MIPI D-PHY CSI-2 TX (Transmitter) in TSMC 28HPC+
Tensilica Vision P1 DSP
UCIe/BoW BlueLynx™ Dual Mode PHY and subsystem IP for chiplet interconnect
PCI Express (PCIe) 3.1 Controller
Arm loses out in Qualcomm court case, wants a re-trial
Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Enhancements to Creonic's DVB-S2X IP Cores for Greater Flexibility and Performance
Quantum Readiness Considerations for Suppliers and Manufacturers
A Rad Hard ASIC Design Approach: Triple Modular Redundancy (TMR)
The Ideal Crypto Coprocessor with Root of Trust to Support Customer Complete Full Chip Evaluation: PUFcc gained SESIP and PSA Certified™ Level 3 RoT Component Certification
From Concept to Reality: Understanding the Cadence Analog IC Design Flow
Enhancing IoT System Performance with Smart Memory Partitioning
Enabling Massive AI Clusters with the Industry's First Ultra Ethernet and UALink IP Solutions
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