|
Headline Sign Up for SoC News Alert |
Publication |
 | |
| | |
|
Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks |
Jul. 11, 2024 |
| | |
|
Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024 |
Jun. 17, 2024 |
| | |
|
Samsung Collaborates With Arm To Drive Research in Software for Next-Generation Communication Technologies |
May. 21, 2024 |
| | |
|
Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology |
Feb. 20, 2024 |
| | |
|
Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU |
Oct. 19, 2023 |
| | |
|
Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023 |
Jun. 28, 2023 |
| | |
|
Samsung Electronics and AMD Extend Strategic IP Licensing Agreement To Bring AMD Radeon™ Graphics to Future Mobile Platforms |
Apr. 06, 2023 |
| | |
|
Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller |
Feb. 23, 2023 |
| | |
|
Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022 |
Oct. 06, 2022 |
| | |
|
Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture |
Jun. 30, 2022 |
| | |
|
Samsung Readies Gate-All-Around Ramp |
Jan. 31, 2022 |
| | |
|
Samsung Selects Texas as Site for $17 Billion Fab |
Nov. 25, 2021 |
| | |
|
Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021 |
Nov. 18, 2021 |
| | |
|
Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications |
Nov. 11, 2021 |
| | |
|
Samsung to triple foundry capacity |
Oct. 28, 2021 |
| | |
|
Samsung Foundry Promises Gate All-Around in '22 |
Oct. 14, 2021 |
| | |
|
Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices |
Oct. 07, 2021 |
| | |
|
Samsung Introduces the Industry's First 5nm Processor Powering the Next Generation of Wearables |
Aug. 10, 2021 |
| | |
|
Samsung Successfully Completes 8nm RF Solution Development to Strengthen 5G Communications Chip Solutions |
Jun. 10, 2021 |
| | |
|
Samsung Provides One-Stop Foundry Design Environment with the Launch of "SAFE Cloud Design Platform" |
Jun. 18, 2020 |
| | |
|
Samsung Begins Mass Production of Industry's First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones |
Feb. 25, 2020 |
| | |
|
USC ISI The MOSIS Service and Samsung Foundry collaborate to spur microelectronics innovation in the US |
Oct. 22, 2019 |
| | |
|
Samsung wants to rally more fabless customers |
Oct. 21, 2019 |
| | |
|
Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich |
Oct. 10, 2019 |
| | |
|
Samsung Begins Mass Production of Industry's First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones |
Jul. 23, 2019 |
| | |
|
Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform |
May. 15, 2019 |
| | |
|
Samsung Foundry Begins Partnership with Silvaco to Launch their Semiconductor IP Assets |
May. 13, 2019 |
| | |
|
Samsung Successfully Completes 5nm EUV Development to Allow Greater Area Scaling and Ultra-low Power Benefits |
Apr. 16, 2019 |
| | |
|
Samsung Develops Industry's First 3rd-generation 10nm-Class DRAM for Premium Memory Applications |
Mar. 21, 2019 |
| | |
|
Samsung Electronics Starts Commercial Shipment of eMRAM Product Based on 28nm FD-SOI Process |
Mar. 07, 2019 |
| | |
|
Samsung Still Spending Heavily on Capex |
Nov. 05, 2018 |
| | |
|
Samsung Complements the Production of its Revolutionary 7nm EUV with Exceptional SAFE Ecosystem Solutions |
Oct. 18, 2018 |
| | |
|
Samsung Electronics Starts Production of EUV-based 7nm LPP Process |
Oct. 18, 2018 |
| | |
|
Samsung Foundry and Arm Expand Collaboration to Drive High-Performance Computing Solutions |
Jul. 24, 2018 |
| | |
|
