USB-C 3.2 DP/TX PHY in TSMC (N3E)
Duet Package of Embedded Memories and Logic Libraries for UMC (40nm, 28nm)
Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N3EP
Low-power 32-bit RISC-V processor
EnSilica - Design and Supply contract award for a controller ASIC for automotive and industrial markets
Thalia adds analog and mixed-signal IP reuse to Siemens' Cre8Ventures Digital Twin Marketplace
ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
A new era for embedded memory
Electronic musical instruments design: what's inside counts
Casting a wide safety net through post processing Checking
Delivering a Better Support Experience for IP Customers
Cadence Commits to Join imec Automotive Chiplet Programme
Exploring the Fault Tolerance of LEON3FT SoCs on CertusPro-NX FPGAs
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