whitepaper discusses how the increase in interconnect communication speed introduces challenges such as signal integrity, crosstalk, and power consumption, each of which must be addressed to help ensure design feasibility and cost effectiveness before manufacturing.
  
  
• SoC design: When is a network-on-chip (NoC) not enough? (Jun. 07, 2023)
  A system-on-chip (SoC) design can easily feature a combination of multiple NoC topologies to achieve optimal results.
  
  
• Integrating VESA DSC and MIPI DSI in a System-on-Chip (SoC): Addressing Design Challenges and Leveraging Arasan IP Portfolio (Jun. 05, 2023)
  The integration of VESA Display Stream Compression (DSC) and MIPI Display Serial Interface (DSI) in a System-on-Chip (SoC) offers significant benefits for high-resolution display systems. This whitepaper discusses the challenges involved in integrating these technologies and provides insights into overcoming them.
  
  
• High-Speed PCIe and SSD Development and Challenges (May. 30, 2023)
  PCIe stands for Peripheral Component Interconnect Express (PCIe), which is a very important specification in computer buses. It is widely used in a large number of applications for data exchange communication within computer components, such as network cards, graphics cards, and nowadays NVMe solid state drives, which are mostly connected to the motherboard via PCIe. Since its introduction in 2003, PCIe has evolved into a fifth or even sixth-generation specification.
  
  
• Intrinsic ID PUFs: An Antidote to Post-Quantum Uncertainty (May. 22, 2023)
  You’ve probably been hearing a lot lately about the quantum-computing threat to cryptography. If so, you probably also have a lot of questions about what this “quantum threat” is and how it will impact your cryptographic solutions. Let’s take a look at some of the most common questions about quantum computing and its impact on cryptography
  
  
• Achieving Your Low Power Goals with Synopsys Ultra Low Leakage IO (May. 08, 2023)
  This whitepaper explains the need for ULL GPIOs, the optimization techniques used to reduce leakage, and the inherent tradeoffs to consider. Finally, it describes how Synopsys ULL GPIOs help designers reduce leakage while achieving the SoC power and performance targets for mobile and battery-driven devices used in AI and sensing applications.
  
  
• How to Avoid Fall in Expectations for Automated Driving (May. 04, 2023)
  By understanding the current reality of automated driving in the near term, companies and ecosystems can better predict its adoption.
  
  
• The Future of Safe and Secure Aerospace Systems (May. 02, 2023)
  Next-generation aircraft and spacecraft are generating big data from high-resolution sensors. They are interconnected with other vehicles and are able to securely access clouds. The need for safety and dependability is increasing, even as the aerospace regulatory framework for certification becomes stricter.
  
  
• Fmax Margin/Value Improvement for Memory Block During ECO Stage (Apr. 17, 2023)
  The intent of this article is to explain how to fix Fmax margin/value during ECO stage using buffer/inverter-pair removal and push-pull techniques. Fmax for memory block shall be the Tcc limited. But due to over fixing the hold violation for few instances path, they become memory-limited, or SMS limited. In this article we will be discussing how to fix this in the ECO stage.
  
  
• Safeguarding the Arm Ecosystem with PSA Certified PUF-based Crypto Coprocessor (Mar. 27, 2023)
  For the past five years, Arm has reaffirmed its commitment to safeguarding its architecture with their Security Manifesto. It outlines a clear “call to arms” for the semiconductor industry to address the rising threats facing computing today.
  
  
• Mastering Key Technologies to Realize the Dream - M31 IP Integration Services (Mar. 20, 2023)
  Throughout the development of the industry, the evolution of advanced semiconductor manufacturing processes has led to an increase in production costs, high-speed interface bandwidth, and the difficulty and risk in IP and SoC integration. That results in a significant increase in development costs for chip manufacturers, especially in the investment of manpower, and EDA tools are becoming more challenging.
  
  
• Create high-performance SoCs using network-on-chip IP (Mar. 13, 2023)
  A system-on-chip (SoC) containing a million transistors was considered a large device in the not-so-distant past. Today, SoCs commonly contain up to a billion transistors. Consider, for example, the recent case study with SiMa.ai and its new machine learning (ML) chip called MLSoC; it provides effortless machine learning at the embedded edge.
  
  
• How Efinix is Conquering the Hurdle of Hardware Acceleration for Devices at the Edge (Mar. 10, 2023)
  This article discusses precisely how the Efinix platform simplifies the entire design and development cycle, allowing users to take advantage of the flexible FPGA fabric for a scalable embedded processing solution.
  
  
• Securing Memory Will Take More Than Cryptography Alone (Mar. 02, 2023)
  Advances in computing, storage and memory pave the way for a variety of innovations, from advanced sensor-fusion to autonomous driving and machine learning (ML). But with new technology comes new threats, and as memory evolves, so does the opportunity for cybercrime.
  
  
• Functional Safety in Road Vehicles (Feb. 27, 2023)
  Complexity of modern cars is growing rapidly without a doubt. A lot has happened since Ford T and the times when car was just a “fully mechanical” experience. Last few decades prove that safety is crucial. There’s no wonder then, that the safety ecosystem based on proprietary certification is a must. But even the best engineer is not capable of taking care of every single design detail. Everyone makes mistakes.
  
  
• Maven Silicon's RISC-V Processor IP Verification Flow (Feb. 24, 2023)
  In this open era of computing, RISC-V community members are ambitious to create various kinds of RISC processors using RISC-V open ISA. However, the risk of using RISC-V ISA is higher because the proven processor verification flow is still proprietary to established processor fabless IP companies and IDMs as an unrevealed secret. So, how can we make the RISC-V verification flow open and empower the RISC-V community?
  
  
• Meet the Next-Generation Network-on-Chip From Arteris (Feb. 23, 2023)
  Today’s system-on-chip (SoC) designs continue to grow in capacity and complexity. The only way to continue developing components of this class is by increasing the sophistication of the design, implementation and verification tools while simultaneously increasing levels of automation. The launch of the latest generation of network-on-chip (NoC) IP, FlexNoC 5, from Arteris addresses all these issues.