Samsung developing new GPU |
Jul. 24, 2018 |
| | |
|
Samsung Plans 3nm Gate-All-Around FETs in 2021 |
May. 23, 2018 |
| | |
|
Samsung Set to Power the Future of High-Performance Computing and Connected Devices with Silicon Innovation |
May. 23, 2018 |
| | |
|
Samsung early with 7nm process, says report. |
Apr. 09, 2018 |
| | |
|
Samsung Strengthens its Foundry Customer Support with New SAFE Foundry Ecosystem Program |
Jan. 25, 2018 |
| | |
|
Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology |
Nov. 29, 2017 |
| | |
|
Samsung Completes Qualification of 8nm LPP Process |
Oct. 19, 2017 |
| | |
|
Samsung Strengthens Advanced Foundry Portfolio With New 11nm LPP and 7nm LPP With EUV Technology |
Sep. 12, 2017 |
| | |
|
Samsung to Invest $7 Billion in China Fab |
Aug. 30, 2017 |
| | |
|
Report: Samsung Plans to Triple Foundry Market Share |
Jul. 25, 2017 |
| | |
|
Samsung Set to Lead the Future of Foundry with Comprehensive Process Roadmap Down to 4nm |
May. 25, 2017 |
| | |
|
Samsung Completes Qualification of its 2nd Generation 10nm Process Technology |
Apr. 20, 2017 |
| | |
|
Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up |
Mar. 16, 2017 |
| | |
|
Samsung Starts Industry's First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology |
Oct. 17, 2016 |
| | |
|
Samsung Mass Produces Industry's First Application Processor for Wearable Devices Built on 14-Nanometer FinFET Technology |
Oct. 11, 2016 |
| | |
|
Samsung Details Foundry Roadmap |
Apr. 25, 2016 |
| | |
|
Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM |
Apr. 06, 2016 |
| | |
|
Samsung Announces Mass Production of 2nd Generation 14-Nanometer FinFET Logic Process Technology |
Jan. 14, 2016 |
| | |
|
Samsung Running 28nm FDSOI Chip Process |
Dec. 24, 2015 |
| | |
|
Samsung Ramps 10nm in 2016 |
May. 22, 2015 |
| | |
|
Samsung Breaks Ground on $14 Billion Fab |
May. 11, 2015 |
| | |
|
Samsung Announces Mass Production of Industry's First 14nm FinFET Mobile Application Processor |
Feb. 16, 2015 |
| | |
|
Samsung Shows 14nm Chip |
Oct. 02, 2014 |
| | |
|
Samsung Now Mass Producing Industry's First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM |
Sep. 22, 2014 |
| | |
|
Samsung's 14nm FinFET Process Technology Ecosystem Solidly in Place for Mobile Consumer and IT Infrastructure SoC Applications |
Jun. 02, 2014 |
| | |
|
Samsung Proliferates the Internet of Things with the Addition of RF Capabilities to its 28nm Process Technology for Foundry Customers |
Mar. 07, 2014 |
| | |
|
Samsung Primes Exynos 5 Octa for ARM big.LITTLE Technology with Heterogeneous Multi-Processing Capability |
Sep. 11, 2013 |
| | |
|
Samsung Announces Industry-First 45 nanometer Embedded Flash Logic Process Development |
May. 21, 2013 |
| | |
|
SAMSUNG Highlights Innovations in Mobile Experiences Driven by Components, in CES Keynote |
Jan. 09, 2013 |
| | |
|
Samsung Begins Mass Producing Industry's Highest Density (128GB) Embedded NAND Storage |
Sep. 20, 2012 |
| | |
|
Samsung begins building China fab |
Sep. 13, 2012 |
| | |
|
Samsung Samples Industry's First 16-Gigabyte Server Modules Based on DDR4 Memory Technology |
Jul. 06, 2012 |
| | |
|
Samsung Electronics Announces Acquisition of Nanoradio |
Jun. 05, 2012 |
| | |
|
Samsung Now Producing Highest Density Mobile LPDDR2 Memory Using 20nm-class Technology - an Industry First |
May. 21, 2012 |
| | |
|
Samsung positions its fab to take on TSMC |
Feb. 22, 2012 |
| | |
|
Samsung Mass Producing Highly Efficient Embedded Multi-Chip Memory for Entry-level Smartphones |
