Bluetooth low energy v6.0 Baseband Controller, Protocol Software Stack and Profiles IP
Tensilica Fusion F1 DSP
Ultra High Performance AES-XTS/ECB Core
Custom Regulated High Capacity Charge Pump
Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
YorChip announces patent-pending Universal PHY for Open Chiplets
Accelerating RISC-V development with Tessent UltraSight-V
Automotive Ethernet Security Using MACsec
Optimizing Power Efficiency in SOC with PVT Sensor-Assisted DVFS Technology
UCIe for 1.6T Interconnects in Next-Gen I/O Chiplets for AI data centers
Progressing on Track: PCIe 7.0 Specification, Version 0.7 Now Available for Member Review
The Industry's First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
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