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Headline Sign Up for SoC News Alert |
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Cadence Unveils Arm-Based System Chiplet |
Nov. 20, 2024 |
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Cadence Reports Third Quarter 2024 Financial Results |
Oct. 28, 2024 |
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TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions |
Sep. 26, 2024 |
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Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family |
Sep. 18, 2024 |
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Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity |
Jun. 26, 2024 |
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Semiwise, sureCore, and Cadence Showcase Breakthrough in Cryogenic CMOS Circuit Development for Quantum Computing and Energy-Efficient Data Centers |
Jun. 24, 2024 |
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Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024 |
Jun. 19, 2024 |
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Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications |
Jun. 13, 2024 |
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Cadence Completes Acquisition of BETA CAE |
Jun. 03, 2024 |
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Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design |
Apr. 25, 2024 |
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Cadence Reports First Quarter 2024 Financial Results |
Apr. 23, 2024 |
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Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management |
Apr. 18, 2024 |
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Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances |
Apr. 18, 2024 |
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Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins |
Apr. 18, 2024 |
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Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem |
Mar. 13, 2024 |
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Cadence to Acquire BETA CAE, Expanding into Structural Analysis |
Mar. 06, 2024 |
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Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications |
Feb. 29, 2024 |
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Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes |
Feb. 20, 2024 |
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Cadence Reports Fourth Quarter and Fiscal Year 2023 Financial Results |
Feb. 13, 2024 |
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Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform |
Feb. 02, 2024 |
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Cadence Unveils Millennium Platform - Industry's First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency |
Feb. 02, 2024 |
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Phison Deploys Cadence Cerebrus AI-Driven Chip Optimization to Accelerate Product Development |
Jan. 23, 2024 |
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Cadence Unveils New Palladium Z2 Apps with Industry's First 4-State Emulation and Mixed-Signal Modeling to Accelerate SoC Verification |
Jan. 19, 2024 |
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GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform |
Jan. 10, 2024 |
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Cadence Acquires Invecas to Accelerate System Realization |
Jan. 08, 2024 |
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Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development |
Dec. 21, 2023 |
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Cadence Signoff Solutions Empower Samsung Foundry's Breakthrough Success on 5G Networking SoC Design |
Nov. 30, 2023 |
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Cadence EMX 3D Planar Solver Certified for Samsung Foundry 8nm LPP Process Technology |
Nov. 09, 2023 |
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Cadence Announces Voltus InsightAI, Industry's First Generative AI Technology that Automatically Identifies and Addresses EM-IR Violations |
Nov. 06, 2023 |
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Realtek Deploys Cadence Tempus Timing Solution to Deliver Working Silicon on N12 Design |
Nov. 02, 2023 |
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Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference |
Oct. 25, 2023 |
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Cadence Reports Third Quarter 2023 Financial Results |
Oct. 24, 2023 |
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Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards |
Oct. 20, 2023 |
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Cadence Collaborates with Broadcom to Implement AI-Driven Solutions with Impressive Quality of Results |
Oct. 19, 2023 |
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Cadence Joins Arm Total Design to Accelerate Development of Arm-Based Custom SoCs |
Oct. 18, 2023 |
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Imagination Optimizes PPA and Speeds the Delivery of Low-Power GPUs Using AI-Driven Cadence Cerebrus in the OnCloud Platform |
Oct. 13, 2023 |
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Cadence Completes Acquisition of Intrinsix |
Oct. 05, 2023 |
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Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification |
Sep. 28, 2023 |
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Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows |
Sep. 28, 2023 |
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Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF |
Sep. 26, 2023 |
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Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies |
Sep. 26, 2023 |
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Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP |
Sep. 21, 2023 |
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Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design |
Sep. 14, 2023 |
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Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows |
Aug. 31, 2023 |
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Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform |
Aug. 03, 2023 |
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Cadence to Acquire Rambus PHY IP Assets |
Jul. 21, 2023 |
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Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology |
Jul. 19, 2023 |
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Cadence Unveils Joules RTL Design Studio, Delivering Breakthrough Gains in RTL Productivity and Quality of Results |
Jul. 13, 2023 |
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Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process |
Jul. 12, 2023 |
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Cadence AI-Based Virtuoso Studio Certified for Samsung Foundry PDKs for Mature and Advanced Nodes |
Jun. 29, 2023 |
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Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform |
Jun. 29, 2023 |
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Cadence Delivers Certified, Innovative Backside Implementation Flow to Support Samsung Foundry SF2 Technology |