Jan. 20, 2012 |
| | |
|
Samsung Announces Industry First ARM Cortex-A15 Processor Samples for Tablet Computers |
Dec. 01, 2011 |
| | |
|
Samsung Develops Industry's First LPDDR3 DRAM, Using 30nm-class Process Technology |
Sep. 30, 2011 |
| | |
|
Samsung Announces High-performance 512GB SSDs with Ultra-fast SATA Revision 3.0 Interface |
Aug. 11, 2011 |
| | |
|
Samsung Electronics Acquires Grandis, Inc. |
Aug. 03, 2011 |
| | |
|
Samsung, in Collaboration with Physical IP and Design Enablement Partners, Confirms 20nm Design Infrastructure with Test Chip Tape-out |
Jul. 12, 2011 |
| | |
|
Samsung Qualifies 28nm LP Process Technology for High Performance Mobile Applications |
Jun. 07, 2011 |
| | |
|
Samsung Introduces High Performance, Low Power Dual CORTEX-A9 Application Processor for Mobile Devices |
Sep. 07, 2010 |
| | |
|
Samsung First to Begin Mass Producing 2-Gigabit Green DDR3 Using 30nm Class Technology |
Jul. 21, 2010 |
| | |
|
Samsung Electronics Qualifies Foundry Industry's First 32nm Low Power High-K Metal Gate Logic Process and Design Ecosystem |
Jun. 11, 2010 |
| | |
|
Samsung Producing Industry's First Higher-performing 20nm-class NAND Flash Memory |
Apr. 19, 2010 |
| | |
|
Samsung Expands Green Line-up with Industry's First Volume 40nm-class 4Gigabit DDR3 |
Feb. 24, 2010 |
| | |
|
Samsung Develops Most Advanced Green DDR3 DRAM, Using 30nm-class Technology |
Feb. 01, 2010 |
| | |
|
Samsung's New 5-Megapixel SoC Image Sensor Brings Digital Still Camera Capabilities to High-end Mobile Phones |
Sep. 22, 2009 |
| | |
|
Samsung First to Begin Mass Producing 2-Gigabit DDR3 Using 40nm Class Technology |
Jul. 22, 2009 |
| | |
|
Samsung using 45-nm process for ARM-11 based processor |
Jun. 29, 2009 |
| | |
|
SanDisk and Samsung Renew Patent Cross License and Flash Supply Agreements |
May. 27, 2009 |
| | |
|
Samsung's Single-Chip Mobile TV Channel Decoder RF SoC Supports Global TV Standards for Cell Phones |
Feb. 11, 2008 |
| | |
|
Samsung Electronics Licenses OneNAND to STMicroelectronics |
Oct. 23, 2006 |
| | |
|
Samsung Introduces the Next Generation of Nonvolatile Memory -- PRAM |
Sep. 11, 2006 |
| | |
|
Samsung Electronics Begins Volume Production of First 80-nanometer DDR2 Memory |
Mar. 13, 2006 |
| | |
|
Renesas Technology Releases R8A66597 Two-Port Hi-Speed (480 Mbps) USB Host Controller Suitable for Embedded Use |
Jan. 16, 2006 |
| | |
|
Samsung Electronics Develops World's First 512-Megabit DDR2 with 70nm Process Technology |
Oct. 13, 2005 |
| | |
|
Samsung Electronics Develops DVB-H Chipset with Zero-IF CMOS RF Tuner and SoC Channel Decoder |
Aug. 22, 2005 |
| | |
|
Samsung Accelerates Shift to High-Performance Computing by Producing More DDR2 than DDR1 Memory |
Aug. 11, 2005 |
| | |
|
Samsung Electronics First to Mass Produce 667 Mbps DDR2 Memory |
Jul. 12, 2005 |
| | |
|
Samsung Electronics Announces Advanced Graphics Memory for High-end Multimedia Applications |
Jun. 21, 2005 |
| | |
|
Samsung says expanding industrial storage market showing growing interest in Single-Level-Cell (SLC) Memory |
Apr. 11, 2005 |
| | |
|
Samsung Semiconductor offers SERDES Intellectual Property for high-speed ASIC designs |
Sep. 13, 2004 |
| | |
|
Samsung Electronics Develops Highly-integrated HDTV System- on-Chip |
Jul. 26, 2004 |
| | |
|
Samsung Electronics Joins IBM, Chartered, Infineon in Next-Generation Semiconductor Logic Process Development |
May. 05, 2004 |
English
