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Headline Sign Up for SoC News Alert |
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eSilicon to be Acquired by Inphi and Synopsys |
Nov. 11, 2019 |
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Synopsys to Acquire Certain IP Assets from eSilicon |
Nov. 11, 2019 |
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eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects |
Sep. 23, 2019 |
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ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies |
Sep. 19, 2019 |
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AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable |
Sep. 13, 2019 |
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eSilicon to debut AI Accelerator software and a new chiplet model at Hot Chips 2019 |
Aug. 15, 2019 |
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eSilicon, Samtec and Wild River Technology Offer High-Performance Communications Webinar |
Jun. 20, 2019 |
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Google and eSilicon at DAC 2019: Doing EDA in the Cloud? Yes, It's Possible! |
May. 29, 2019 |
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eSilicon Technical Advisory Board Members Win Facebook Research Award |
May. 27, 2019 |
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eSilicon Announces Production Qualification of 5G Infrastructure ASIC |
May. 15, 2019 |
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eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip |
May. 09, 2019 |
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eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip |
May. 07, 2019 |
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eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC |
May. 01, 2019 |
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eSilicon Expands Technical Advisory Board |
Apr. 30, 2019 |
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eSilicon Signs Multi-Year Agreement with Google Cloud |
Apr. 29, 2019 |
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Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms |
Apr. 02, 2019 |
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DATE 2019: eSilicon to present two papers on advanced floor planning techniques with the Polytechnic University of Catalonia |
Mar. 20, 2019 |
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OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth |
Mar. 13, 2019 |
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Interoperability demo at OFC: eSilicon 56G SerDes and Precise-ITC 400G FEC |
Mar. 06, 2019 |
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OFC 2019: eSilicon to demonstrate two 7nm IP products, 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem |
Feb. 27, 2019 |
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eSilicon builds momentum as a strong tier one FinFET ASIC supplier |
Feb. 14, 2019 |
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ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly |
Feb. 12, 2019 |
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eSilicon and Wild River Technology Announce Advanced SerDes Test System |
Jan. 30, 2019 |
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eSilicon Announces Technical Advisory Board |
Jan. 29, 2019 |
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DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly |
Jan. 23, 2019 |
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eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing |
Oct. 25, 2018 |
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eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design |
Sep. 18, 2018 |
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eSilicon Announces Silicon Validation of 7nm 56G SerDes |
Sep. 13, 2018 |
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The Linley Group Microprocessor Report Details eSilicon 7nm IP |
Aug. 14, 2018 |
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eSilicon Licenses Industry-Leading SiFive E2 Core IP for Next-Generation SerDes IP |
Aug. 07, 2018 |
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7nm networking platform delivers unprecedented performance and configurability for data center ASICs |
Jun. 26, 2018 |
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AI Comes to ASICs in Data Centers |
Jun. 07, 2018 |
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eSilicon revolutionizes machine learning ASIC platform (MLAP) market |
Jun. 05, 2018 |
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eSilicon deep learning ASIC in production qualification |
May. 01, 2018 |
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ASICs Unlock Deep Learning Innovation: Live Seminar in Silicon Valley |
Feb. 13, 2018 |
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TIRIAS Research Publishes White Paper on ASIC Market |
Jan. 23, 2018 |
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eSilicon announces 7nm FinFET ASIC design win |
Jan. 09, 2018 |
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eSilicon tapes out deep learning ASIC |
Sep. 13, 2017 |
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eSilicon at TSMC OIP 2017 |
Sep. 06, 2017 |
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High-performance, high-bandwidth IP platform for Samsung 14LPP process technology |
Mar. 22, 2017 |
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Silicon-proven HBM Gen2 Hardened PHY from eSilicon |
Dec. 15, 2016 |
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eSilicon Takes TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper |
Nov. 29, 2016 |
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Philippe Morali, High Technology Veteran, Joins eSilicon as CFO |
Nov. 22, 2016 |
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New automated online multi-project wafer quote system delivers instant pricing |
Oct. 01, 2013 |
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eSilicon elevates Rob Cadman to vice president of sales, North America and EMEA |