Jun. 29, 2023 |
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Cadence Digital and Custom/Analog Design Flows Certified for Samsung Foundry's SF2 and SF3 Process Technologies |
Jun. 29, 2023 |
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Samsung Foundry Certifies Cadence Virtuoso Studio Flow to Automate Analog IP Migration on Advanced Process Technologies |
Jun. 29, 2023 |
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DB GlobalChip Deploys Cadence's Spectre FX and AMS Designer, Accelerating IP Verification by 2X |
Jun. 26, 2023 |
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Cadence Announces $200 Million Accelerated Share Repurchase Agreement |
Jun. 15, 2023 |
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Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio |
Jun. 14, 2023 |
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Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions |
May. 30, 2023 |
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Cadence Reports First Quarter 2023 Financial Results |
May. 01, 2023 |
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Cadence Digital and Custom/Analog Design Flows Certified for TSMC's Latest N3E and N2 Process Technologies |
Apr. 27, 2023 |
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Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation |
Apr. 27, 2023 |
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Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies |
Apr. 27, 2023 |
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Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies |
Apr. 27, 2023 |
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Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard |
Apr. 27, 2023 |
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Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology |
Apr. 25, 2023 |
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Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process |
Apr. 25, 2023 |
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Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio |
Apr. 20, 2023 |
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Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps |
Apr. 18, 2023 |
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Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud |
Apr. 17, 2023 |
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Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis |
Apr. 14, 2023 |
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Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications |
Apr. 12, 2023 |
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Cadence Verisium AI-Driven Verification Platform Accelerates Debug Productivity for Renesas |
Mar. 10, 2023 |
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Cadence Delivers 13 New VIP and Expands System VIP Portfolio to Accelerate Automotive, Hyperscale Data Center and Mobile SoC Verification |
Feb. 20, 2023 |
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Cadence Reports Fourth Quarter and Fiscal Year 2022 Financial Results |
Feb. 16, 2023 |
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Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies |
Jan. 26, 2023 |
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GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions |
Jan. 23, 2023 |
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Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars |
Jan. 06, 2023 |
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Cadence Announces Industry Best-In-Class 8533Mbps LPDDR5X IP Solution for Next-Generation AI, Automotive and Mobile Applications |
Dec. 26, 2022 |
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Cadence Wins Six 2022 TSMC OIP Partner of the Year Awards |
Dec. 13, 2022 |
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Cadence and UMC Certified mmWave Reference Flow Delivers First-Pass Silicon Success |
Nov. 30, 2022 |
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Cadence Introduces Industry's Leading-Performance, Silicon-Proven 22Gbps GDDR6 IP at TSMC N5 |
Nov. 16, 2022 |
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Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings |
Oct. 27, 2022 |
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Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow |
Oct. 27, 2022 |
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Cadence's New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies |
Oct. 27, 2022 |
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Cadence Digital and Custom/Analog Design Flows Achieve Certification for TSMC's Latest N4P and N3E Processes |
Oct. 26, 2022 |
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Cadence Reports Third Quarter 2022 Financial Results |
Oct. 25, 2022 |
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Cadence Joins Intel Foundry Services USMAG Alliance to Accelerate Chip Design Development |
Oct. 25, 2022 |
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Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design |
Oct. 18, 2022 |
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New Cadence Certus Delivers Up to 10X Faster Concurrent Full-Chip Optimization and Signoff |
Oct. 12, 2022 |
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Cadence and Google Cloud Collaborate to Advance the Electronic System and Semiconductor Design Ecosystem |
Oct. 12, 2022 |
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Samsung Foundry Certifies Cadence Voltus-XFi Custom Power Integrity Solution for 5LPE Process Technology |
Oct. 04, 2022 |
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Cadence and Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology |
Oct. 04, 2022 |
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Cadence Revolutionizes Verification Productivity with the Verisium AI-Driven Verification Platform |
Sep. 14, 2022 |
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New Cadence Joint Enterprise Data and AI Platform Dramatically Accelerates AI-Driven Chip Design Development |
Sep. 14, 2022 |
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Cadence Completes Acquisition of OpenEye Scientific |
Sep. 01, 2022 |
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UMC and Cadence Collaborate on Analog/Mixed-Signal Flow for 22ULP/ULL Process Technologies |
Aug. 24, 2022 |
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Cadence and GlobalFoundries Collaborate on RF and mmWave Design Flow to Accelerate Mobile and 5G Innovation |
Aug. 19, 2022 |
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Cadence Library Characterization Solution Accelerates Delivery and Enhances Quality of Arm Memory Products |
Aug. 10, 2022 |
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Cadence Accelerates Hyperscale SoC Design with Industry's First Verification IP and System VIP for CXL 3.0 |
Aug. 05, 2022 |
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Samsung Foundry Achieves 2X Productivity on Large-Scale Analog and Mixed-Signal IP with the Spectre FX Simulator |
Jul. 26, 2022 |
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Cadence Expands into Molecular Simulation with Acquisition of OpenEye Scientific, a Pioneering Leader in Computational Molecular Design |
