HDMI 2.1 eARC Rx PHY in GF (12nm)
NVM OTP in Tower (180nm, 110nm)
TSMC 5nm (N5) 1.2V/1.8V/2.5V GPIO Libraries, multiple metalstacks
1-112Gbps Integrated Laser Driver and Optical SerDes
Tenstorrent Expands Deployment of Arteris' Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
Siemens' Tessent In-System Test software enables advanced, deterministic testing throughout the silicon lifecycle
EnSilica plc - Audited Full Year Results for the Year Ended 31 May 2024
CANsec: Security for the Third Generation of the CAN Bus
Accelerating SoC Evolution With NoC Innovations Using NoC Tiling for AI and Machine Learning
A new era for embedded memory
Flash Forward: MRAM and RRAM Bring Embedded Memory and Applications into the Future
Hardware-Assisted Verification: Unlocking the Future of Chip and System Design
Ensuring Quality and Providing Exceptional Support for IP Cores at Chip Interfaces
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