Mar. 26, 2013 |
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Subramaniam Hariharan joins eSilicon executive team to head global manufacturing operations |
Mar. 21, 2013 |
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eSilicon Corporation and ARM Sign Multi-Year IP Agreement |
Nov. 01, 2012 |
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eSilicon Offers Specialty Memory Products on TSMC 28nm and 40nm Processes |
Oct. 30, 2012 |
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Duy-Loan Le Joins eSilicon Board |
Oct. 23, 2012 |
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eSilicon Korea Now Open for Business |
Sep. 20, 2012 |
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John Dickson, Former Agere CEO, Joins eSilicon Board |
Sep. 12, 2012 |
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AMD Appoints eSilicon's Harding to board |
Aug. 30, 2012 |
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ESilicon set to reap rewards of Asian gamble |
May. 18, 2012 |
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eSilicon Expands SerDes IP Licensing Agreement with Avago Technologies |
Feb. 07, 2012 |
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HiSilicon Licenses eSilicon's 40nm Silicon-Proven TCAMs for High-Performance Network Chips |
Dec. 13, 2011 |
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Ikanos Communications Selects eSilicon For Manufacturing Operations and Logistics |
Dec. 08, 2011 |
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eSilicon adds Wim Roelandts and Timothy Chen to its Board; Appoints Seth Neiman as Chairman |
Dec. 07, 2011 |
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eSilicon and MIPS Technologies Announce Tapeout of 28nm 1.5GHz Microprocessor Cluster for Embedded Platforms |
Oct. 05, 2011 |
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eSilicon and TSMC Support Long-Lifecycle Products |
Aug. 18, 2011 |
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eSilicon Adds China Region to its TSMC VCA Partnership |
May. 30, 2011 |
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GN ReSound Inks ASIC Engagement with eSilicon |
May. 03, 2011 |
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TranSwitch Selects eSilicon to Reduce Manufacturing Costs and Streamline Design-to-Manufacturing Process |
Apr. 12, 2011 |
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SMS Business Momentum Adds to eSilicon's Revenue Growth |
Mar. 10, 2011 |
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eSilicon names Lawrence Conrad as general manager of Semiconductor Manufacturing Services business unit |
Dec. 02, 2010 |
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eSilicon's eFlexCAM cores enable 725 million searches per second |
Oct. 28, 2010 |
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eSilicon Announces Operations Strategy Engagements |
Jun. 17, 2010 |
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eSilicon Expands In Asia Through Acquisition of Silicon Design Solutions |
May. 27, 2010 |
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eSilicon to acquire Silicon Design Solutions |
Apr. 08, 2010 |
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eSilicon Names Ajay Lalwani as Vice President, Strategic Sourcing |
Feb. 17, 2010 |
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eSilicon Takes Achronix 1.5 GHz FPGA Design to Production |
Dec. 17, 2009 |
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eSilicon Signs Multi-Year Agreement with Synopsys |
Dec. 16, 2009 |
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eSilicon CEO sees new ASIC landscape |
Feb. 09, 2009 |
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eSilicon Delivers 65nm Silicon and Package to Achronix |
Nov. 11, 2008 |
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eSilicon Achieves Significant Milestone by Booking Production Orders from More Than Fifty Customers |
May. 22, 2008 |
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ASIC specialist eSilicon expands strategy, seeks acquisitions |
May. 07, 2008 |
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eSilicon Licenses Avago Technologies' High Performance Embedded SerDes Cores |
Feb. 27, 2008 |
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eSilicon Acquires SwitchCore's Product Lines |
Jan. 14, 2008 |
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eSilicon Ramps 65Nm Design Engagements With Multiple Customers |
Nov. 27, 2007 |
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New eSilicon Peripheral Subsystem offers Design Flexibility for ARM Processor-Based Chips |
Jul. 03, 2007 |
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eSilicon Optimizes Arm Processor For TAK IMAGING |
Apr. 04, 2007 |
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eSilicon Enables Mistletoe Technologies Security System on a Chip |
Nov. 13, 2006 |
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eSilicon Introduces Comprehensive Production Services |
Oct. 23, 2006 |
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eSilicon Offers Complete 90nm DDR2 Memory Interface Solutions |
Sep. 05, 2006 |
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New eSilicon Direct Model Lowers Risks and Costs for Custom Chip Developers |
Jul. 10, 2006 |
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Inapac Technology and eSilicon Partner on SiP Program; eSilicon to Offer Inapac SIPFLOW Memory IP and Methodology to Enable SiP Applications |
Jun. 02, 2006 |
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eSilicon Appoints Jim Lindstrom Chief Financial Officer |
Dec. 15, 2005 |
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eSilicon Expands Global Operations |
Oct. 03, 2005 |
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eSilicon Expands Access To ARM Technology For Its Customers |
Jan. 31, 2005 |
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eSilicon Joins TSMC Design Center Alliance |
Mar. 08, 2004 |
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