Jul. 25, 2022 |
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Cadence Completes Acquisition of Future Facilities |
Jul. 15, 2022 |
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Tower Semiconductor and Cadence Expand Collaboration to Accelerate Automotive IC Development |
Jul. 14, 2022 |
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Cadence to Acquire Future Facilities, A Pioneer in Data Center Digital Twins |
Jul. 11, 2022 |
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Cadence Introduces the Voltus-XFi Custom Power Integrity Solution, Delivering over 3X Productivity Gains |
Jul. 08, 2022 |
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Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets |
Jul. 04, 2022 |
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New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs |
Jun. 30, 2022 |
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Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions |
Jun. 29, 2022 |
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Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success |
Jun. 29, 2022 |
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Cadence Achieves PCIe 5.0 Specification Compliance for PHY and Controller IP in TSMC Advanced Technologies |
Jun. 21, 2022 |
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Cadence Announces $100 Million Accelerated Share Repurchase Agreement |
Jun. 21, 2022 |
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Cadence RFIC Solutions Support TSMC N6RF Design Reference Flow |
Jun. 17, 2022 |
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Cadence Design IP portfolio in TSMC's N5 Process Gains Broad Adoption Among Leading Semiconductor and System Companies |
Jun. 16, 2022 |
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Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes |
Jun. 13, 2022 |
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Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs |
Jun. 10, 2022 |
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Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e-Commerce Platform |
Jun. 09, 2022 |
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Cadence Revolutionizes System Design with Optimality Explorer for AI-Driven Optimization of Electronic Systems |
Jun. 09, 2022 |
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Cadence Accelerates Industrial, Automotive, Hyperscale Data Center, and Mobile SoC Verification with Expanded VIP and System VIP Portfolio |
Jun. 02, 2022 |
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Cadence Digital Full Flow Achieves Certification for GlobalFoundries 12LP/12LP+ Process Platforms |
May. 19, 2022 |
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Cadence Reports First Quarter 2022 Financial Results |
Apr. 26, 2022 |
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New Cadence High-Speed Ethernet Controller IP Family Enables Silicon-Proven Ethernet Subsystem Solutions up to 800Gbps |
Apr. 12, 2022 |
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Cadence Spectre FX FastSPICE Simulator Is Adopted by SK Hynix to Accelerate DRAM Design |
Apr. 11, 2022 |
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M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud |
Mar. 31, 2022 |
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Cadence Selected by Microsoft for RAMP Phase II Program |
Mar. 24, 2022 |
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Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services |
Mar. 24, 2022 |
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Cadence Recognized with TSMC OIP Ecosystem Forum Customers' Choice Award for 3D-IC Design |
Mar. 02, 2022 |
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Cadence Reports Fourth Quarter and Fiscal Year 2021 Financial Results |
Feb. 24, 2022 |
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Cadence and Dassault Systemes Partner to Transform Electronic Systems Development |
Feb. 22, 2022 |
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Qorvo Selects Cadence Design Systems for US Government SHIP-RF Program |
Feb. 16, 2022 |
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Cadence Joins Intel Foundry Services Ecosystem Alliance to Advance Chip Design Innovation |
Feb. 07, 2022 |
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Cadence Announces Full DRAM Verification Solution for Automotive, Data Center, and Mobile Applications |
Jan. 24, 2022 |
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Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip's Data Center Solutions SoC Development |
Jan. 20, 2022 |
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Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems |
Jan. 17, 2022 |
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GUC Optimizes Quality of Results and Accelerates Time to Tapeout Using the Cadence Digital Full Flow |
Dec. 08, 2021 |
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Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud |
Dec. 01, 2021 |
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Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library |
Nov. 17, 2021 |
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Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications |
Nov. 16, 2021 |
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Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices |
Oct. 29, 2021 |
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Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs |
Oct. 27, 2021 |
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Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process |
Oct. 21, 2021 |
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Cadence Digital and Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications |
Oct. 21, 2021 |
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Cadence Introduces Comprehensive Safety Solution for Faster Certification of Automotive and Industrial Designs |
Oct. 19, 2021 |
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Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform |
Oct. 07, 2021 |
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Cadence Accelerates Development of Mobile, Automotive and Hyperscale Systems with the Helium Virtual and Hybrid Studio |
Sep. 23, 2021 |
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Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform |
Sep. 13, 2021 |
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Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon |
Sep. 09, 2021 |
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Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation |
Aug. 19, 2021 |
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Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D |
Jul. 28, 2021 |
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Cadence Announces Anirudh Devgan to Become CEO in December 2021; Lip-Bu Tan to Transition to Role of Executive Chairman at That Time |
Jul. 27, 2021 |
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Cadence Extends Digital Design Leadership with Revolutionary ML-based Cerebrus, Delivering Best-in-class Productivity and Quality of Results |
Jul. 23, 2021 |
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