USB 3.0 femtoPHY in GF (28nm, 12nm)
ARINC664 End System IP Core
Process Detector (For DVFS and monitoring process variation), TSMC N6
Temperature Sensor with Digital Output High accuracy thermal sensing for reliability and optimisation)
Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Enhancements to Creonic's DVB-S2X IP Cores for Greater Flexibility and Performance
VeriSilicon unveils next-generation high-performance Vitality architecture GPU IP series
Quantum Readiness Considerations for Suppliers and Manufacturers
A Rad Hard ASIC Design Approach: Triple Modular Redundancy (TMR)
The Ideal Crypto Coprocessor with Root of Trust to Support Customer Complete Full Chip Evaluation: PUFcc gained SESIP and PSA Certified™ Level 3 RoT Component Certification
From Concept to Reality: Understanding the Cadence Analog IC Design Flow
Enhancing IoT System Performance with Smart Memory Partitioning
Enabling Massive AI Clusters with the Industry's First Ultra Ethernet and UALink IP Solutions
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